NXP Semiconductors LPC2919 NXP Semiconductors, ARM968E-S processor, On-chip flash memory system

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NXP Semiconductors

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2.2 ARM968E-S processor

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The ARM968E-S is a general purpose 32-bit RISC processor, which offers high

 

 

 

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performance and very low power consumption. The ARM architecture is based on

 

 

 

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Reduced Instruction Set Computer (RISC) principles, and the instruction set and related

 

 

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decode mechanism are much simpler than those of micro-programmed Complex

 

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Instruction Set Computers (CISC). This simplicity results in a high instruction throughput

 

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and impressive real-time interrupt response from a small and cost-effective controller

 

 

core.

Amongst the most compelling features of the ARM968E-S are:

•Separate directly connected instruction and data Tightly Coupled Memory (TCM) interfaces

•Write buffers for the AHB and TCM buses

•Enhanced 16 x 32 multiplier capable of single-cycle MAC operations and 16-bit fixed- point DSP instructions to accelerate signal-processing algorithms and applications.

Pipeline techniques are employed so that all parts of the processing and memory systems can operate continuously. The ARM968E-S is based on the ARMv5TE five-stage pipeline architecture. Typically, in a three-stage pipeline architecture, while one instruction is being executed its successor is being decoded and a third instruction is being fetched from memory. In the five-stage pipeline additional stages are added for memory access and write-back cycles.

The ARM968E-S processor also employs a unique architectural strategy known as THUMB, which makes it ideally suited to high-volume applications with memory restrictions or to applications where code density is an issue.

The key idea behind THUMB is that of a super-reduced instruction set. Essentially, the

ARM968E-S processor has two instruction sets:

•Standard 32-bit ARMv5TE set

•16-bit THUMB set

The THUMB set's 16-bit instruction length allows it to approach twice the density of standard ARM code while retaining most of the ARM's performance advantage over a traditional 16-bit controller using 16-bit registers. This is possible because THUMB code operates on the same 32-bit register set as ARM code.

THUMB code can provide up to 65 % of the code size of ARM, and 160 % of the performance of an equivalent ARM controller connected to a 16-bit memory system.

The ARM968E-S processor is described in detail in the ARM968E-S data sheet Ref. 2.

2.3 On-chip flash memory system

The LPC2917/19 includes a 512 kB or 768 kB flash memory system. This memory can be used for both code and data storage. Programming of the flash memory can be accomplished in several ways. It may be programmed in-system via a serial port; e.g. CAN.

LPC2917_19_1

© NXP B.V. 2007. All rights reserved.

Preliminary data sheet

Rev. 1.01 — 15 November 2007

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Contents About this document IntroductionGeneral description Intended audienceOn-chip flash memory system NXP SemiconductorsARM968E-S processor General FeaturesOn-chip static RAM Ordering information Ordering informationOrdering options Part optionsBlock diagram LPC2917/19 block diagramPin description Pinning informationPinning General descriptionSymbol Pin Description Function 0 default LQFP144 pin assignment …TIMER1 MAT0 EXTINT0 TIMER2 MAT2 PWM TRAP1TIMER2 MAT3 PWM TRAP0 TIMER1 MAT1 EXTINT1LQFP144 pin SymbolPin Description Reset strategy Reset, debug, test and power descriptionReset and power-up behavior Reset pinClocking strategy Ieee 1149.1 interface pins Jtag boundary-scan testPower supply pins description Clock architectureLPC2917/19 block diagram, overview of clock areas LPC2917/19Base clock Branch clock name Parts of the device clocked by Base clock and branch clock relationshipBase clock and branch clock overview This branch clockOverview Block descriptionFlash memory controller Base clockDRA DescriptionFlash layout Flash memory controller pin descriptionFlash memory controller clock description Flash bridge wait-states Flash sector overview …External memory-bank address bit description 32 bit Symbol Description System Address Bit FieldExternal static memory controller External static-memory controller pin description External memory timing diagramsExternal memory controller pins External static-memory controller clock descriptionReading from external memory Writing to external memoryReading/writing external memory General subsystem clock description Chip and feature identificationGeneral subsystem System Control Unit SCUPeripheral subsystem clock description Symbol Direction Bit position Description Default PolarityPeripheral subsystem Event-router pin connectionsPin description TimerWatchdog timer clock description 3.2 Description 3.3 Pin descriptionUart pins Timer clock descriptionTimer pins UARTsFunctional description Serial peripheral interfaceUart clock description SPI pin description SPI pinsModes of operation SPI clock description6.1 Overview Gpio pinsGeneral-purpose I/O Gpio pin descriptionLIN Can pinsCan gateway Global acceptance filterLIN pin description LIN controller pinsModulation and sampling control subsystem LIN0/1 TxdlSynchronization and trigger features of the Mscss Modulation and sampling control subsystem block diagramStart ADC conditions is valid Mscss pin description Mscss clock descriptionDraft Analog-to-digital converterADC pin description ADC block diagramAnalog to digital converter pins 6 PWM ADC clock descriptionPWM block diagram Synchronizing the PWM countersPWM pins Timers in the MscssMaster and slave mode PWM pin descriptionMscss timer 1 pin Power, clock and reset control subsystemMscss timer-clock description Pause pin for Mscss timerClock Generation Unit CGU Pcrss block diagramPCR subsystem clock description CGU base clocks Number Name Frequency Description MHzBlock diagram of the CGU Structure of the clock generation scheme PLL functional description CGU pin description PLL block diagramCGU pins Reset Generation Unit RGU Reset output configurationRGU pin description Power Management Unit PMURGU pins DRA Vectored interrupt controller PMU pin descriptionVIC clock description Limiting valuesVIC pin description Thermal characteristics Symbol Parameter Conditions Min Typ Max Static characteristicsStatic characteristics Input pins and I/O pins configured as inputINL Analog-to-digital converter supplyVDDA5V FSR LSBDynamic characteristics Dynamic characteristicsPower-up reset Symbol Parameter Conditions Min Typ Max UnitUnitDRAFT Jitter Specification Can TXD pin Cycle-to-cycle jitter Peak-to-peak valuePackage outline Package outline SOT486-1 LQFP144Through-hole mount packages SolderingIntroduction Surface mount packagesWave soldering Volume mm3 350 235 220 Lead-free process from J-STD-020CTemperature profiles for large and small components SnPb eutectic process from J-STD-020C Package thickness mmCPGA, Hcpga Package related soldering informationMounting Package1 Soldering method Wave Reflow2 Dipping DBS, DIP, HDIP, RDBS, SDIP, SILMounting Abbreviation Description AbbreviationsAbbreviations list References Revision history Document ID Release date Data sheet statusRevision history Legal information Contact informationContents Package outline Contact information ContentsSoldering
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