Detailed Description

Table 1-3:Voltage Rails (Cont’d)

U1 FPGA Bank

I/O Rail

Voltage

 

 

 

Bank 24

VCC2V5_FPGA

2.5V

 

 

 

Bank 25

VCC1V5_FPGA

1.5V

 

 

 

Bank 26

VCC1V5_FPGA

1.5V

 

 

 

Bank 32

VCC2V5_FPGA

2.5V

 

 

 

Bank 33

VCC2V5_FPGA

2.5V

 

 

 

Bank 34

VCC2V5_FPGA

2.5V

 

 

 

Bank 35

VCC1V5_FPGA

1.5V

 

 

 

Bank 36

VCC1V5_FPGA

1.5V

 

 

 

Notes:

1.The VITA 57.1 specification stipulates that the Bank 12 voltage named FMC_VIO_B_M2C is supplied by the FMC card plugged onto the relevant FMC connector (ML605 J64). FMC_VIO_B_M2C cannot exceed the base board (ML605) Vadj of the FMC connector. The ML605 FMC Vadj maximum is 2.5V.

References

See the Xilinx Virtex-6 FPGA documentation for more information at

http://www.xilinx.com/support/documentation/virtex-6.htm.

2. 512 MB DDR3 Memory SODIMM

A 512MB DDR3 SODIMM is provided as a flexible and efficient form-factor volatile memory for user applications. The ML605 SODIMM socket is wired to support a maximum SODIMM size of 2 GB.

The ML605 DDR3 64-bit wide interface has been tested to 800 MT/s.

The DDR3 interface is implemented in FPGA banks 25, 26, 35, and 36. DCI VRP/N resistor connections are only implemented banks 26 and 36. DCI functionality in banks 25 and 35 is achieved in the UCF by cascading DCI between adjacent banks as follows:

CONFIG DCI_CASCADE = "36 35";

CONFIG DCI_CASCADE = "26 25";

Table 1-4shows the connections and pin numbers for the DDR3 SODIMM.

Table 1-4:DDR3 SODIMM Connections

U1 FPGA Pin

Schematic Net Name

J1 SODIMM

 

 

 

 

Pin Number

Pin Name

 

 

 

 

L14

DDR3_A0

98

A0

 

 

 

 

A16

DDR3_A1

97

A1

 

 

 

 

B16

DDR3_A2

96

A2

 

 

 

 

E16

DDR3_A3

95

A3

 

 

 

 

D16

DDR3_A4

92

A4

 

 

 

 

J17

DDR3_A5

91

A5

 

 

 

 

ML605 Hardware User Guide

www.xilinx.com

15

UG534 (v1.2.1) January 21, 2010

 

 

Page 15
Image 15
Xilinx ML605 manual MB DDR3 Memory Sodimm, Detailed Description 3Voltage Rails Cont’d U1 Fpga Bank, VCC1V5FPGA