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NXP Semiconductors LPC2919 user manual Wave soldering, DLPC2917/19, Draft Draft

Models: LPC2917 LPC2919

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MSL: Moisture Sensitivity Level

NXP Semiconductors

DRAFT	D	D		AFT
DRAFT	RAFT	RAFT AFT		AFT
			DR	DR

DLPC2917/19

ARM9 microcontrollerRAFT withDRAFTCANDRAFTand LINDRAFT

Table 32.	SnPb eutectic process (from J-STD-020C)
Package thickness (mm)		Package reflow temperature (°C)
		Volume (mm3)
		< 350		≥ 350
< 2.5	235			220
≥ 2.5	220			220
Table 33.	Lead-free process (from J-STD-020C)

T DRAFT	T
DRA	DRA DR
F	F
DRAFT DRAFT DRAF
DRAFT DRAFT
	DRAFT	D
	DRAFT
	DRA

Package thickness (mm)

< 1.6

Package reflow temperature (°C)

Volume (mm3)

< 350	350 to 2000	> 2000
260	260	260

1.6 to 2.5	260	250	245
> 2.5	250	245	245

Moisture sensitivity precautions, as indicated on the packing, must be respected at all times.

Studies have shown that small packages reach higher temperatures during reflow soldering, see Figure 16.

	maximum peak temperature
temperature	= MSL limit, damage level
temperature
	minimum peak temperature
	= minimum soldering temperature
	peak
	temperature
	time
	001aac844

MSL: Moisture Sensitivity Level

Fig 16. Temperature profiles for large and small components

For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description”.

14.3.2Wave soldering

Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems.

LPC2917_19_1

© NXP B.V. 2007. All rights reserved.

Preliminary data sheet

Rev. 1.01 — 15 November 2007

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NXP Semiconductors LPC2919 user manual Wave soldering, DLPC2917/19, Draft Draft, MSL Moisture Sensitivity Level

