NXP Semiconductors LPC2919, LPC2917 user manual Mounting

Page 62

NXP Semiconductors

DRAFT

D

D

 

AFT

RAFT

RAFT AFT

 

 

 

DR

DR

DLPC2917/19

ARM9 microcontrollerRAFT withDRAFTCANDRAFTand LINDRAFT

Table 34.

Mounting

 

 

 

T DRAFT

T

 

 

DRA

 

DRA

DR

 

 

 

F

 

F

Suitability of IC packages for wave, reflow and dipping soldering methods …continued

DRAFT

DRAFT

DRAF

 

Package[1]

Soldering method

 

 

 

 

Wave

Surface mount

BGA, HTSSON..T[5], LBGA,

not suitable

 

LFBGA, SQFP, SSOP..T[5],

 

 

TFBGA, VFBGA, XSON

 

Reflow[2]

suitable

 

DRAFT DRAFT

Dipping

 

−

DRAFT

D

 

 

 

DHVQFN, HBCC, HBGA, HLQFP, not suitable[6]

suitable

−

HSO, HSOP, HSQFP, HSSON,

 

 

HTQFP, HTSSOP, HVQFN,

 

 

HVSON, SMS

 

 

DRA

 

PLCC[7], SO, SOJ

suitable

suitable

−

 

LQFP, QFP, TQFP

not recommended[7][8]

suitable

−

 

SSOP, TSSOP, VSO, VSSOP

not recommended[9]

suitable

−

 

CWQCCN..L[10], WQCCN..L[10]

not suitable

not suitable

−

[1]For more detailed information on the BGA packages refer to the (LF)BGA Application Note (AN01026); order a copy from your NXP Semiconductors sales office.

[2]All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect).

[3]For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.

[4]Hot bar soldering or manual soldering is suitable for PMFP packages.

[5]These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature exceeding 217 °C ± 10 °C measured in the atmosphere of the reflow oven. The package body peak temperature must be kept as low as possible.

[6]These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, the solder might be deposited on the heatsink surface.

[7]If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners.

[8]Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

[9]Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

[10]Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by using a hot bar soldering process. The appropriate soldering profile can be provided on request.

LPC2917_19_1

© NXP B.V. 2007. All rights reserved.

Preliminary data sheet

Rev. 1.01 — 15 November 2007

62 of 68

Page 61 Page 63
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Contents About this document IntroductionGeneral description Intended audienceOn-chip flash memory system NXP SemiconductorsARM968E-S processor General FeaturesOn-chip static RAM Ordering information Ordering informationOrdering options Part optionsBlock diagram LPC2917/19 block diagramPin description Pinning informationPinning General descriptionSymbol Pin Description Function 0 default LQFP144 pin assignment …TIMER1 MAT0 EXTINT0 TIMER2 MAT2 PWM TRAP1TIMER2 MAT3 PWM TRAP0 TIMER1 MAT1 EXTINT1LQFP144 pin SymbolPin Description Reset strategy Reset, debug, test and power descriptionReset and power-up behavior Reset pinClocking strategy Ieee 1149.1 interface pins Jtag boundary-scan testPower supply pins description Clock architectureLPC2917/19 block diagram, overview of clock areas LPC2917/19Base clock Branch clock name Parts of the device clocked by Base clock and branch clock relationshipBase clock and branch clock overview This branch clockOverview Block descriptionFlash memory controller Base clockDRA DescriptionFlash layout Flash memory controller pin descriptionFlash memory controller clock description Flash bridge wait-states Flash sector overview …External memory-bank address bit description 32 bit Symbol Description System Address Bit FieldExternal static memory controller External static-memory controller pin description External memory timing diagramsExternal memory controller pins External static-memory controller clock descriptionReading from external memory Writing to external memoryReading/writing external memory General subsystem clock description Chip and feature identificationGeneral subsystem System Control Unit SCUPeripheral subsystem clock description Symbol Direction Bit position Description Default PolarityPeripheral subsystem Event-router pin connectionsPin description TimerWatchdog timer clock description 3.2 Description 3.3 Pin descriptionUart pins Timer clock descriptionTimer pins UARTsFunctional description Serial peripheral interfaceUart clock description SPI pin description SPI pinsModes of operation SPI clock description6.1 Overview Gpio pinsGeneral-purpose I/O Gpio pin descriptionLIN Can pinsCan gateway Global acceptance filterLIN pin description LIN controller pinsModulation and sampling control subsystem LIN0/1 TxdlSynchronization and trigger features of the Mscss Modulation and sampling control subsystem block diagramStart ADC conditions is valid Mscss pin description Mscss clock descriptionDraft Analog-to-digital converterADC pin description ADC block diagramAnalog to digital converter pins 6 PWM ADC clock descriptionPWM block diagram Synchronizing the PWM countersPWM pins Timers in the MscssMaster and slave mode PWM pin descriptionMscss timer 1 pin Power, clock and reset control subsystemMscss timer-clock description Pause pin for Mscss timerClock Generation Unit CGU Pcrss block diagramPCR subsystem clock description CGU base clocks Number Name Frequency Description MHzBlock diagram of the CGU Structure of the clock generation scheme PLL functional description CGU pin description PLL block diagramCGU pins Reset Generation Unit RGU Reset output configurationRGU pin description Power Management Unit PMURGU pins DRA Vectored interrupt controller PMU pin descriptionVIC clock description Limiting valuesVIC pin description Thermal characteristics Symbol Parameter Conditions Min Typ Max Static characteristicsStatic characteristics Input pins and I/O pins configured as inputINL Analog-to-digital converter supplyVDDA5V FSR LSBDynamic characteristics Dynamic characteristicsPower-up reset Symbol Parameter Conditions Min Typ Max UnitUnitDRAFT Jitter Specification Can TXD pin Cycle-to-cycle jitter Peak-to-peak valuePackage outline Package outline SOT486-1 LQFP144Through-hole mount packages SolderingIntroduction Surface mount packagesWave soldering Volume mm3 350 235 220 Lead-free process from J-STD-020CTemperature profiles for large and small components SnPb eutectic process from J-STD-020C Package thickness mmCPGA, Hcpga Package related soldering informationMounting Package1 Soldering method Wave Reflow2 Dipping DBS, DIP, HDIP, RDBS, SDIP, SILMounting Abbreviation Description AbbreviationsAbbreviations list References Revision history Document ID Release date Data sheet statusRevision history Legal information Contact informationContents Package outline Contact information ContentsSoldering
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