NXP Semiconductors LPC2919 user manual Overview, Description, DLPC2917/19

Models: LPC2917 LPC2919

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8.2.1Overview

NXP Semiconductors

DRAFT

D

D

 

AFT

RAFT

RAFT AFT

 

 

 

DR

DR

DLPC2917/19

ARM9 microcontrollerRAFT withDRAFTCANDRAFTand LINDRAFT

T

DRAFT

T

 

DRA

 

DRA

 

DR

F

 

F

 

cannot be performed at full speed (i.e. with zero wait-states at the AHB bus)DRAFTif speculativeDRAFT

DRAF

Remark: If the programmed number of wait-states is more than three, flash-data reading

 

 

reading is active.

DRAFT DRAFT

 

 

 

 

8.2 External static memory controller

 

DRAFT

D

 

 

 

 

 

 

8.2.1Overview

The LPC2917/19 contains an external Static Memory Controller (SMC) which provides an interface for external (off-chip) memory devices.

Key features are:

DRA

Supports static memory-mapped devices including RAM, ROM, flash, burst ROM and external I/O devices

Asynchronous page-mode read operation in non-clocked memory subsystems

Asynchronous burst-mode read access to burst-mode ROM devices

Independent configuration for up to eight banks, each up to 16 MB

Programmable bus-turnaround (idle) cycles (one to 16)

Programmable read and write wait states (up to 32), for static RAM devices

Programmable initial and subsequent burst-read wait state for burst-ROM devices

Programmable write protection

Programmable burst-mode operation

Programmable external data width: 8-bit, 16-bit or 32-bit

Programmable read-byte lane enable control

8.2.2Description

The SMC simultaneously supports up to eight independently configurable memory banks. Each memory bank can be 8, 16 or 32 bits wide and is capable of supporting SRAM, ROM, burst-ROM memory or external I/O devices.

A separate chip-select output is available for each bank. The chip-select lines are configurable to be active HIGH or LOW. Memory-bank selection is controlled by memory addressing. Table 10 shows how the 32-bit system address is mapped to the external bus memory base addresses, chip selects and bank internal addresses.

Table 10. External memory-bank address bit description

 

32 bit

Symbol

Description

 

System

 

 

 

Address Bit

 

 

 

field

 

 

 

31 to 29

BA[2:0]

external static-memory base address (three most significant bits);

 

 

 

the base address can be found in the memory map; see Ref. 1. This

 

 

 

field contains ’010’ when addressing an external memory bank.

 

 

 

 

 

28 to 26

CS[2:0]

chip-select address space for eight memory banks; see [1]

 

25 and 24

-

always ’00’; other values are ’mirrors’ of the 16 MByte bank address

 

 

 

 

 

23 to 0

A[23:0]

16-MByte memory banks address space

 

 

 

 

LPC2917_19_1

 

© NXP B.V. 2007. All rights reserved.

Preliminary data sheet

Rev. 1.01 — 15 November 2007

18 of 68

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NXP Semiconductors LPC2919 user manual Overview, Description, DLPC2917/19