Contents

1. Introduction 2. General descriptionLPC2917/19 DLPC2917/19 T DRAFT3. Features DLPC2917/194. Ordering information DLPC2917/195. Block diagram DRA DRDRAFT DRAFT Preliminary data sheet6. Pinning information 6.2.1 General description6.2.2 LQFP144 pin assignment DLPC2917/19Symbol Function 0 defaultDLPC2917/19 RAFT AFTSymbol Function 0 defaultDLPC2917/19 RAFT AFTDLPC2917/19 LQFP144 pinDRAFT 7.1 Reset, debug, test and power description 7.1.1 Reset and power-up behavior7.1.2 Reset strategy 7. Functional description7.1.3 IEEE 1149.1 interface pins JTAG boundary-scan test 7.1.4 Power supply pins description7.2.1 Clock architecture DLPC2917/19DRAF Preliminary data sheetDLPC2917/19 RAFT AFT7.2.2 Base clock and branch clock relationship DLPC2917/19DRAFT DRAFT DRAF Table 7. Base clock and branch clock overview8. Block description 8.1.1 OverviewDLPC2917/19 8.1.2 Description DLPC2917/198.1.3 Flash memory controller pin description 8.1.4 Flash memory controller clock description8.1.5 Flash layout DLPC2917/198.1.6 Flash bridge wait-states DLPC2917/19DRAFT DRAFT Table 9. Flash sector overview …continued8.2.1 Overview 8.2.2 DescriptionDLPC2917/19 8.2.5 External memory timing diagrams 8.2.3 External static-memory controller pin description8.2.4 External static-memory controller clock description Table 12. External memory controller pinsDRAFT DRAFT DRAFT DRAFT DRAFPreliminary data sheet DLPC2917/19DLPC2917/19 RAFT AFTT DRAFT NXP Semiconductors8.3.2 Chip and feature identification 8.3.1 General subsystem clock description8.3.3 System Control Unit SCU 8.3.4 Event router8.4.1 Peripheral subsystem clock description DLPC2917/198.4.3 Timer 8.4.2.4 Watchdog timer clock description8.4.2.1 Overview 8.4.2.2 Description8.4.3.2 Description8.4.3.3 Pin description8.4.3.4 Timer clock description 8.4.4 UARTs8.4.4.1 Overview 8.4.4.2 Description8.4.5 Serial peripheral interface 8.4.4.4 UART clock description8.4.5.1 Overview 8.4.5.2 Functional description8.4.5.3 Modes of operation 8.4.5.4 SPI pin description8.4.5.5 SPI clock description DLPC2917/198.4.6 General-purpose I/O8.4.6.1 Overview8.5.1 Overview8.5.2 Global acceptance filter 8.5.3 CAN pin description8.6.2 LIN pin description 8.7.1 Overview8.7.2 Description DLPC2917/198.7.2.1 Synchronization and trigger features of the MSCSS DLPC2917/19start ADC conditions is valid DLPC2917/19RAFT AFT T DRAFT8.7.3 MSCSS pin description 8.7.4 MSCSS clock descriptionDLPC2917/19 The MSCSS is clocked from a number of different sources8.7.5 Analog-to-digital converter 8.7.5.1 Overview8.7.5.2 Description DLPC2917/198.7.5.3 ADC pin description DLPC2917/19RAFT AFT T DRAFT8.7.6 PWM 8.7.5.4 ADC clock description8.7.6.1 Overview 8.7.6.2 Description8.7.6.3 Synchronizing the PWM counters Fig 10. PWM block diagramDLPC2917/19 8.7.7 Timers in the MSCSS 8.7.6.4 Master and slave mode8.7.6.5 PWM pin description 8.7.6.6 PWM clock description8.7.7.4 MSCSS timer-clock description 8.8.1 Overview8.8.2 Description 8.7.7.2 Description8.8.3 PCR subsystem clock description 8.8.4 Clock Generation Unit CGUPower, Clock & Reset DLPC2917/198.8.4.2 Description DLPC2917/19RAFT AFT T DRAFTDLPC2917/19 RAFT AFTDRA DR T DRAFTDLPC2917/19 DRAFT DRAFT DRAFLPOSC/crystal Oscillator 8.8.4.3 PLL functional description DLPC2917/19RAFT AFT T DRAFT8.8.4.4 CGU pin description Triple output phasesPower-down control DLPC2917/198.8.5 Reset Generation Unit RGU 8.8.5.1 Overview8.8.5.2 Description DLPC2917/198.8.6 Power Management Unit PMU 8.8.5.3 RGU pin description8.8.6.1 Overview 8.8.6.2 DescriptionDRAFT DRAFT DRAFTDRAF Implemented Switch On/Off8.9 Vectored interrupt controller 8.9.1 Overview8.9.2 Description DRAFT DRAFT9. Limiting values 8.9.3 VIC pin description8.9.4 VIC clock description DLPC2917/1910. Thermal characteristics DRAFTmADRAFT Symbol11. Static characteristics SymbolDLPC2917/19 RAFT AFTDRAFTUnit DRAFTTable 30. Static characteristics …continued Symbol12. Dynamic characteristics Table 30. Static characteristics …continuedSymbol SymbolUnitDRAFT DLPC2917/19DRAFT DRAFT DRAFTTable 31. Dynamic characteristics …continued SymbolJitter Specification DLPC2917/1913. Package outline Preliminary data sheetDLPC2917/19 RAFT AFT14. Soldering 14.1 Introduction14.2 Through-hole mount packages 14.3 Surface mount packages14.3.2 Wave soldering DLPC2917/19DRAFT DRAFT MSL Moisture Sensitivity Level14.3.3 Manual soldering DLPC2917/19DLPC2917/19 Package1Soldering method Dipping15. Abbreviations DLPC2917/19RAFT AFT DRA DR16. References DLPC2917/19RAFT AFT DRA DR17. Revision history DLPC2917/19DRAFT DRAFT DRAF Table 36. Revision history18. Legal information 19. Contact informationDLPC2917/19 For sales office addresses, send an email to salesaddresses@nxp.com20. Contents continuedDLPC2917/19 T DRAFT 9 Limiting values 10 Thermal characteristics11 Static characteristics 12 Dynamic characteristics 19 Contact information 20 Contents