IBM 71453RU manual Memory expansion module features and specifications, DIMMs Power supply

Memory expansion module features and specifications

The following table contains a summary of the features and specifications of the memory expansion module.

Table 4. MAX5 expansion module features and operating specifications

v Intel 7500 or 7510 scalable memory		DIMMs:		Power supply:
	buffer (depending on your model)	v Minimum: 2 DIMMs (two 2 GB		v One or two 675-watt (110 - 220 V
	with eight memory ports (four
	DIMMs on each port)		DIMMs (4 GB total)		ac auto-sensing) standard
v	Xcellerated Memory Technology	v Maximum: 32 DIMM connectors			(depending on the model)
				v Supports up to two 675-watt (110 -
v	EXA chip set		(up 1 TB of memory, depending on
			the DIMM size)		220 V ac auto-sensing) hot-swap
v	QuickPath Interconnect (QPI)
		v	Type of DIMMs: PC3-10600R-999,		power supplies with built-in fans
	architecture technology:
			1333 MHz or PC3-8500R, 1066		for redundancy support
	– Four 6.4 gigatransfers (GT) per
			MHz, ECC, DDR3 registered	Light path diagnostics LEDs:
	second QuickPath Interconnect
			SDRAM dual inline memory
	links (for up to 2			v	Board LED
			modules (DIMMs)
	microprocessors)	v	Supports 2 GB, 4 GB, 8 GB, 16 GB,	v	Configuration LED
	– Three 10.0 GT per second EXA
			and 32 GB DIMMs	v	Fan LEDs
	scalability links
		v Supports l.35 V (low-voltage) and		v Link LED (for QPI and EXA links)
v	Scalability:
			1.5 V registered DIMMs (see	v	Locate LED
	– Connects to the x3850 X5 and		“Installing DIMMs in the memory
				v	Memory LEDs
	x3950 X5 (4U) rack servers using		expansion module” on page 83 for
	QPI cables		more information).	v	Power-on LEDs
				v	Power supply LEDs

Chapter 1. The System x3850 X5 and x3950 X5 server 23