Memory expansion module features and specifications

The following table contains a summary of the features and specifications of the

memory expansion module.

Table4. MAX5 expansion module features and operating specifications
vIntel 7500 or 7510 scalable memory
buffer (depending on your model)
with eight memory ports (four
DIMMs on each port)
vXcellerated Memory Technology
vEXAchip set
vQuickPath Interconnect (QPI)
architecture technology:
– Four 6.4 gigatransfers (GT) per
second QuickPath Interconnect
links (for up to 2
microprocessors)
– Three 10.0 GT per second EXA
scalability links
vScalability:
– Connects to the x3850 X5 and
x3950 X5 (4U) rack servers using
QPI cables
DIMMs:
vMinimum: 2 DIMMs (two 2 GB
DIMMs (4 GB total)
vMaximum: 32 DIMM connectors
(up 1 TB of memory,depending on
the DIMM size)
vTypeof DIMMs: PC3-10600R-999,
1333 MHz or PC3-8500R, 1066
MHz, ECC, DDR3 registered
SDRAM dual inline memory
modules (DIMMs)
vSupports 2 GB, 4 GB, 8 GB, 16 GB,
and 32 GB DIMMs
vSupports l.35 V (low-voltage) and
1.5 V registered DIMMs (see
“Installing DIMMs in the memory
expansion module” on page 83 for
more information).
Power supply:
vOne or two 675-watt (110- 220 V
ac auto-sensing) standard
(depending on the model)
vSupports up to two 675-watt (110-
220 V ac auto-sensing) hot-swap
power supplies with built-in fans
for redundancy support
Light path diagnostics LEDs:
vBoard LED
vConfiguration LED
vFan LEDs
vLink LED (for QPI and EXAlinks)
vLocate LED
vMemory LEDs
vPower-on LEDs
vPower supply LEDs
Chapter1. The System x3850 X5 and x3950 X5 server 23