Chapter 4

Replacement Procedures

 

4.1

General

...................................................................................................................

4-1

4.2

Cooling Module

4-18

4.3

CPU

4-21

4.4

HDD

4-24

4.5

Selectable Bay Module

4-27

4.6

Touch Pad

4-31

4.7

RTC Battery

4-35

4.8

Wireless Lan Card

4-37

4.9

Keyboard

4-39

4.10

Speaker

.................................................................................................................

4-42

4.11

Bluetooth Card

4-44

4.12

Top Cover with the Display Assembly

4-46

4.13

I/O Board

4-50

4.14

System Board

4-51

4.15

Display Mask

4-53

4.16

Inverter Board

4-55

4.17

LCD Module

4-57

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TECRA S1 Maintenance Manual

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Toshiba TECRA S1 manual Chapter Replacement Procedures, Cpu Hdd