NXP Semiconductors LPC2919, LPC2917 CGU base clocks, Number Name Frequency Description MHz

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NXP Semiconductors

DRAFT

D

D

 

AFT

RAFT

RAFT AFT

 

 

 

DR

DR

DLPC2917/19

ARM9 microcontrollerRAFT withDRAFTCANDRAFTand LINDRAFT

T DRAFT

T

DRA

DRA

DR

F

F

 

Generation of 10 and 2 test-base clocks, selectable from several embeddedDRAFTclockDRAFT sources

Crystal oscillator with power-downDRAFT DRAFT

Control PLL with power-downD

Very low-power ring oscillator, always on to provide a ’safe clock’DRAFT

Seven fractional clock dividers with L/D divisionDRA

Individual source selector for each base clock, with glitch-free switching

Autonomous clock-activity detection on every clock source

Protection against switching to invalid or inactive clock sources

Embedded frequency counter

Register write-protection mechanism to prevent unintentional alteration of clocks DRAF

Remark: Any clock-frequency adjustment has a direct impact on the timing of on-board peripherals such as the UARTs, SPI, watchdog, timers, CAN controller, LIN master controller, ADCs or flash-memory interface.

8.8.4.2Description

The clock generation unit provides 10 internal clock sources as described in Table 23.

Table 23. CGU base clocks

Number

Name

Frequency

Description

 

 

(MHz) [1]

 

0

BASE_SAFE_CLK

0.4

Base safe clock (always on)

 

 

 

 

1

BASE_SYS_CLK

80

Base system clock

 

 

 

 

2

BASE_PCR_CLK

0.4 [2]

Base PCR subsystem clock

3

BASE_IVNSS_CLK

80

Base IVNSS subsystem clock

 

 

 

 

4

BASE_MSCSS_CLK

80

Base MSCSS subsystem clock

 

 

 

 

5

BASE_UART_CLK

80

Base UART clock

 

 

 

 

6

BASE_SPI_CLK

40

Base SPI clock

 

 

 

 

7

BASE_TMR_CLK

80

Base timers clock

 

 

 

 

8

BASE_ADC_CLK

4.5

Base ADCs clock

 

 

 

 

[1]Maximum frequency that guarantees stable operation of the LPC2917/19.

[2]Fixed to low-power oscillator.

For generation of these base clocks, the CGU consists of primary and secondary clock generators and one output generator for each base clock.

LPC2917_19_1

© NXP B.V. 2007. All rights reserved.

Preliminary data sheet

Rev. 1.01 — 15 November 2007

42 of 68

Image 42
Contents About this document IntroductionGeneral description Intended audienceNXP Semiconductors ARM968E-S processorOn-chip flash memory system Features On-chip static RAMGeneral Ordering information Ordering informationOrdering options Part optionsBlock diagram LPC2917/19 block diagramPin description Pinning informationPinning General descriptionSymbol Pin Description Function 0 default LQFP144 pin assignment …TIMER1 MAT0 EXTINT0 TIMER2 MAT2 PWM TRAP1TIMER2 MAT3 PWM TRAP0 TIMER1 MAT1 EXTINT1Symbol Pin DescriptionLQFP144 pin Reset strategy Reset, debug, test and power descriptionReset and power-up behavior Reset pinClocking strategy Ieee 1149.1 interface pins Jtag boundary-scan testPower supply pins description Clock architectureLPC2917/19 block diagram, overview of clock areas LPC2917/19Base clock Branch clock name Parts of the device clocked by Base clock and branch clock relationshipBase clock and branch clock overview This branch clockOverview Block descriptionFlash memory controller Base clockDRA DescriptionFlash memory controller pin description Flash memory controller clock descriptionFlash layout Flash bridge wait-states Flash sector overview …32 bit Symbol Description System Address Bit Field External static memory controllerExternal memory-bank address bit description External static-memory controller pin description External memory timing diagramsExternal memory controller pins External static-memory controller clock descriptionReading from external memory Writing to external memoryReading/writing external memory General subsystem clock description Chip and feature identificationGeneral subsystem System Control Unit SCUPeripheral subsystem clock description Symbol Direction Bit position Description Default PolarityPeripheral subsystem Event-router pin connectionsTimer Watchdog timer clock descriptionPin description 3.2 Description 3.3 Pin descriptionUart pins Timer clock descriptionTimer pins UARTsSerial peripheral interface Uart clock descriptionFunctional description SPI pin description SPI pinsModes of operation SPI clock description6.1 Overview Gpio pinsGeneral-purpose I/O Gpio pin descriptionLIN Can pinsCan gateway Global acceptance filterLIN pin description LIN controller pinsModulation and sampling control subsystem LIN0/1 TxdlSynchronization and trigger features of the Mscss Modulation and sampling control subsystem block diagramStart ADC conditions is valid Mscss pin description Mscss clock descriptionDraft Analog-to-digital converterADC block diagram Analog to digital converter pinsADC pin description 6 PWM ADC clock descriptionPWM block diagram Synchronizing the PWM countersPWM pins Timers in the MscssMaster and slave mode PWM pin descriptionMscss timer 1 pin Power, clock and reset control subsystemMscss timer-clock description Pause pin for Mscss timerPcrss block diagram PCR subsystem clock descriptionClock Generation Unit CGU CGU base clocks Number Name Frequency Description MHzBlock diagram of the CGU Structure of the clock generation scheme PLL functional description PLL block diagram CGU pinsCGU pin description Reset Generation Unit RGU Reset output configurationPower Management Unit PMU RGU pinsRGU pin description DRA Vectored interrupt controller PMU pin descriptionLimiting values VIC pin descriptionVIC clock description Thermal characteristics Symbol Parameter Conditions Min Typ Max Static characteristicsStatic characteristics Input pins and I/O pins configured as inputINL Analog-to-digital converter supplyVDDA5V FSR LSBDynamic characteristics Dynamic characteristicsPower-up reset Symbol Parameter Conditions Min Typ Max UnitUnitDRAFT Jitter Specification Can TXD pin Cycle-to-cycle jitter Peak-to-peak valuePackage outline Package outline SOT486-1 LQFP144Through-hole mount packages SolderingIntroduction Surface mount packagesWave soldering Volume mm3 350 235 220 Lead-free process from J-STD-020CTemperature profiles for large and small components SnPb eutectic process from J-STD-020C Package thickness mmCPGA, Hcpga Package related soldering informationMounting Package1 Soldering method Wave Reflow2 Dipping DBS, DIP, HDIP, RDBS, SDIP, SILMounting Abbreviations Abbreviations listAbbreviation Description References Document ID Release date Data sheet status Revision historyRevision history Legal information Contact informationContents Contact information Contents SolderingPackage outline