NXP Semiconductors
DRAFT | D | D |
| AFT |
RAFT | RAFT AFT | |||
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| DR | DR |
DLPC2917/19
ARM9 microcontrollerRAFT withDRAFTCANDRAFTand LINDRAFT
| T | DRAFT |
| T |
| |
| DRA |
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| DRA | DR | |
| F |
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| F | DRAF |
Highly configurable system Power Management Unit (PMU), | DRAFT | DRAFT | ||||
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clock control of individual modules |
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| DRAFT |
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| DRAFT |
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allows minimization of system operating power consumption in any configuration |
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Standard ARM test and debug interface with |
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| DRAFT | D | ||
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Dual power supply: |
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| DRA |
CPU operating voltage: 1.8 V ± 5% |
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I/O operating voltage: 2.7 V to 3.6 V; inputs tolerant up to 5.5 V
−40 °C to 85 °C ambient operating temperature range
4. Ordering information
Table 1. Ordering information
Type number
Package
Name | Description |
Version
LPC2917FBD144 | LQFP144 | plastic low profile quad flat package; 144 leads; body 20 ⋅ 20 ⋅ 1.4 mm, pin | |
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| pitch 0.5 mm |
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LPC2919FBD144 | LQFP144 | plastic low profile quad flat package; 144 leads; body 20 ⋅ 20 ⋅ 1.4 mm, pin | |
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| pitch 0.5 mm |
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4.1 Ordering options
Table 2. Part options
Type number | Flash memory | RAM (kB) | SMC | LIN 2.0 | Package |
| (kB) |
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LPC2917FBD144 | 512 | 80 (incl TCMs) | 2 | LQFP144 | |
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LPC2919FBD144 | 768 | 80 (incl TCMs) | 2 | LQFP144 | |
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LPC2917_19_1 | © NXP B.V. 2007. All rights reserved. |
Preliminary data sheet | Rev. 1.01 — 15 November 2007 | 4 of 68 |