Intended audience
Introduction
General description
About this document
On-chip flash memory system
NXP Semiconductors
ARM968E-S processor
General
Features
On-chip static RAM
Part options
Ordering information
Ordering options
Ordering information
LPC2917/19 block diagram
Block diagram
General description
Pinning information
Pinning
Pin description
LQFP144 pin assignment …
Symbol Pin Description Function 0 default
TIMER1 MAT1 EXTINT1
TIMER2 MAT2 PWM TRAP1
TIMER2 MAT3 PWM TRAP0
TIMER1 MAT0 EXTINT0
LQFP144 pin
Symbol
Pin Description
Reset pin
Reset, debug, test and power description
Reset and power-up behavior
Reset strategy
Clock architecture
Ieee 1149.1 interface pins Jtag boundary-scan test
Power supply pins description
Clocking strategy
LPC2917/19
LPC2917/19 block diagram, overview of clock areas
This branch clock
Base clock and branch clock relationship
Base clock and branch clock overview
Base clock Branch clock name Parts of the device clocked by
Base clock
Block description
Flash memory controller
Overview
Description
DRA
Flash layout
Flash memory controller pin description
Flash memory controller clock description
Flash sector overview …
Flash bridge wait-states
External memory-bank address bit description
32 bit Symbol Description System Address Bit Field
External static memory controller
External static-memory controller clock description
External memory timing diagrams
External memory controller pins
External static-memory controller pin description
Writing to external memory
Reading from external memory
Reading/writing external memory
System Control Unit SCU
Chip and feature identification
General subsystem
General subsystem clock description
Event-router pin connections
Symbol Direction Bit position Description Default Polarity
Peripheral subsystem
Peripheral subsystem clock description
Pin description
Timer
Watchdog timer clock description
3.3 Pin description
3.2 Description
UARTs
Timer clock description
Timer pins
Uart pins
Functional description
Serial peripheral interface
Uart clock description
SPI clock description
SPI pins
Modes of operation
SPI pin description
Gpio pin description
Gpio pins
General-purpose I/O
6.1 Overview
Global acceptance filter
Can pins
Can gateway
LIN
LIN0/1 Txdl
LIN controller pins
Modulation and sampling control subsystem
LIN pin description
Modulation and sampling control subsystem block diagram
Synchronization and trigger features of the Mscss
Start ADC conditions is valid
Mscss clock description
Mscss pin description
Analog-to-digital converter
Draft
ADC pin description
ADC block diagram
Analog to digital converter pins
ADC clock description
6 PWM
Synchronizing the PWM counters
PWM block diagram
PWM pin description
Timers in the Mscss
Master and slave mode
PWM pins
Pause pin for Mscss timer
Power, clock and reset control subsystem
Mscss timer-clock description
Mscss timer 1 pin
Clock Generation Unit CGU
Pcrss block diagram
PCR subsystem clock description
Number Name Frequency Description MHz
CGU base clocks
Block diagram of the CGU
Structure of the clock generation scheme
PLL functional description
CGU pin description
PLL block diagram
CGU pins
Reset output configuration
Reset Generation Unit RGU
RGU pin description
Power Management Unit PMU
RGU pins
DRA
PMU pin description
Vectored interrupt controller
VIC clock description
Limiting values
VIC pin description
Thermal characteristics
Input pins and I/O pins configured as input
Static characteristics
Static characteristics
Symbol Parameter Conditions Min Typ Max
LSB
Analog-to-digital converter supply
VDDA5V FSR
INL
Symbol Parameter Conditions Min Typ Max Unit
Dynamic characteristics
Power-up reset
Dynamic characteristics
UnitDRAFT
Can TXD pin Cycle-to-cycle jitter Peak-to-peak value
Jitter Specification
Package outline SOT486-1 LQFP144
Package outline
Surface mount packages
Soldering
Introduction
Through-hole mount packages
SnPb eutectic process from J-STD-020C Package thickness mm
Volume mm3 350 235 220 Lead-free process from J-STD-020C
Temperature profiles for large and small components
Wave soldering
DBS, DIP, HDIP, RDBS, SDIP, SIL
Package related soldering information
Mounting Package1 Soldering method Wave Reflow2 Dipping
CPGA, Hcpga
Mounting
Abbreviation Description
Abbreviations
Abbreviations list
References
Revision history
Document ID Release date Data sheet status
Revision history
Contact information
Legal information
Contents
Package outline
Contact information Contents
Soldering