NXP Semiconductors LPC2919 Package outline, DLPC2917/19, Raft Aft, Dra Dr, T Draft, Draft Draft

NXP Semiconductors

DRAFT	D	D		AFT
	RAFT	RAFT AFT
			DR	DR

DLPC2917/19

ARM9 microcontrollerRAFT withDRAFTCANDRAFTand LINDRAFT

13. Package outline

T DRAFT	T
DRA	DRA DR
F	F
DRAFT DRAFT DRAF

LQFP144: plastic low profile quad flat package; 144 leads; body 20 x 20 x 1.4 mm

DRAFT DRAFT
SOT486-1	D
DRAFT
DRA

y

c

X

A

108

109

144

1

pin 1 index
e	w M	Z D
	bp

D

HD

73

72

Z E

e

E HE A A2

A1

w M

b p

37 36

v M A

B

v M B

0 5 10 mm

scale

(A3)

θ

L p

L

detail X

DIMENSIONS (mm are the original dimensions)

UNIT	A	A	1	A	2	A	3	b	p	c	D(1)	E(1)	e	H	H	E	L	L	p	v	w	y	Z (1)	Z (1)	θ
	max.													D									D	E
mm	1.6	0.15		1.45		0.25		0.27		0.20	20.1	20.1	0.5	22.15	22.15		1	0.75		0.2	0.08	0.08	1.4	1.4	7o
		0.05		1.35				0.17		0.09	19.9	19.9		21.85	21.85			0.45					1.1	1.1	0o

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

OUTLINE		REFERENCES		EUROPEAN	ISSUE DATE
VERSION	IEC	JEDEC	JEITA	PROJECTION
SOT486-1	136E23	MS-026			00-03-14
					03-02-20

Fig 15. Package outline SOT486-1 (LQFP144)

LPC2917_19_1

© NXP B.V. 2007. All rights reserved.

Preliminary data sheet Rev. 1.01 — 15 November 2007 58 of 68