MC68HC(7)08KH12 — Rev. 1.1 Advance Information
Freescale Semiconductor 253
17.10 USB Low Speed Source Electrical CharacteristicsCharacteristic Symbol Conditions
(Notes 1,2,3) Min Typ Max Unit
Transition time:
Rise Time
Fall Time
TR
TF
Notes 4, 5, 8
CL=200 pF
CL=600pF
CL=200pF
CL=600pF
75
75
—
—
—
300
—
300
ns
Rise/Fall Time Matching TRFM TR/TF80 — 120 %
Output Signal Crossover
Voltage VCRS 1.3 — 2.0 V
Low Speed Data Rate TDRATE 1.5Mbs±1.5% 1.4775
676.8 1.500
666.0 1.5225
656.8 Mbs
ns
Source Differential Driver Jitter
To Ne xt Tr an sit ion
For Paired Transitions TUDJ1
TUDJ2
CL=350pF
Notes 6, 7 –25
–10
—
—25
10 ns
ns
Receiver Data Jitter Tolerance
To Ne xt Tr an sit ion
For Paired Transitions TDJR1
TDJR2
CL=350pF
Note 7 –75
–45 —
—75
45 ns
ns
Source EOP Width TEOPT Note 7 1.25 — 1.50 µs
Differential to EOP Transition
Skew TDEOP Note 7 –40 — 100 ns
Receiver EOP Width
Must Reject as EOP
Must Accept TEOPR1
TEOPR2
Note 7 330
670 —
——
—ns
ns
NOTES:
1. All voltages measured from local ground, unless otherwise specified.
2. All timings use a capacitive load of 50pF, unless otherwise specified.
3. Low speed timings have a 1.5kΩ pull-up to 2.8V on the D– data line.
4. Measured from 10% to 90% of the data signal.
5. The rising and falling edges should be smoothly transitioning (monotonic).
6. Timing differences between the differential data signals.
7. Measured at crossover point of differential data signals.
8. Capacitive loading includes 50pF of tester capacitance.