February
Hardware Design Guidelines
Document No 305261 Revision
February
Contents
Introduction
6.0 PCI Interface Design Considerations
February
5.0 General Layout and Routing Guide
Document Number 305261, Revision
Figures
Tables
Revision
Revision History
Date
Description
February
1.1Content Overview
1.0Introduction
1.2Related Documentation
1.4Overview
1.3Acronyms and Abbreviations
List of Acronyms and Abbreviations
32-bitPCI interface Master/Target 33/66 MHz
Cryptography
Figure 1. Intel IXP465 Component Block Diagram
MII/SMII
Unit
1.5Typical Applications
2.1System Architecture Description
2.0System Architecture
2.2System Memory Map
Line of Network
JTAG
IntelIXP46X Product
Processors
3.0General Hardware Design Considerations
3.1Soft Fusible Features
Signal Type Definitions
Table
3.2DDR-266SDRAM Interface
3.2.1Signal Interface
Soft Fusible Features
DDR SDRAM Interface Pin Description Sheet 1 of
DDR SDRAM Interface Pin Description Sheet 2 of
3.2.2DDR SDRAM Memory Interface
3.3Expansion Bus
3.2.3DDR SDRAM Initialization
3.3.2Reset Configuration Straps
3.3.1Signal Interface
Expansion Bus Signal Recommendations
Name
Boot/Reset Strapping Configuration Sheet 1 of
Table
Function
3.3.38-BitDevice Interface
Boot/Reset Strapping Configuration Sheet 2 of
3.3.416-BitDevice Interface
3.3.532-BitDevice Interface
32-Bit-WordAccess
Byte Access
16-Bit-WordAccess
8-BitDevice
32-Bit-WordAccess
Byte Access
16-Bit-WordAccess
8-BitDevice
Figure 5. Flash Interface Example
Intel Flash
3.3.6Flash Interface
16-Bit-WordAccess
3.3.8Design Notes
3.4UART Interface
3.3.7SRAM Interface
Figure 6. Expansion Bus SRAM Interface
3.4.1Signal Interface
UART Signal Recommendations
Figure 7. UART Interface Example
Connector
MII/SMII Interface
UART Interface
MII NPE A Signal Recommendations
3.5.1Signal Interface MII
MII NPE B Signal Recommendations Sheet 1 of
MII NPE B Signal Recommendations Sheet 2 of
MII NPE C Signal Recommendations
Figure 8. MII Interface Example
3.5.2Device Connection, MII
10/100
3.5.3Signal Interface, SMII
3.5.4Device Connection, SMII
3.6GPIO Interface
Figure 9. SMII Interface Example
GPIO Signal Recommendations
3.6.1Signal Interface
3.6.2Design Notes
3.7I2C Interface
3.7.1Signal Interface
I2C Signal Recommendations
3.7.2Device Connection
Product Line
3.8USB Interface
Figure 10. I2C EEPROM Interface Example
Network Processor
3.8.1Signal Interface
USB Host/Device Signal Recommendations
Host
3.8.2Device Connection
Figure 11. USB Host Down Stream Interface Example
Device
Device
3.9UTOPIA Level 2 Interface
Figure 12. USB Device Interface Example
Host
UTOPIA Signal Recommendations
3.9.1Signal Interface
3.9.2Device Connection
Analog Front
3.10HSS Interface
Figure 13. UTOPIA Interface Example
ATM Layer Device
3.10.1Signal Interface
High-Speed,Serial Interface
High-Speed,Serial Interface
Transmit frame
3.10.2Device Connection
3.11SSP Interface
Figure 14. HSS Interface Example
Synchronous Serial Peripheral Port Interface
3.11.1Signal Interface
3.11.2Device Connection
SPI Flash
3.12PCI Interface
3.12.1Signal Interface
PCI Controller Sheet 1 of
3.12.2PCI Interface Block Diagram
PCI Controller Sheet 2 of
Compact PCI Bus
3.12.3Supporting 5 V PCI Interface
Figure 16. PCI Interface
cPCI J1
PCI Device
3.12.4PCI Option Interface
3.3V Logic
PCI Device
Page
3.13JTAG Interface
3.12.5Design Notes
Clock Signals
