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Intel IXP45X, IXP46X manual High-Speed,Serial Interface, Transmit frame

Models: IXP45X IXP46X

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General Hardware Design Considerations—Intel®IXP45X and Intel® IXP46X Product Line of Network Processors

Table 18.		High-Speed, Serial Interface 1

			Input	Pull
	Name		Input	Up	Recommendations
	Name		Output	Up	Recommendations
			Output	Down

					Transmit frame.
HSS_TXFRAME1			I/O	Yes	When this interface/signal is enabled and is not being used in a system design, the
					interface/signal should be pulled high with a 10-KΩresistor.

					Transmit data out. Open Drain output.
HSS_TXDATA1			OD	Yes	When this interface/signal is enabled and is either used or not used in a system design,
					the interface/signal should be pulled high with a 10-KΩresistor to VCCP.
					Transmit clock.
HSS_TXCLK1			I/O	Yes	When this interface/signal is enabled and is not being used in a system design, the
					interface/signal should be pulled high with a 10-KΩresistor.

					Receive frame.
HSS_RXFRAME1			I/O	Yes	When this interface/signal is enabled and is not being used in a system design, the
					interface/signal should be pulled high with a 10-KΩresistor.

					Receive data input.
HSS_RXDATA1			I	Yes	When this interface/signal is enabled and is not being used in a system design, the
					interface/signal should be pulled high with a 10-KΩresistor.

					Receive clock.
HSS_RXCLK1			I/O	Yes	When this interface/signal is enabled and is not being used in a system design, the
					interface/signal should be pulled high with a 10-KΩresistor.

Notes:
1.	Features disabled/enabled by Soft Fuse must be done during the boot-up sequence. A feature cannot be enabled after
	being disabled without asserting a system reset.
2.	Features disabled by a specific part number, do not require pull-ups or pull-downs. Therefore, all pins can be left
	unconnected.
3.	Features enabled by a specific part number — and required to be Soft Fuse-disabled, as stated in Note 1 — only require
	pull-ups or pull-downs in the clock-input signals.

	Intel® IXP45X and Intel® IXP46X Product Line of Network Processors
February 2007	HDD
Document Number: 305261; Revision: 004	45

