NXP Semiconductors LPC2919 Wave soldering, Temperature profiles for large and small components

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NXP Semiconductors

DRAFT	D	D		AFT
DRAFT	RAFT	RAFT AFT		AFT
			DR	DR

DLPC2917/19

ARM9 microcontrollerRAFT withDRAFTCANDRAFTand LINDRAFT

Table 32.	SnPb eutectic process (from J-STD-020C)
Package thickness (mm)		Package reflow temperature (°C)
		Volume (mm3)
		< 350		≥ 350
< 2.5	235			220
≥ 2.5	220			220
Table 33.	Lead-free process (from J-STD-020C)

T DRAFT	T
DRA	DRA DR
F	F
DRAFT DRAFT DRAF
DRAFT DRAFT
	DRAFT	D
	DRAFT
	DRA

Package thickness (mm)

< 1.6

Package reflow temperature (°C)

Volume (mm3)

< 350	350 to 2000	> 2000
260	260	260

1.6 to 2.5	260	250	245
> 2.5	250	245	245

Moisture sensitivity precautions, as indicated on the packing, must be respected at all times.

Studies have shown that small packages reach higher temperatures during reflow soldering, see Figure 16.

	maximum peak temperature
temperature	= MSL limit, damage level
temperature
	minimum peak temperature
	= minimum soldering temperature
	peak
	temperature
	time
	001aac844

MSL: Moisture Sensitivity Level

Fig 16. Temperature profiles for large and small components

For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description”.

14.3.2Wave soldering

Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems.

LPC2917_19_1

© NXP B.V. 2007. All rights reserved.

Preliminary data sheet

Rev. 1.01 — 15 November 2007

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Contents Introduction General descriptionAbout this document Intended audienceNXP Semiconductors ARM968E-S processorOn-chip flash memory system Features On-chip static RAMGeneral Ordering information Ordering optionsOrdering information Part optionsBlock diagram LPC2917/19 block diagramPinning information PinningPin description General descriptionSymbol Pin Description Function 0 default LQFP144 pin assignment …TIMER2 MAT2 PWM TRAP1 TIMER2 MAT3 PWM TRAP0TIMER1 MAT0 EXTINT0 TIMER1 MAT1 EXTINT1Symbol Pin DescriptionLQFP144 pin Reset, debug, test and power description Reset and power-up behaviorReset strategy Reset pinIeee 1149.1 interface pins Jtag boundary-scan test Power supply pins descriptionClocking strategy Clock architectureLPC2917/19 block diagram, overview of clock areas LPC2917/19Base clock and branch clock relationship Base clock and branch clock overviewBase clock Branch clock name Parts of the device clocked by This branch clockBlock description Flash memory controllerOverview Base clockDRA DescriptionFlash memory controller pin description Flash memory controller clock descriptionFlash layout Flash bridge wait-states Flash sector overview …32 bit Symbol Description System Address Bit Field External static memory controllerExternal memory-bank address bit description External memory timing diagrams External memory controller pinsExternal static-memory controller pin description External static-memory controller clock descriptionReading from external memory Writing to external memoryReading/writing external memory Chip and feature identification General subsystemGeneral subsystem clock description System Control Unit SCUSymbol Direction Bit position Description Default Polarity Peripheral subsystemPeripheral subsystem clock description Event-router pin connectionsTimer Watchdog timer clock descriptionPin description 3.2 Description 3.3 Pin descriptionTimer clock description Timer pinsUart pins UARTsSerial peripheral interface Uart clock descriptionFunctional description SPI pins Modes of operationSPI pin description SPI clock descriptionGpio pins General-purpose I/O6.1 Overview Gpio pin descriptionCan pins Can gatewayLIN Global acceptance filterLIN controller pins Modulation and sampling control subsystemLIN pin description LIN0/1 TxdlSynchronization and trigger features of the Mscss Modulation and sampling control subsystem block diagramStart ADC conditions is valid Mscss pin description Mscss clock descriptionDraft Analog-to-digital converterADC block diagram Analog to digital converter pinsADC pin description 6 PWM ADC clock descriptionPWM block diagram Synchronizing the PWM countersTimers in the Mscss Master and slave modePWM pins PWM pin descriptionPower, clock and reset control subsystem Mscss timer-clock descriptionMscss timer 1 pin Pause pin for Mscss timerPcrss block diagram PCR subsystem clock descriptionClock Generation Unit CGU CGU base clocks Number Name Frequency Description MHzBlock diagram of the CGU Structure of the clock generation scheme PLL functional description PLL block diagram CGU pinsCGU pin description Reset Generation Unit RGU Reset output configurationPower Management Unit PMU RGU pinsRGU pin description DRA Vectored interrupt controller PMU pin descriptionLimiting values VIC pin descriptionVIC clock description Thermal characteristics Static characteristics Static characteristicsSymbol Parameter Conditions Min Typ Max Input pins and I/O pins configured as inputAnalog-to-digital converter supply VDDA5V FSRINL LSBDynamic characteristics Power-up resetDynamic characteristics Symbol Parameter Conditions Min Typ Max UnitUnitDRAFT Jitter Specification Can TXD pin Cycle-to-cycle jitter Peak-to-peak valuePackage outline Package outline SOT486-1 LQFP144Soldering IntroductionThrough-hole mount packages Surface mount packagesVolume mm3 350 235 220 Lead-free process from J-STD-020C Temperature profiles for large and small componentsWave soldering SnPb eutectic process from J-STD-020C Package thickness mmPackage related soldering information Mounting Package1 Soldering method Wave Reflow2 DippingCPGA, Hcpga DBS, DIP, HDIP, RDBS, SDIP, SILMounting Abbreviations Abbreviations listAbbreviation Description References Document ID Release date Data sheet status Revision historyRevision history Legal information Contact informationContents Contact information Contents SolderingPackage outline