3.13.1Signal Interface
3.14.1Clock Signals
3.14Input System Clock
3.14.3Device Connection
3.15Power
Intel IXP46X
Power Interface Sheet 2 of
3.15.5Power Sequence
3.15.6Reset Timing
3.15.1De-CouplingCapacitance Recommendations
February
Document Number 305261 Revision
February
Document Number 305261 Revision
4.1PCB Overview
4.4Component Placement
4.0General PCB Guide
4.2General Recommendations
Inexpensive
Figure 19. Component Placement on a PCB
4.5Stack-UpSelection
Medium Frequency
Higher cost More weight
Uncontrolled signal trace impedance
Low-impedancepower distribution
Poor routing density
Figure 20. 8-LayerStackup
Figure 21. 6-LayerStackup
5.1Overview
5.0General Layout and Routing Guide
5.2General Layout Guidelines
5.2.1General Component Spacing
Figure 22. Signal Changing Reference Planes
VIAs
25 mils min 25 mils min 25 mils min
Figure 24. Poor Design Practice for VIA Placement
Flush Via min Potential Bridge min
5.2.2Clock Signal Considerations
PGA or BGA Package
5.2.4MII Signal Considerations
5.2.3SMII Signal Considerations
5.2.5USB Considerations
5.2.6Cross-Talk
5.2.7EMI-DesignConsiderations
February
5.2.9Power and Ground Plane
5.2.8Trace Impedance
Document Number 305261 Revision
February
Document Number 305261 Revision
6.1Electrical Interface
6.0PCI Interface Design Considerations
6.2Topology
PCI Slot
6.3Clock Distribution
Figure 26. PCI Address/Data Topology
Table 25. PCI Address/Data Routing Guidelines
Clock
6.3.1Trace Length Limits
PCI Devices
Driver
6.3.2Routing Guidelines
6.3.3Signal Loading
February
7.1Introduction
DDR Signal Groups
7.0DDR-SDRAM
Table
Line of Network
Figure 28. Processor-DDRInterface
Processors
DDR SDRAM
February
Document Number: 305261, Revision:
Supported Memory Configurations
Termination
VTT Signal Termination
Signal
Intel IXP46X
IXP46X
7.1.1Selecting VTT Power Supply
Figure 30. VTT Terminating Circuitry
DDR SDRAM
DDR M CLK
Figure 31. DDR Command and Control Setup and Hold
Control/Command Valid
7.1.2Signal-TimingAnalysis
Data
Figure 32. DDR Data to DQS Read Timing Parameters
DDR Data to DQS Read Timing Parameters
DDR Data to DQS Write Timing Parameters
Figure 33. DDR-Data-to-DQS-WriteTiming Parameters
Data Valid
Data
7.1.3Printed Circuit Board Layer Stackup
DDR-Clock-to-DQS-WriteTiming Parameters
7.1.4Printed Circuit Board Controlled Impedance
Figure 35. Printed Circuit Board Layer Stackup
February
—Table 30 on page —Table 31 on page
7.1.5Timing Relationships
Figure 31 on page -Table 29 on page
Figure 32 on page -Table 30 on page
7.1.7Routing Guidelines
7.1.6Resistive Compensation Register Rcomp
7.1.7.1Clock Group
7.1.7.2Data, Command, and Control Groups
Clock Signal Group Routing Guidelines
7.2Simulation Results
7.2.1Clock Group
February
Document Number: 305261, Revision:
7.2.2Data Group
February
TL1 Tpd = 175 ps/in
Figure 39. DDR Data Topology Two-Bankx16 Devices
February
February
Document Number: 305261, Revision:
February
February
Document Number 305261, Revision
7.2.3Control Group
February
Document Number 305261, Revision
TL2 Tpd = 175 ps/in
7.2.4Command Group
TL1 Tpd = 175 ps/in
TL3 Tpd = 175 ps/in
February
Document Number 305261, Revision
February
February
Document Number 305261, Revision
February
7.2.5RCVENIN and RCVENOUT
Figure 49. DDR RCVENIN/RCVENOUT Topology
February
February
Document Number 305261, Revision
February
Document Number 305261, Revision
