NXP Semiconductors LPC2919, LPC2917 user manual External static memory controller

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NXP Semiconductors

DRAFT

D

D

 

AFT

RAFT

RAFT AFT

 

 

 

DR

DR

DLPC2917/19

ARM9 microcontrollerRAFT withDRAFTCANDRAFTand LINDRAFT

T

DRAFT

T

 

DRA

 

DRA

 

DR

F

 

F

 

cannot be performed at full speed (i.e. with zero wait-states at the AHB bus)DRAFTif speculativeDRAFT

DRAF

Remark: If the programmed number of wait-states is more than three, flash-data reading

 

 

reading is active.

DRAFT DRAFT

 

 

 

 

8.2 External static memory controller

 

DRAFT

D

 

 

 

 

 

 

8.2.1Overview

The LPC2917/19 contains an external Static Memory Controller (SMC) which provides an interface for external (off-chip) memory devices.

Key features are:

DRA

Supports static memory-mapped devices including RAM, ROM, flash, burst ROM and external I/O devices

Asynchronous page-mode read operation in non-clocked memory subsystems

Asynchronous burst-mode read access to burst-mode ROM devices

Independent configuration for up to eight banks, each up to 16 MB

Programmable bus-turnaround (idle) cycles (one to 16)

Programmable read and write wait states (up to 32), for static RAM devices

Programmable initial and subsequent burst-read wait state for burst-ROM devices

Programmable write protection

Programmable burst-mode operation

Programmable external data width: 8-bit, 16-bit or 32-bit

Programmable read-byte lane enable control

8.2.2Description

The SMC simultaneously supports up to eight independently configurable memory banks. Each memory bank can be 8, 16 or 32 bits wide and is capable of supporting SRAM, ROM, burst-ROM memory or external I/O devices.

A separate chip-select output is available for each bank. The chip-select lines are configurable to be active HIGH or LOW. Memory-bank selection is controlled by memory addressing. Table 10 shows how the 32-bit system address is mapped to the external bus memory base addresses, chip selects and bank internal addresses.

Table 10. External memory-bank address bit description

 

32 bit

Symbol

Description

 

System

 

 

 

Address Bit

 

 

 

field

 

 

 

31 to 29

BA[2:0]

external static-memory base address (three most significant bits);

 

 

 

the base address can be found in the memory map; see Ref. 1. This

 

 

 

field contains ’010’ when addressing an external memory bank.

 

 

 

 

 

28 to 26

CS[2:0]

chip-select address space for eight memory banks; see [1]

 

25 and 24

-

always ’00’; other values are ’mirrors’ of the 16 MByte bank address

 

 

 

 

 

23 to 0

A[23:0]

16-MByte memory banks address space

 

 

 

 

LPC2917_19_1

 

© NXP B.V. 2007. All rights reserved.

Preliminary data sheet

Rev. 1.01 — 15 November 2007

18 of 68

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Contents About this document IntroductionGeneral description Intended audienceNXP Semiconductors ARM968E-S processorOn-chip flash memory system Features On-chip static RAMGeneral Ordering information Ordering informationOrdering options Part optionsBlock diagram LPC2917/19 block diagramPin description Pinning informationPinning General descriptionSymbol Pin Description Function 0 default LQFP144 pin assignment …TIMER1 MAT0 EXTINT0 TIMER2 MAT2 PWM TRAP1TIMER2 MAT3 PWM TRAP0 TIMER1 MAT1 EXTINT1Symbol Pin DescriptionLQFP144 pin Reset strategy Reset, debug, test and power descriptionReset and power-up behavior Reset pinClocking strategy Ieee 1149.1 interface pins Jtag boundary-scan testPower supply pins description Clock architectureLPC2917/19 block diagram, overview of clock areas LPC2917/19Base clock Branch clock name Parts of the device clocked by Base clock and branch clock relationshipBase clock and branch clock overview This branch clockOverview Block descriptionFlash memory controller Base clockDRA DescriptionFlash memory controller pin description Flash memory controller clock descriptionFlash layout Flash bridge wait-states Flash sector overview …32 bit Symbol Description System Address Bit Field External static memory controllerExternal memory-bank address bit description External static-memory controller pin description External memory timing diagramsExternal memory controller pins External static-memory controller clock descriptionReading from external memory Writing to external memoryReading/writing external memory General subsystem clock description Chip and feature identificationGeneral subsystem System Control Unit SCUPeripheral subsystem clock description Symbol Direction Bit position Description Default PolarityPeripheral subsystem Event-router pin connectionsTimer Watchdog timer clock descriptionPin description 3.2 Description 3.3 Pin descriptionUart pins Timer clock descriptionTimer pins UARTsSerial peripheral interface Uart clock descriptionFunctional description SPI pin description SPI pinsModes of operation SPI clock description6.1 Overview Gpio pinsGeneral-purpose I/O Gpio pin descriptionLIN Can pinsCan gateway Global acceptance filterLIN pin description LIN controller pinsModulation and sampling control subsystem LIN0/1 TxdlSynchronization and trigger features of the Mscss Modulation and sampling control subsystem block diagramStart ADC conditions is valid Mscss pin description Mscss clock descriptionDraft Analog-to-digital converterADC block diagram Analog to digital converter pinsADC pin description 6 PWM ADC clock descriptionPWM block diagram Synchronizing the PWM countersPWM pins Timers in the MscssMaster and slave mode PWM pin descriptionMscss timer 1 pin Power, clock and reset control subsystemMscss timer-clock description Pause pin for Mscss timerPcrss block diagram PCR subsystem clock descriptionClock Generation Unit CGU CGU base clocks Number Name Frequency Description MHzBlock diagram of the CGU Structure of the clock generation scheme PLL functional description PLL block diagram CGU pinsCGU pin description Reset Generation Unit RGU Reset output configurationPower Management Unit PMU RGU pinsRGU pin description DRA Vectored interrupt controller PMU pin descriptionLimiting values VIC pin descriptionVIC clock description Thermal characteristics Symbol Parameter Conditions Min Typ Max Static characteristicsStatic characteristics Input pins and I/O pins configured as inputINL Analog-to-digital converter supplyVDDA5V FSR LSBDynamic characteristics Dynamic characteristicsPower-up reset Symbol Parameter Conditions Min Typ Max UnitUnitDRAFT Jitter Specification Can TXD pin Cycle-to-cycle jitter Peak-to-peak valuePackage outline Package outline SOT486-1 LQFP144Through-hole mount packages SolderingIntroduction Surface mount packagesWave soldering Volume mm3 350 235 220 Lead-free process from J-STD-020CTemperature profiles for large and small components SnPb eutectic process from J-STD-020C Package thickness mmCPGA, Hcpga Package related soldering informationMounting Package1 Soldering method Wave Reflow2 Dipping DBS, DIP, HDIP, RDBS, SDIP, SILMounting Abbreviations Abbreviations listAbbreviation Description References Document ID Release date Data sheet status Revision historyRevision history Legal information Contact informationContents Contact information Contents SolderingPackage outline