Sigma SQC-122c manual Power%

Page 17

Chapter 2

Operation

The PID parameters control the response of the SQC-122c to changes in deposition rate. These values are unique to each deposition chamber setup, and to a lesser extent to each material.

The P Term is proportional (or gain), the % process rate change divided by the % input power change. The I Term (integral) sums the rate deviations over time to more accurately achieve the rate setpoint. The D Term (derivative) speeds response to sudden changes in rate. Volumes have been written on determining the proper PID settings. See the section on Loop Tuning later in this chapter for a common PID loop tuning procedure. For now, you should probably leave these values at their defaults.

Press Film Conds to enter the film conditioning menu. Film preconditioning is used to prepare a material for deposition. When the film deposition is complete, post conditioning ramps power down to an idle level. It may also ramp power to a level appropriate for wire feeding new material. Refer to the Thin Film Process Overview in Chapter 1 for an illustration of pre and post conditioning.

Exit to Main

Prev Menu

Edit

THICKNESS(kA)

 

RATE(A/s)

POWER(%)

0.000

0.0

0.0

 

My Process 1 Editing: Aluminum

 

 

 

 

 

 

 

Parameter

 

Value

Units

 

 

 

 

 

 

 

 

 

 

 

Ramp1 Power

50

%

 

 

 

 

 

 

Ramp1 Time

0.7

h:mm:ss

 

Soak1 Time

0.0

h:mm:ss

 

Ramp2 Power

 

O n

%

 

Ramp2 Time

 

O n

h:mm:ss

 

Soak2 Time

 

Out1

h:mm:ss

 

Feed Power

75.0

%

 

Ramp Time

10.0

h:mm:ss

 

Feed Time

0:00:00

h:mm:ss

 

Idle Power

2.90

%

 

Ramp Time

0.950

h:mm:ss

 

 

 

 

 

 

 

Film Conditioning Menu

Set the Ramp 1 Power and Time to values that will slowly bring the material to a near molten state. Set the Soak 1 Time to a value that will allow the material to homogeneously achieve the state. Ramp 2 is used to slowly bring the material to a power level that nearly matches the desired deposition power. Use Soak 2 to hold the material at that level until deposition (i.e. rate control) begins.

If you use wire feed to replenish material after deposition, set the Feed Power and times as required. Idle typically ramps output power back toward zero at the end of a process.

2-3

Image 17
Contents SQC-122c Thin Film Deposition Controller User’s Guide Safety Symbols Safety InformationReturn Policy Warranty InformationLimitation of Warranty Chapter Operation Table of Contents Chapter Quick StartChapter Menus Chapter OptionsAppendix Thin Film Process Overview Chapter Quick Start IntroductionChapter Quick Start Front Panel Chapter Quick Start Rear Panel Power Input FuseChapter Quick Start System Connections Chapter Quick Start Installation Power Chapter Quick Start Process SetupQuick Setup SelectExit to Main Edit Mode LayerChapter Quick Start Chapter Quick Start Depositing a Film This page left blank for your notes Defining a Film Chapter Operation IntroductionDefinitions POWER% POWER% Deposition Controls Menu Layer Edit Menu Chapter Operation Defining a ProcessChapter Operation Chapter Operation Sensor Setup Tooling U n d e r 1 0 0 % Chapter Operation Chapter Operation Source Setup Chapter Operation Running a Process Chapter Operation Next Menu Zero THICKNESSkA RATEA/s 824 55.3 Chapter Operation Loop Tuning Chapter Operation No Readings, or Erratic Readings from Sensors Chapter Operation TroubleshootingPoor Rate Stability Incorrect Rate or Thickness MeasurementThis page left blank for your notes Chapter Menus Introduction Chapter Menus Main Menu Default, power-up Main Screen display is shown belowNext SetupMenu Quick FilmChapter Menus Next Menu Screens Exit to Main Edit Chapter Menus Quick Setup MenuPrev Layer Next LayerChapter Menus Main Screen Prev Menu Select Edit Delete Control Knob Chapter Menus Process MenusInsert Layer Control Knob Main Screen Prev Menu Edit Cut PasteExit to Main Prev Menu Edit Control Knob POWER%Chapter Menus Main Screen Prev Menu Edit Delete Control Knob Chapter Menus Film MenusExit to Main Prev Menu Edit Exit to Main Prev Menu Edit THICKNESSkA RATEA/s Deposition Controls Menu Chapter Menus Chapter Menus Chapter Menus Chapter Menus System Parameters Menu Chapter Menus Chapter Menus Mapping Menu Chapter Menus I/O SetupInputs Explanation high input causes Relays Explanation closes whenThis page left blank for your notes Option Card Full Rack Extender InstallationChapter Options Introduction Appendix Material Parameters General Specifications Appendix SpecificationsMeasurement SourceDisplay Appendix O Connections Connector Wiring Relay PinsInput Pins Appendix Appendix Handheld Remote Controller Appendix EC Declaration of Conformity Complies with the Essential Health and Safety RequirementsDeclares that the product Uses the following standards