About this document
Introduction
General description
Intended audience
 NXP Semiconductors
ARM968E-S processor
On-chip flash memory system
 Features
On-chip static RAM
General
 Ordering information
Ordering information
Ordering options
Part options
 Block diagram
LPC2917/19 block diagram
 Pin description
Pinning information
Pinning
General description
 Symbol Pin Description Function 0 default
LQFP144 pin assignment …
 TIMER1 MAT0 EXTINT0
TIMER2 MAT2 PWM TRAP1
TIMER2 MAT3 PWM TRAP0
TIMER1 MAT1 EXTINT1
 Symbol
Pin Description
LQFP144 pin
 Reset strategy
Reset, debug, test and power description
Reset and power-up behavior
Reset pin
 Clocking strategy
Ieee 1149.1 interface pins Jtag boundary-scan test
Power supply pins description
Clock architecture
 LPC2917/19 block diagram, overview of clock areas
LPC2917/19
 Base clock Branch clock name Parts of the device clocked by
Base clock and branch clock relationship
Base clock and branch clock overview
This branch clock
 Overview
Block description
Flash memory controller
Base clock
 DRA
Description
 Flash memory controller pin description
Flash memory controller clock description
Flash layout
 Flash bridge wait-states
Flash sector overview …
 32 bit Symbol Description System Address Bit Field
External static memory controller
External memory-bank address bit description
 External static-memory controller pin description
External memory timing diagrams
External memory controller pins
External static-memory controller clock description
 Reading from external memory
Writing to external memory
 Reading/writing external memory
 General subsystem clock description
Chip and feature identification
General subsystem
System Control Unit SCU
 Peripheral subsystem clock description
Symbol Direction Bit position Description Default Polarity
Peripheral subsystem
Event-router pin connections
 Timer
Watchdog timer clock description
Pin description
 3.2 Description
3.3 Pin description
 Uart pins
Timer clock description
Timer pins
UARTs
 Serial peripheral interface
Uart clock description
Functional description
 SPI pin description
SPI pins
Modes of operation
SPI clock description
 6.1 Overview
Gpio pins
General-purpose I/O
Gpio pin description
 LIN
Can pins
Can gateway
Global acceptance filter
 LIN pin description
LIN controller pins
Modulation and sampling control subsystem
LIN0/1 Txdl
 Synchronization and trigger features of the Mscss
Modulation and sampling control subsystem block diagram
 Start ADC conditions is valid
 Mscss pin description
Mscss clock description
 Draft
Analog-to-digital converter
 ADC block diagram
Analog to digital converter pins
ADC pin description
 6 PWM
ADC clock description
 PWM block diagram
Synchronizing the PWM counters
 PWM pins
Timers in the Mscss
Master and slave mode
PWM pin description
 Mscss timer 1 pin
Power, clock and reset control subsystem
Mscss timer-clock description
Pause pin for Mscss timer
 Pcrss block diagram
PCR subsystem clock description
Clock Generation Unit CGU
 CGU base clocks
Number Name Frequency Description MHz
 Block diagram of the CGU
 Structure of the clock generation scheme
 PLL functional description
 PLL block diagram
CGU pins
CGU pin description
 Reset Generation Unit RGU
Reset output configuration
 Power Management Unit PMU
RGU pins
RGU pin description
 DRA
 Vectored interrupt controller
PMU pin description
 Limiting values
VIC pin description
VIC clock description
 Thermal characteristics
 Symbol Parameter Conditions Min Typ Max
Static characteristics
Static characteristics
Input pins and I/O pins configured as input
 INL
Analog-to-digital converter supply
VDDA5V FSR
LSB
 Dynamic characteristics
Dynamic characteristics
Power-up reset
Symbol Parameter Conditions Min Typ Max Unit
 UnitDRAFT
 Jitter Specification
Can TXD pin Cycle-to-cycle jitter Peak-to-peak value
 Package outline
Package outline SOT486-1 LQFP144
 Through-hole mount packages
Soldering
Introduction
Surface mount packages
 Wave soldering
Volume mm3 350 235 220 Lead-free process from J-STD-020C
Temperature profiles for large and small components
SnPb eutectic process from J-STD-020C Package thickness mm
 CPGA, Hcpga
Package related soldering information
Mounting Package1 Soldering method Wave Reflow2 Dipping
DBS, DIP, HDIP, RDBS, SDIP, SIL
 Mounting
 Abbreviations
Abbreviations list
Abbreviation Description
 References
 Document ID Release date Data sheet status
Revision history
Revision history
 Legal information
Contact information
 Contents
 Contact information Contents
Soldering
Package outline