NXP Semiconductors LPC2917 Static characteristics, Symbol Parameter Conditions Min Typ Max

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NXP Semiconductors

DRAFT	D	D		AFT
DRAFT	RAFT	RAFT AFT		AFT
			DR	DR

DLPC2917/19

ARM9 microcontrollerRAFT withDRAFTCANDRAFTand LINDRAFT

11. Static characteristics

T DRAFT	T
DRA	DRA DR
F	F
DRAFT DRAFT DRAF

Table 30. Static characteristics

VDD(CORE) = VDD(OSC_PLL) ; VDD(IO) = 2.7 V to 3.6 V; VDD(A3V3) = 3.0 V to 3.6 V; Tvj = -40 °C to +125 °C; all voltages measured with respect to ground; positive currents flow into the IC; unless otherwise specified.[1]

Symbol	Parameter	Conditions	Min	Typ	Max
Supplies

	DRAFT DRAFT
	are	D
	DRAFT	D
	DRAFT
	Unit
	DRA

Core supply

VDD(CORE)	Core supply voltage.			1.71	1.80	1.89	V
IDDD(CORE)	Core supply current.	ARM9 and all		-	1.1	2.5	mA/
		peripherals active at					MHz
		max clock speeds.
		All clocks off.	[2]	-	30	450	μA

I/O supply

VDD(IO)	I/O digital supply voltage.			2.7	-	3.6	V
Oscillator supply

VDD(OSC_PLL)	Oscillator and PLL supply			1.71	1.80	1.89	V
	voltage.
IDDD(OSC_PLL)	Oscillator and PLL supply	start-up		1.5	-	3	mA
	current.
	current.	Normal mode		-	-	1	mA
		Normal mode		-	-	1	mA

		Power-down mode		-	-	2	μA

Analog-to-digital converter supply

VDD(A3V3)	3.3 V ADC supply voltage			3.0	3.3	3.6	V
IDDA(A3V3)	3.3 V ADC analog supply	Normal mode		-	-	1.9	mA
	current.
	current.	Power-down mode		-	-	4	μA
		Power-down mode		-	-	4	μA

Input pins and I/O pins configured as input

VI	Input voltage.	All port pins and VDD(IO)	[7][8]	-0.5	-	+ 5.5	V
		applied except port 0
		pins 16 to 31.
		see Section 9

		Port 0 pins 16 to 31.	[8]			VVREFP
		All port pins and VDD(IO)		-0.5	-	+3.6	V
		not applied.

		All other I/O pins,		-0.5	-	VDD(IO)	V
		RESET_N, TRST_N,
		TDI, JTAGSEL, TMS,
		TCK.

VIH	HIGH-state input voltage.	All port pins, RESET_N,		2.0	-	-	V
		TRST_N, TDI,
		JTAGSEL, TMS, TCK.

VIL	LOW-state input voltage.	All port pins, RESET_N,		-	-	0.8	V
		TRST_N, TDI,
		JTAGSEL, TMS, TCK.

Vhys	Hysteresis voltage.			0.4	-	-	V

ILIH	HIGH-state input leakage			-	-	1	μA
	current.
LPC2917_19_1						© NXP B.V. 2007. All rights reserved.

Preliminary data sheet

Rev. 1.01 — 15 November 2007

53 of 68

Image 53

Contents General description IntroductionAbout this document Intended audienceOn-chip flash memory system NXP SemiconductorsARM968E-S processor General FeaturesOn-chip static RAM Ordering options Ordering informationOrdering information Part optionsLPC2917/19 block diagram Block diagramPinning Pinning informationPin description General descriptionLQFP144 pin assignment … Symbol Pin Description Function 0 defaultTIMER2 MAT3 PWM TRAP0 TIMER2 MAT2 PWM TRAP1TIMER1 MAT0 EXTINT0 TIMER1 MAT1 EXTINT1LQFP144 pin SymbolPin Description Reset and power-up behavior Reset, debug, test and power descriptionReset strategy Reset pinPower supply pins description Ieee 1149.1 interface pins Jtag boundary-scan testClocking strategy Clock architectureLPC2917/19 LPC2917/19 block diagram, overview of clock areasBase clock and branch clock overview Base clock and branch clock relationshipBase clock Branch clock name Parts of the device clocked by This branch clockFlash memory controller Block descriptionOverview Base clockDescription DRAFlash layout Flash memory controller pin descriptionFlash memory controller clock description Flash sector overview … Flash bridge wait-statesExternal memory-bank address bit description 32 bit Symbol Description System Address Bit FieldExternal static memory controller External memory controller pins External memory timing diagramsExternal static-memory controller pin description External static-memory controller clock descriptionWriting to external memory Reading from external memoryReading/writing external memory General subsystem Chip and feature identificationGeneral subsystem clock description System Control Unit SCUPeripheral subsystem Symbol Direction Bit position Description Default PolarityPeripheral subsystem clock description Event-router pin connectionsPin description TimerWatchdog timer clock description 3.3 Pin description 3.2 DescriptionTimer pins Timer clock descriptionUart pins UARTsFunctional description Serial peripheral interfaceUart clock description Modes of operation SPI pinsSPI pin description SPI clock descriptionGeneral-purpose I/O Gpio pins6.1 Overview Gpio pin descriptionCan gateway Can pinsLIN Global acceptance filterModulation and sampling control subsystem LIN controller pinsLIN pin description LIN0/1 TxdlModulation and sampling control subsystem block diagram Synchronization and trigger features of the MscssStart ADC conditions is valid Mscss clock description Mscss pin descriptionAnalog-to-digital converter DraftADC pin description ADC block diagramAnalog to digital converter pins ADC clock description 6 PWMSynchronizing the PWM counters PWM block diagramMaster and slave mode Timers in the MscssPWM pins PWM pin descriptionMscss timer-clock description Power, clock and reset control subsystemMscss timer 1 pin Pause pin for Mscss timerClock Generation Unit CGU Pcrss block diagramPCR subsystem clock description Number Name Frequency Description MHz CGU base clocksBlock diagram of the CGU Structure of the clock generation scheme PLL functional description CGU pin description PLL block diagramCGU pins Reset output configuration Reset Generation Unit RGURGU pin description Power Management Unit PMURGU pins DRA PMU pin description Vectored interrupt controllerVIC clock description Limiting valuesVIC pin description Thermal characteristics Static characteristics Static characteristicsSymbol Parameter Conditions Min Typ Max Input pins and I/O pins configured as inputVDDA5V FSR Analog-to-digital converter supplyINL LSBPower-up reset Dynamic characteristicsDynamic characteristics Symbol Parameter Conditions Min Typ Max UnitUnitDRAFT Can TXD pin Cycle-to-cycle jitter Peak-to-peak value Jitter SpecificationPackage outline SOT486-1 LQFP144 Package outlineIntroduction SolderingThrough-hole mount packages Surface mount packagesTemperature profiles for large and small components Volume mm3 350 235 220 Lead-free process from J-STD-020CWave soldering SnPb eutectic process from J-STD-020C Package thickness mmMounting Package1 Soldering method Wave Reflow2 Dipping Package related soldering informationCPGA, Hcpga DBS, DIP, HDIP, RDBS, SDIP, SILMounting Abbreviation Description AbbreviationsAbbreviations list References Revision history Document ID Release date Data sheet statusRevision history Contact information Legal informationContents Package outline Contact information ContentsSoldering