NXP Semiconductors LPC2919, LPC2917 user manual Package outline SOT486-1 LQFP144

Page 58

NXP Semiconductors

DRAFT

D

D

 

AFT

RAFT

RAFT AFT

 

 

 

DR

DR

DLPC2917/19

ARM9 microcontrollerRAFT withDRAFTCANDRAFTand LINDRAFT

13. Package outline

T DRAFT

T

DRA

DRA DR

F

F

DRAFT DRAFT DRAF

LQFP144: plastic low profile quad flat package; 144 leads; body 20 x 20 x 1.4 mm

DRAFT DRAFT

SOT486-1

D

DRAFT

 

DRA

y

c

X

A

108

109

144

1

pin 1 index

 

 

e

w M

Z D

bp

 

D

HD

73

72

Z E

e

E HE

A A2

A1

w M

b p

37 36

v M A

B

v M B

0

5

10 mm

scale

(A3)

θ

L p

L

detail X

DIMENSIONS (mm are the original dimensions)

UNIT

A

A

1

A

2

A

3

b

p

c

D(1)

E(1)

e

H

H

E

L

L

p

v

w

y

Z (1)

Z (1)

θ

 

max.

 

 

 

 

 

 

 

 

D

 

 

 

 

 

 

D

E

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

mm

1.6

0.15

1.45

0.25

0.27

0.20

20.1

20.1

0.5

22.15

22.15

1

0.75

0.2

0.08

0.08

1.4

1.4

7o

0.05

1.35

0.17

0.09

19.9

19.9

21.85

21.85

0.45

1.1

1.1

0o

 

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

OUTLINE

 

REFERENCES

 

EUROPEAN

ISSUE DATE

VERSION

IEC

JEDEC

JEITA

 

 

PROJECTION

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

SOT486-1

136E23

MS-026

 

 

 

 

 

 

 

 

 

 

 

 

00-03-14

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

03-02-20

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Fig 15. Package outline SOT486-1 (LQFP144)

LPC2917_19_1

© NXP B.V. 2007. All rights reserved.

Preliminary data sheet

Rev. 1.01 — 15 November 2007

58 of 68

Image 58
Contents About this document IntroductionGeneral description Intended audienceARM968E-S processor NXP SemiconductorsOn-chip flash memory system On-chip static RAM FeaturesGeneral Ordering information Ordering informationOrdering options Part optionsBlock diagram LPC2917/19 block diagramPin description Pinning informationPinning General descriptionSymbol Pin Description Function 0 default LQFP144 pin assignment …TIMER1 MAT0 EXTINT0 TIMER2 MAT2 PWM TRAP1TIMER2 MAT3 PWM TRAP0 TIMER1 MAT1 EXTINT1Pin Description SymbolLQFP144 pin Reset strategy Reset, debug, test and power descriptionReset and power-up behavior Reset pinClocking strategy Ieee 1149.1 interface pins Jtag boundary-scan testPower supply pins description Clock architectureLPC2917/19 block diagram, overview of clock areas LPC2917/19Base clock Branch clock name Parts of the device clocked by Base clock and branch clock relationshipBase clock and branch clock overview This branch clockOverview Block descriptionFlash memory controller Base clockDRA DescriptionFlash memory controller clock description Flash memory controller pin descriptionFlash layout Flash bridge wait-states Flash sector overview …External static memory controller 32 bit Symbol Description System Address Bit FieldExternal memory-bank address bit description External static-memory controller pin description External memory timing diagramsExternal memory controller pins External static-memory controller clock descriptionReading from external memory Writing to external memoryReading/writing external memory General subsystem clock description Chip and feature identificationGeneral subsystem System Control Unit SCUPeripheral subsystem clock description Symbol Direction Bit position Description Default PolarityPeripheral subsystem Event-router pin connectionsWatchdog timer clock description TimerPin description 3.2 Description 3.3 Pin descriptionUart pins Timer clock descriptionTimer pins UARTsUart clock description Serial peripheral interfaceFunctional description SPI pin description SPI pinsModes of operation SPI clock description6.1 Overview Gpio pinsGeneral-purpose I/O Gpio pin descriptionLIN Can pinsCan gateway Global acceptance filterLIN pin description LIN controller pinsModulation and sampling control subsystem LIN0/1 TxdlSynchronization and trigger features of the Mscss Modulation and sampling control subsystem block diagramStart ADC conditions is valid Mscss pin description Mscss clock descriptionDraft Analog-to-digital converterAnalog to digital converter pins ADC block diagramADC pin description 6 PWM ADC clock descriptionPWM block diagram Synchronizing the PWM countersPWM pins Timers in the MscssMaster and slave mode PWM pin descriptionMscss timer 1 pin Power, clock and reset control subsystemMscss timer-clock description Pause pin for Mscss timerPCR subsystem clock description Pcrss block diagramClock Generation Unit CGU CGU base clocks Number Name Frequency Description MHzBlock diagram of the CGU Structure of the clock generation scheme PLL functional description CGU pins PLL block diagramCGU pin description Reset Generation Unit RGU Reset output configurationRGU pins Power Management Unit PMURGU pin description DRA Vectored interrupt controller PMU pin descriptionVIC pin description Limiting valuesVIC clock description Thermal characteristics Symbol Parameter Conditions Min Typ Max Static characteristicsStatic characteristics Input pins and I/O pins configured as inputINL Analog-to-digital converter supplyVDDA5V FSR LSBDynamic characteristics Dynamic characteristicsPower-up reset Symbol Parameter Conditions Min Typ Max UnitUnitDRAFT Jitter Specification Can TXD pin Cycle-to-cycle jitter Peak-to-peak valuePackage outline Package outline SOT486-1 LQFP144Through-hole mount packages SolderingIntroduction Surface mount packagesWave soldering Volume mm3 350 235 220 Lead-free process from J-STD-020CTemperature profiles for large and small components SnPb eutectic process from J-STD-020C Package thickness mmCPGA, Hcpga Package related soldering informationMounting Package1 Soldering method Wave Reflow2 Dipping DBS, DIP, HDIP, RDBS, SDIP, SILMounting Abbreviations list AbbreviationsAbbreviation Description References Revision history Document ID Release date Data sheet statusRevision history Legal information Contact informationContents Soldering Contact information ContentsPackage outline