© Siemens AG 2007

Process I/O

Dezentrale Peripherie ET 200pro

Introduction

Technical specifications

General technical specifications

 

 

 

Electronics modules

• Digital inputs/outputs

 

• Analog inputs/outputs

 

Safety-related digital inputs/

 

outputs

Connection system for actuator/

M12 round plug connection with

sensor

standard assignments for

 

actuator/sensor

 

 

For detailed technical specifications, especially for individual components such as interface module, power module and elec- tronics modules, see:

Catalog IK PI

Mall/CA 01 under "Distributed I/Os / ET 200pro"

Data transfer rate, max.

12 Mbit/s (PROFIBUS DP)

Power supply

24 V DC

Current consumption of an ET

5 A

200pro (internal and sensor supply,

 

non-switched voltage), up to 55 °C,

 

max.

 

Load current for ET 200pro per

10 A

incoming supply (IM, PM, switched

 

voltage), up to 55 °C, max.

 

 

 

For total configuration with looping through (several ET 200pro), up to 55 °C, max.

16 A (with direct connection module)

 

Degree of protection

IP65/66/IP67 for interface, digital

 

 

 

and analog modules

 

Material

Thermoplast (glass-fiber

 

 

 

reinforced)

 

 

 

 

 

Ambient conditions

 

 

 

 

 

 

Temperature

0 ... 55 °C (-25 °C on request)

 

Relative humidity

5 ... 100 %

 

Atmospheric pressure

 

 

795 ... 1080 hPa

 

 

 

 

 

Mechanical stress

 

 

 

 

 

 

Vibrations

Vibration test according to

 

 

 

IEC 60068, Part 2-6 (sinusoidal)

 

 

 

• Constant acceleration 5 g,

 

 

 

occasionally 10 g, for interface,

 

 

 

digital and analog modules

 

 

 

• 2 g for motor starters

 

Shock

• Shock test according to

11

 

 

IEC 680068 Part 2-27, half-sine,

 

 

30 g, 18 ms duration for inter-

 

 

 

face, digital and analog mod-

 

 

 

ules

 

 

 

• 15 g, 11 ms duration for motor

 

 

 

starters

 

 

Approvals

UL, CSA and cULus

 

 

 

 

11/58

Siemens ST PCS 7 · November 2007

Page 272
Image 272
Siemens ST PCS 7 manual 11/58, General technical specifications, Ambient conditions, Mechanical stress