Lenovo 3797 manual

4.Depending on which microprocessor you are removing, remove the following components, if necessary:

v Microprocessor 1: PCI riser-card assembly 1 and DIMM air baffle (see “Removing a PCI riser-card assembly” on page 42 and “Removing the DIMM air baffle” on page 52)

vMicroprocessor 2: PCI riser-card assembly 2 and microprocessor 2 air baffle (see “Removing a PCI riser-card assembly” on page 42 and “Removing the microprocessor 2 air baffle” on page 50).

5.Open the heat-sink release lever to the fully open position.

1 Heat-sink release lever

2 Microprocessor

3 Retainer bracket

4 Lock tab

6.Lift the heat sink out of the server. If the heat sink sticks to the microprocessor, slightly twist the heat sink back and forth to break the seal. After removal, place the heat sink on its side on a clean, flat surface.

7.Release the microprocessor retention latch
1 by pressing down on the end, moving it to the side, and releasing it to the open (up) position.

8.Open the microprocessor bracket frame
4 by lifting up the tab on the top edge. Keep the bracket frame in the open position.

9.Carefully lift the microprocessor
2 straight up and out of the socket, and place it on a static-protective surface.

10.If you are instructed to return the microprocessor, follow all packaging instructions, and use any packaging materials for shipping that are supplied to you.

Chapter 5. Installing optional devices and replacing customer replaceable units 93