Image 45

Intel IXP45X, IXP46X manual High-Speed,Serial Interface, Transmit frame

Contents

Hardware Design Guidelines FebruaryDocument No 305261 Revision February Introduction Contents5.0 General Layout and Routing Guide February6.0 PCI Interface Design Considerations Document Number 305261, RevisionFigures Tables Date Revision HistoryRevision DescriptionFebruary 1.0Introduction 1.1Content Overview1.2Related Documentation 1.3Acronyms and Abbreviations 1.4OverviewList of Acronyms and Abbreviations 32-bitPCI interface Master/Target 33/66 MHz MII/SMII Figure 1. Intel IXP465 Component Block DiagramCryptography Unit1.5Typical Applications 2.0System Architecture 2.1System Architecture Description2.2System Memory Map IntelIXP46X Product JTAGLine of Network ProcessorsSignal Type Definitions 3.1Soft Fusible Features3.0General Hardware Design Considerations TableSoft Fusible Features 3.2.1Signal Interface3.2DDR-266SDRAM Interface DDR SDRAM Interface Pin Description Sheet 1 ofDDR SDRAM Interface Pin Description Sheet 2 of 3.3Expansion Bus 3.2.2DDR SDRAM Memory Interface3.2.3DDR SDRAM Initialization 3.3.1Signal Interface 3.3.2Reset Configuration StrapsExpansion Bus Signal Recommendations Table Boot/Reset Strapping Configuration Sheet 1 ofName FunctionBoot/Reset Strapping Configuration Sheet 2 of 3.3.38-BitDevice Interface3.3.416-BitDevice Interface 3.3.532-BitDevice Interface 16-Bit-WordAccess Byte Access32-Bit-WordAccess 8-BitDevice16-Bit-WordAccess Byte Access32-Bit-WordAccess 8-BitDevice3.3.6Flash Interface Intel FlashFigure 5. Flash Interface Example 16-Bit-WordAccess3.3.7SRAM Interface 3.4UART Interface3.3.8Design Notes Figure 6. Expansion Bus SRAM InterfaceUART Signal Recommendations 3.4.1Signal InterfaceMII/SMII Interface ConnectorFigure 7. UART Interface Example UART Interface3.5.1Signal Interface MII MII NPE A Signal RecommendationsMII NPE B Signal Recommendations Sheet 1 of MII NPE C Signal Recommendations MII NPE B Signal Recommendations Sheet 2 of3.5.2Device Connection, MII Figure 8. MII Interface Example10/100 3.5.3Signal Interface, SMII 3.6GPIO Interface 3.5.4Device Connection, SMIIFigure 9. SMII Interface Example 3.6.1Signal Interface GPIO Signal Recommendations3.6.2Design Notes I2C Signal Recommendations 3.7.1Signal Interface3.7I2C Interface 3.7.2Device ConnectionFigure 10. I2C EEPROM Interface Example 3.8USB InterfaceProduct Line Network ProcessorUSB Host/Device Signal Recommendations 3.8.1Signal InterfaceFigure 11. USB Host Down Stream Interface Example 3.8.2Device ConnectionHost DeviceFigure 12. USB Device Interface Example 3.9UTOPIA Level 2 InterfaceDevice Host3.9.1Signal Interface UTOPIA Signal Recommendations3.9.2Device Connection Figure 13. UTOPIA Interface Example 3.10HSS InterfaceAnalog Front ATM Layer DeviceHigh-Speed,Serial Interface 3.10.1Signal InterfaceTransmit frame High-Speed,Serial Interface3.11SSP Interface 3.10.2Device ConnectionFigure 14. HSS Interface Example 3.11.2Device Connection 3.11.1Signal InterfaceSynchronous Serial Peripheral Port Interface SPI Flash3.12.1Signal Interface 3.12PCI InterfacePCI Controller Sheet 1 of PCI Controller Sheet 2 of 3.12.2PCI Interface Block DiagramFigure 16. PCI Interface 3.12.3Supporting 5 V PCI InterfaceCompact PCI Bus cPCI J13.3V Logic 3.12.4PCI Option InterfacePCI Device PCI DevicePage 3.12.5Design Notes 3.13JTAG Interface3.14.1Clock Signals 3.13.1Signal InterfaceClock Signals 3.14Input System Clock3.15Power 3.14.3Device ConnectionIntel IXP46X 3.15.6Reset Timing 3.15.5Power SequencePower Interface Sheet 2 of 3.15.1De-CouplingCapacitance RecommendationsDocument Number 305261 Revision FebruaryDocument Number 305261 Revision February4.0General PCB Guide 4.4Component Placement4.1PCB Overview 4.2General Recommendations4.5Stack-UpSelection Figure 19. Component Placement on a PCBInexpensive Medium FrequencyLow-impedancepower distribution Uncontrolled signal trace impedanceHigher cost More weight Poor routing densityFigure 21. 6-LayerStackup Figure 20. 8-LayerStackup5.0General Layout and Routing Guide 5.1Overview5.2General Layout Guidelines Figure 22. Signal Changing Reference Planes 5.2.1General Component SpacingVIAs Figure 24. Poor Design Practice for VIA Placement 25 mils min 25 mils min 25 mils minFlush Via min Potential Bridge min PGA or BGA Package 5.2.2Clock Signal Considerations5.2.3SMII Signal Considerations 5.2.4MII Signal Considerations5.2.5USB Considerations 5.2.7EMI-DesignConsiderations 5.2.6Cross-Talk5.2.8Trace Impedance 5.2.9Power and Ground PlaneFebruary Document Number 305261 RevisionDocument Number 305261 Revision February6.0PCI Interface Design Considerations 6.1Electrical Interface6.2Topology Figure 26. PCI Address/Data Topology 6.3Clock DistributionPCI Slot Table 25. PCI Address/Data Routing GuidelinesPCI Devices 6.3.1Trace Length LimitsClock Driver6.3.3Signal Loading 6.3.2Routing GuidelinesFebruary 7.0DDR-SDRAM DDR Signal Groups7.1Introduction TableProcessors Figure 28. Processor-DDRInterfaceLine of Network DDR SDRAMDocument Number: 305261, Revision: FebruarySupported Memory Configurations Signal VTT Signal TerminationTermination Intel IXP46XFigure 30. VTT Terminating Circuitry 7.1.1Selecting VTT Power SupplyIXP46X DDR SDRAMControl/Command Valid Figure 31. DDR Command and Control Setup and HoldDDR M CLK 7.1.2Signal-TimingAnalysisFigure 32. DDR Data to DQS Read Timing Parameters DataDDR Data to DQS Read Timing Parameters Data Valid Figure 33. DDR-Data-to-DQS-WriteTiming ParametersDDR Data to DQS Write Timing Parameters DataDDR-Clock-to-DQS-WriteTiming Parameters 7.1.3Printed Circuit Board Layer StackupFigure 35. Printed Circuit Board Layer Stackup 7.1.4Printed Circuit Board Controlled ImpedanceFebruary Figure 31 on page -Table 29 on page 7.1.5Timing Relationships—Table 30 on page —Table 31 on page Figure 32 on page -Table 30 on page7.1.6Resistive Compensation Register Rcomp 7.1.7Routing Guidelines7.1.7.1Clock Group Clock Signal Group Routing Guidelines 7.1.7.2Data, Command, and Control Groups7.2.1Clock Group 7.2Simulation ResultsDocument Number: 305261, Revision: FebruaryFebruary 7.2.2Data GroupTL1 Tpd = 175 ps/in February Figure 39. DDR Data Topology Two-Bankx16 DevicesDocument Number: 305261, Revision: FebruaryFebruary Document Number 305261, Revision February7.2.3Control Group Document Number 305261, Revision FebruaryTL1 Tpd = 175 ps/in 7.2.4Command GroupTL2 Tpd = 175 ps/in TL3 Tpd = 175 ps/inDocument Number 305261, Revision FebruaryFebruary Document Number 305261, Revision FebruaryFebruary Figure 49. DDR RCVENIN/RCVENOUT Topology 7.2.5RCVENIN and RCVENOUTFebruary Document Number 305261, Revision FebruaryDocument Number 305261, Revision February