NXP Semiconductors LPC2919, LPC2917 user manual Mounting

NXP Semiconductors

DRAFT	D	D		AFT
	RAFT	RAFT AFT
			DR	DR

DLPC2917/19

ARM9 microcontrollerRAFT withDRAFTCANDRAFTand LINDRAFT

Table 34.

Mounting

			T DRAFT		T
		DRA			DRA	DR
			F		F
Suitability of IC packages for wave, reflow and dipping soldering methods …continued			DRAFT	DRAFT		DRAF
Package[1]	Soldering method

		Wave
Surface mount	BGA, HTSSON..T[5], LBGA,	not suitable
	LFBGA, SQFP, SSOP..T[5],
	TFBGA, VFBGA, XSON

Reflow[2]

suitable

	DRAFT DRAFT
Dipping
−	DRAFT	D

DHVQFN, HBCC, HBGA, HLQFP, not suitable[6]	suitable	−
HSO, HSOP, HSQFP, HSSON,
HTQFP, HTSSOP, HVQFN,
HVSON, SMS

DRA

PLCC[7], SO, SOJ	suitable	suitable	−
LQFP, QFP, TQFP	not recommended[7][8]	suitable	−
SSOP, TSSOP, VSO, VSSOP	not recommended[9]	suitable	−
CWQCCN..L[10], WQCCN..L[10]	not suitable	not suitable	−

[1]For more detailed information on the BGA packages refer to the (LF)BGA Application Note (AN01026); order a copy from your NXP Semiconductors sales office.

[2]All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect).

[3]For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.

[4]Hot bar soldering or manual soldering is suitable for PMFP packages.

[5]These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature exceeding 217 °C ± 10 °C measured in the atmosphere of the reflow oven. The package body peak temperature must be kept as low as possible.

[6]These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, the solder might be deposited on the heatsink surface.

[7]If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners.

[8]Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

[9]Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

[10]Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by using a hot bar soldering process. The appropriate soldering profile can be provided on request.

LPC2917_19_1 © NXP B.V. 2007. All rights reserved.

Preliminary data sheet Rev. 1.01 — 15 November 2007 62 of 68