NXP Semiconductors LPC2917, LPC2919 Package related soldering information, CPGA, Hcpga, PMFP4

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NXP Semiconductors

DRAFT

D

D

 

AFT

RAFT

RAFT AFT

 

 

 

DR

DR

DLPC2917/19

ARM9 microcontrollerRAFT withDRAFTCANDRAFTand LINDRAFT

 

T

DRAFT

T

 

 

DRA

 

DRA

 

DR

developed.

F

 

F

 

DRAFT DRAFT

DRAF

To overcome these problems the double-wave soldering method was specifically

 

 

 

 

 

DRAFT DRAFT

If wave soldering is used the following conditions must be observed for optimal results:

 

 

 

 

 

DRAFT

D

 

 

 

 

• Use a double-wave soldering method comprising a turbulent wave with high upward

 

 

pressure followed by a smooth laminar wave.

 

 

 

 

DRA

• For packages with leads on two sides and a pitch (e):

 

 

 

 

 

 

 

 

 

– larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board;

– smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board.

The footprint must incorporate solder thieves at the downstream end.

•For packages with leads on four sides, the footprint must be placed at a 45° angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners.

During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured.

Typical dwell time of the leads in the wave ranges from 3 seconds to 4 seconds at 250 °C or 265 °C, depending on solder material applied, SnPb or Pb-free respectively.

A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.

14.3.3Manual soldering

Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C.

When using a dedicated tool, all other leads can be soldered in one operation within 2 seconds to 5 seconds between 270 °C and 320 °C.

14.4Package related soldering information

Table 34. Suitability of IC packages for wave, reflow and dipping soldering methods

Mounting

Package[1]

Soldering method

Wave

Reflow[2]

Dipping

Through-hole mount

CPGA, HCPGA

suitable

−

−

 

 

 

 

 

 

DBS, DIP, HDIP, RDBS, SDIP, SIL

suitable[3]

−

suitable

Through-hole-surface

PMFP[4]

not suitable

not suitable

−

mount

 

 

 

 

LPC2917_19_1

© NXP B.V. 2007. All rights reserved.

Preliminary data sheet

Rev. 1.01 — 15 November 2007

61 of 68

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Contents General description IntroductionAbout this document Intended audienceARM968E-S processor NXP SemiconductorsOn-chip flash memory system On-chip static RAM FeaturesGeneral Ordering options Ordering informationOrdering information Part optionsLPC2917/19 block diagram Block diagramPinning Pinning informationPin description General descriptionLQFP144 pin assignment … Symbol Pin Description Function 0 defaultTIMER2 MAT3 PWM TRAP0 TIMER2 MAT2 PWM TRAP1TIMER1 MAT0 EXTINT0 TIMER1 MAT1 EXTINT1Pin Description SymbolLQFP144 pin Reset and power-up behavior Reset, debug, test and power descriptionReset strategy Reset pinPower supply pins description Ieee 1149.1 interface pins Jtag boundary-scan testClocking strategy Clock architectureLPC2917/19 LPC2917/19 block diagram, overview of clock areasBase clock and branch clock overview Base clock and branch clock relationshipBase clock Branch clock name Parts of the device clocked by This branch clockFlash memory controller Block descriptionOverview Base clockDescription DRAFlash memory controller clock description Flash memory controller pin descriptionFlash layout Flash sector overview … Flash bridge wait-statesExternal static memory controller 32 bit Symbol Description System Address Bit FieldExternal memory-bank address bit description External memory controller pins External memory timing diagramsExternal static-memory controller pin description External static-memory controller clock descriptionWriting to external memory Reading from external memoryReading/writing external memory General subsystem Chip and feature identificationGeneral subsystem clock description System Control Unit SCUPeripheral subsystem Symbol Direction Bit position Description Default PolarityPeripheral subsystem clock description Event-router pin connectionsWatchdog timer clock description TimerPin description 3.3 Pin description 3.2 DescriptionTimer pins Timer clock descriptionUart pins UARTsUart clock description Serial peripheral interfaceFunctional description Modes of operation SPI pinsSPI pin description SPI clock descriptionGeneral-purpose I/O Gpio pins6.1 Overview Gpio pin descriptionCan gateway Can pinsLIN Global acceptance filterModulation and sampling control subsystem LIN controller pinsLIN pin description LIN0/1 TxdlModulation and sampling control subsystem block diagram Synchronization and trigger features of the MscssStart ADC conditions is valid Mscss clock description Mscss pin descriptionAnalog-to-digital converter DraftAnalog to digital converter pins ADC block diagramADC pin description ADC clock description 6 PWMSynchronizing the PWM counters PWM block diagramMaster and slave mode Timers in the MscssPWM pins PWM pin descriptionMscss timer-clock description Power, clock and reset control subsystemMscss timer 1 pin Pause pin for Mscss timerPCR subsystem clock description Pcrss block diagramClock Generation Unit CGU Number Name Frequency Description MHz CGU base clocksBlock diagram of the CGU Structure of the clock generation scheme PLL functional description CGU pins PLL block diagramCGU pin description Reset output configuration Reset Generation Unit RGURGU pins Power Management Unit PMURGU pin description DRA PMU pin description Vectored interrupt controllerVIC pin description Limiting valuesVIC clock description Thermal characteristics Static characteristics Static characteristicsSymbol Parameter Conditions Min Typ Max Input pins and I/O pins configured as inputVDDA5V FSR Analog-to-digital converter supplyINL LSBPower-up reset Dynamic characteristicsDynamic characteristics Symbol Parameter Conditions Min Typ Max UnitUnitDRAFT Can TXD pin Cycle-to-cycle jitter Peak-to-peak value Jitter SpecificationPackage outline SOT486-1 LQFP144 Package outlineIntroduction SolderingThrough-hole mount packages Surface mount packagesTemperature profiles for large and small components Volume mm3 350 235 220 Lead-free process from J-STD-020CWave soldering SnPb eutectic process from J-STD-020C Package thickness mmMounting Package1 Soldering method Wave Reflow2 Dipping Package related soldering informationCPGA, Hcpga DBS, DIP, HDIP, RDBS, SDIP, SILMounting Abbreviations list AbbreviationsAbbreviation Description References Revision history Document ID Release date Data sheet statusRevision history Contact information Legal informationContents Soldering Contact information ContentsPackage outline
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