NXP Semiconductors LPC2917, LPC2919 Soldering, Introduction, Through-hole mount packages

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NXP Semiconductors

DRAFT

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AFT

RAFT

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DLPC2917/19

ARM9 microcontrollerRAFT withDRAFTCANDRAFTand LINDRAFT

14. Soldering

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14.1 Introduction

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soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitchDRAFT

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There is no soldering method that is ideal for all surface mount IC packages. Wave

 

 

SMDs. In these situations reflow soldering is recommended.

 

DRA

 

 

 

14.2 Through-hole mount packages

14.2.1Soldering by dipping or by solder wave

Typical dwell time of the leads in the wave ranges from 3 seconds to 4 seconds at 250 °C or 265 °C, depending on solder material applied, SnPb or Pb-free respectively.

The total contact time of successive solder waves must not exceed 5 seconds.

The device may be mounted up to the seating plane, but the temperature of the plastic

body must not exceed the specified maximum storage temperature (Tstg(max)). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit.

14.2.2Manual soldering

Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 °C and 400 °C, contact may be up to 5 seconds.

14.3 Surface mount packages

14.3.1Reflow soldering

Key characteristics in reflow soldering are:

•Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see Figure 16) than a PbSn process, thus reducing the process window

•Solder paste printing issues including smearing, release, and adjusting the process window for a mix of large and small components on one board

•Reflow temperature profile; this profile includes preheat, reflow (in which the board is heated to the peak temperature) and cooling down. It is imperative that the peak temperature is high enough for the solder to make reliable solder joints (a solder paste characteristic). In addition, the peak temperature must be low enough that the packages and/or boards are not damaged. The peak temperature of the package depends on package thickness and volume and is classified in accordance with Table 32 and 33

LPC2917_19_1

© NXP B.V. 2007. All rights reserved.

Preliminary data sheet

Rev. 1.01 — 15 November 2007

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Contents Intended audience IntroductionGeneral description About this documentOn-chip flash memory system NXP SemiconductorsARM968E-S processor General FeaturesOn-chip static RAM Part options Ordering informationOrdering options Ordering informationLPC2917/19 block diagram Block diagramGeneral description Pinning informationPinning Pin descriptionLQFP144 pin assignment … Symbol Pin Description Function 0 defaultTIMER1 MAT1 EXTINT1 TIMER2 MAT2 PWM TRAP1TIMER2 MAT3 PWM TRAP0 TIMER1 MAT0 EXTINT0LQFP144 pin SymbolPin Description Reset pin Reset, debug, test and power descriptionReset and power-up behavior Reset strategyClock architecture Ieee 1149.1 interface pins Jtag boundary-scan testPower supply pins description Clocking strategyLPC2917/19 LPC2917/19 block diagram, overview of clock areasThis branch clock Base clock and branch clock relationshipBase clock and branch clock overview Base clock Branch clock name Parts of the device clocked byBase clock Block descriptionFlash memory controller OverviewDescription DRAFlash layout Flash memory controller pin descriptionFlash memory controller clock description Flash sector overview … Flash bridge wait-statesExternal memory-bank address bit description 32 bit Symbol Description System Address Bit FieldExternal static memory controller External static-memory controller clock description External memory timing diagramsExternal memory controller pins External static-memory controller pin descriptionWriting to external memory Reading from external memoryReading/writing external memory System Control Unit SCU Chip and feature identificationGeneral subsystem General subsystem clock descriptionEvent-router pin connections Symbol Direction Bit position Description Default PolarityPeripheral subsystem Peripheral subsystem clock descriptionPin description TimerWatchdog timer clock description 3.3 Pin description 3.2 DescriptionUARTs Timer clock descriptionTimer pins Uart pinsFunctional description Serial peripheral interfaceUart clock description SPI clock description SPI pinsModes of operation SPI pin descriptionGpio pin description Gpio pinsGeneral-purpose I/O 6.1 OverviewGlobal acceptance filter Can pinsCan gateway LINLIN0/1 Txdl LIN controller pinsModulation and sampling control subsystem LIN pin descriptionModulation and sampling control subsystem block diagram Synchronization and trigger features of the MscssStart ADC conditions is valid Mscss clock description Mscss pin descriptionAnalog-to-digital converter DraftADC pin description ADC block diagramAnalog to digital converter pins ADC clock description 6 PWMSynchronizing the PWM counters PWM block diagramPWM pin description Timers in the MscssMaster and slave mode PWM pinsPause pin for Mscss timer Power, clock and reset control subsystemMscss timer-clock description Mscss timer 1 pinClock Generation Unit CGU Pcrss block diagramPCR subsystem clock description Number Name Frequency Description MHz CGU base clocksBlock diagram of the CGU Structure of the clock generation scheme PLL functional description CGU pin description PLL block diagramCGU pins Reset output configuration Reset Generation Unit RGURGU pin description Power Management Unit PMURGU pins DRA PMU pin description Vectored interrupt controllerVIC clock description Limiting valuesVIC pin description Thermal characteristics Input pins and I/O pins configured as input Static characteristicsStatic characteristics Symbol Parameter Conditions Min Typ MaxLSB Analog-to-digital converter supplyVDDA5V FSR INLSymbol Parameter Conditions Min Typ Max Unit Dynamic characteristicsPower-up reset Dynamic characteristicsUnitDRAFT Can TXD pin Cycle-to-cycle jitter Peak-to-peak value Jitter SpecificationPackage outline SOT486-1 LQFP144 Package outlineSurface mount packages SolderingIntroduction Through-hole mount packagesSnPb eutectic process from J-STD-020C Package thickness mm Volume mm3 350 235 220 Lead-free process from J-STD-020CTemperature profiles for large and small components Wave solderingDBS, DIP, HDIP, RDBS, SDIP, SIL Package related soldering informationMounting Package1 Soldering method Wave Reflow2 Dipping CPGA, HcpgaMounting Abbreviation Description AbbreviationsAbbreviations list References Revision history Document ID Release date Data sheet statusRevision history Contact information Legal informationContents Package outline Contact information ContentsSoldering
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