NXP Semiconductors LPC2917 Modulation and sampling control subsystem, LIN pin description

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NXP Semiconductors

DRAFT	D	D		AFT
DRAFT	RAFT	RAFT AFT		AFT
			DR	DR

DLPC2917/19

ARM9 microcontrollerRAFT withDRAFTCANDRAFTand LINDRAFT

•Complete LIN 2.0 message handling and transfer

•One interrupt per LIN message

•Slave response time-out detection

•Programmable sync-break length

•Automatic sync-field and sync-break generation

•Programmable inter-byte space

•Hardware or software parity generation

•Automatic checksum generation

•Fault confinement

•Fractional baud-rate generator

T DRAFT	T
DRA	DRA DR
F	F
DRAFT DRAFT DRAF
DRAFT DRAFT
	DRAFT	D
	DRAFT
	DRA

8.6.2LIN pin description

The two LIN 2.0 master controllers in the LPC2917/19 have the pins listed below. The LIN pins are combined with other functions on the port pins of the LPC2917/19. Table 19 shows the LIN pins. For more information see Ref. 1 subsection 3.43, LIN master controller.

Table 19. LIN controller pins

Symbol	Direction	Description
LIN0/1 TXDL	out	LIN channel 0/1 transmit data output

LIN0/1 RXDL	in	LIN channel 0/1 receive data input

8.7Modulation and sampling control subsystem

8.7.1Overview

The Modulation and Sampling Control Subsystem (MSCSS) in the LPC2917/19 includes four Pulse-Width Modulators (PWMs), three10-bit successive approximation Analog-to-Digital Converters (ADCs) and two timers.

The key features of the MSCSS are:

•Two 10-bit, 400 ksamples/s, 8-channel ADCs with 3.3 V inputs and various trigger- start options

•Four 6-channel PWMs (Pulse-Width Modulators) with capture and trap functionality

•Two dedicated timers to schedule and synchronize the PWMs and ADCs

8.7.2Description

The MSCSS contains Pulse-Width Modulators (PWMs), Analog-to-Digital Converters (ADCs) and timers.

Figure 7 provides an overview of the MSCSS. An AHB-to-VPB bus bridge takes care of communication with the AHB system bus. Two internal timers are dedicated to this subsystem. MSCSS timer 0 can be used to generate start pulses for the ADCs and the first PWM. The second timer (MSCSS timer 1) is used to generate ‘carrier’ signals for the PWMs. These carrier patterns can be used, for example, in applications requiring current

LPC2917_19_1

© NXP B.V. 2007. All rights reserved.

Preliminary data sheet

Rev. 1.01 — 15 November 2007

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Contents Intended audience IntroductionGeneral description About this documentARM968E-S processor NXP SemiconductorsOn-chip flash memory system On-chip static RAM FeaturesGeneral Part options Ordering informationOrdering options Ordering informationLPC2917/19 block diagram Block diagramGeneral description Pinning informationPinning Pin descriptionLQFP144 pin assignment … Symbol Pin Description Function 0 defaultTIMER1 MAT1 EXTINT1 TIMER2 MAT2 PWM TRAP1TIMER2 MAT3 PWM TRAP0 TIMER1 MAT0 EXTINT0Pin Description SymbolLQFP144 pin Reset pin Reset, debug, test and power descriptionReset and power-up behavior Reset strategyClock architecture Ieee 1149.1 interface pins Jtag boundary-scan testPower supply pins description Clocking strategyLPC2917/19 LPC2917/19 block diagram, overview of clock areasThis branch clock Base clock and branch clock relationshipBase clock and branch clock overview Base clock Branch clock name Parts of the device clocked byBase clock Block descriptionFlash memory controller OverviewDescription DRAFlash memory controller clock description Flash memory controller pin descriptionFlash layout Flash sector overview … Flash bridge wait-statesExternal static memory controller 32 bit Symbol Description System Address Bit FieldExternal memory-bank address bit description External static-memory controller clock description External memory timing diagramsExternal memory controller pins External static-memory controller pin descriptionWriting to external memory Reading from external memoryReading/writing external memory System Control Unit SCU Chip and feature identificationGeneral subsystem General subsystem clock descriptionEvent-router pin connections Symbol Direction Bit position Description Default PolarityPeripheral subsystem Peripheral subsystem clock descriptionWatchdog timer clock description TimerPin description 3.3 Pin description 3.2 DescriptionUARTs Timer clock descriptionTimer pins Uart pinsUart clock description Serial peripheral interfaceFunctional description SPI clock description SPI pinsModes of operation SPI pin descriptionGpio pin description Gpio pinsGeneral-purpose I/O 6.1 OverviewGlobal acceptance filter Can pinsCan gateway LINLIN0/1 Txdl LIN controller pinsModulation and sampling control subsystem LIN pin descriptionModulation and sampling control subsystem block diagram Synchronization and trigger features of the MscssStart ADC conditions is valid Mscss clock description Mscss pin descriptionAnalog-to-digital converter DraftAnalog to digital converter pins ADC block diagramADC pin description ADC clock description 6 PWMSynchronizing the PWM counters PWM block diagramPWM pin description Timers in the MscssMaster and slave mode PWM pinsPause pin for Mscss timer Power, clock and reset control subsystemMscss timer-clock description Mscss timer 1 pinPCR subsystem clock description Pcrss block diagramClock Generation Unit CGU Number Name Frequency Description MHz CGU base clocksBlock diagram of the CGU Structure of the clock generation scheme PLL functional description CGU pins PLL block diagramCGU pin description Reset output configuration Reset Generation Unit RGURGU pins Power Management Unit PMURGU pin description DRA PMU pin description Vectored interrupt controllerVIC pin description Limiting valuesVIC clock description Thermal characteristics Input pins and I/O pins configured as input Static characteristicsStatic characteristics Symbol Parameter Conditions Min Typ MaxLSB Analog-to-digital converter supplyVDDA5V FSR INLSymbol Parameter Conditions Min Typ Max Unit Dynamic characteristicsPower-up reset Dynamic characteristicsUnitDRAFT Can TXD pin Cycle-to-cycle jitter Peak-to-peak value Jitter SpecificationPackage outline SOT486-1 LQFP144 Package outlineSurface mount packages SolderingIntroduction Through-hole mount packagesSnPb eutectic process from J-STD-020C Package thickness mm Volume mm3 350 235 220 Lead-free process from J-STD-020CTemperature profiles for large and small components Wave solderingDBS, DIP, HDIP, RDBS, SDIP, SIL Package related soldering informationMounting Package1 Soldering method Wave Reflow2 Dipping CPGA, HcpgaMounting Abbreviations list AbbreviationsAbbreviation Description References Revision history Document ID Release date Data sheet statusRevision history Contact information Legal informationContents Soldering Contact information ContentsPackage outline