Signal Interface MII | Intel IXP45X, IXP46X instruction

General Hardware Design Considerations—Intel®IXP45X and Intel® IXP46X Product Line of Network Processors

3.5.1Signal Interface MII

Table 8.			MII NPE A Signal Recommendations

				Input/	Pull
		Name		Input/	Up	Recommendations
		Name		Output	Up	Recommendations
				Output	Down

						Transmit Clock.
	ETHA_TXCLK			I	Yes	When this interface/signal is enabled and is not being used in a system design, the
						interface/signal should be pulled high with a 10-KΩresistor.

	ETHA_TXDATA[3:0]			O	No	Transmit Data.

	ETHA_TXEN			O	No	Transmit Enable.

						Receive Clock.
	ETHA_RXCLK			I	Yes	When this interface/signal is enabled and is not being used in a system design, the
						interface/signal should be pulled high with a 10-KΩresistor.

						Receive Data.
	ETHA_RXDATA[3:0]			I	Yes	When this interface/signal is enabled and is not being used in a system design, the
						interface/signal should be pulled high with a 10-KΩresistor.

						Receive Data Valid.
	ETHA_RXDV			I	Yes	When this interface/signal is enabled and is not being used in a system design, the
						interface/signal should be pulled high with a 10-KΩresistor.

						Collision Detect.
	ETHA_COL			I	Yes	If operating in a full duplex mode and there is no requirement to use the Collision
						Detect signal, then the pin must be pulled low with a 10-KΩresistor.

						Carrier Sense.
	ETHA_CRS			I	Yes	When this interface/signal is enabled and is not being used in a system design, the
						interface/signal should be pulled high with a 10-KΩresistor.

	Notes:
	1.	Features disabled/enabled by Soft Fuse must be done during the boot-up sequence. A feature cannot be enabled after
		being disabled without asserting a system reset.
	2.	Features disabled by a specific part number, do not require pull-ups or pull-downs. Therefore, all pins can be left
		unconnected.
	3.	Features enabled by a specific part number — and required to be Soft Fuse-disabled, as stated in Note 1 — only require
		pull-ups or pull-downs in the clock-input signals.

Table 9.		MII NPE B Signal Recommendations (Sheet 1 of 2)

			Input/	Pull
	Name		Input/	Up/	Recommendations
	Name		Output	Up/	Recommendations
			Output	Down

					Transmit Clock.
	ETHB_TXCLK		I	Yes	When this interface/signal is enabled and is not being used in a system design, the
					interface/signal should be pulled high with a 10-KΩresistor.

	ETHB_TXDATA[3:0]		O	No	Transmit Data.

	ETHB_TXEN		O	No	Transmit Enable.

					Receive Clock.
	ETHB_RXCLK		I	Yes	When this interface/signal is enabled and is not being used in a system design, the
					interface/signal should be pulled high with a 10-KΩresistor.

					Receive Data.
	ETHB_RXDATA[3:0]		I	Yes	When this interface/signal is enabled and is not being used in a system design, the
					interface/signal should be pulled high with a 10-KΩresistor.

					Receive Data Valid.
	ETHB_RXDV		I	Yes	When this interface/signal is enabled and is not being used in a system design, the
					interface/signal should be pulled high with a 10-KΩresistor.

	Intel® IXP45X and Intel® IXP46X Product Line of Network Processors
February 2007	HDD
Document Number: 305261; Revision: 004	31

Image 31

Intel IXP45X, IXP46X manual Signal Interface MII, MII NPE a Signal Recommendations, MII NPE B Signal Recommendations Sheet 1

Contents

February Hardware Design Guidelines HDD Contents 12.1 Figures Tables Control Group Topology Transmission Line Characteristics Date Revision Description Revision History HDD Chapter Name Description Content Overview Title Document # Related Documentation List of Acronyms and Abbreviations OverviewTerm Explanation Smii Intel IXP465 Component Block Diagram Dslam Typical Applications System Memory Map System Architecture Description Intel IXP465 Example System Block Diagram Signal Type Definitions Soft Fusible FeaturesSymbol Description DDR Sdram Interface Pin Description Sheet 1 Signal InterfaceSoft Fusible Features DDR-266 Sdram Interface Ddrircomp DDR Sdram Interface Pin Description Sheet 2Ddriwen Ddrircveninn DDR Sdram Memory Interface Expansion BusDDR Sdram Initialization Expansion Bus Signal Recommendations Reset Configuration StrapsInput Pull Name Recommendations Output Down Name Function Description Boot/Reset Strapping Configuration Sheet 1 3 8-Bit Device Interface Boot/Reset Strapping Configuration Sheet 24 16-Bit Device Interface 5 32-Bit Device Interface Bit Device 16/32-Bit Device Interface Byte Enable Flash Interface Example Flash Interface Sram Interface Uart InterfaceDesign Notes Name Input Pull Recommendations Output Down Uart Signal Recommendations Uart Interface Example MII/SMII Interface MII NPE a Signal Recommendations Signal Interface MIIMII NPE B Signal Recommendations Sheet 1 MII NPE C Signal Recommendations MII NPE B Signal Recommendations Sheet 2 Device Connection, MII MAC Management Signal Recommendations NPE A,B,CNPE A,B,C Smii Signal Recommendations NPE A, B, C Signal Interface, Smii Device Connection, Smii Gpio Interface Gpio Signal Recommendations I2C Interface I2C Signal RecommendationsDevice Connection I2C Eeprom Interface Example USB Interface USB Host/Device Signal Recommendations Host Device USB Device Interface Example Utopia Level 2 Interface Utopia Signal Recommendations Utopia Interface Example HSS Interface HSSRXDATA0 High-Speed, Serial InterfaceHSSTXDATA0 HSSTXCLK0 HSSRXCLK1 HSSTXDATA1HSSTXCLK1 HSSRXDATA1 HSS Interface Example SSP Interface Synchronous Serial Peripheral Port Interface PCI Controller Sheet 1 PCI InterfaceInput Pull Name Outpu Recommendations Down PCI Controller Sheet 2 PCI Interface Block Diagram PCI Interface Supporting 5 V PCI Interface PCI Host/Option Interface Pin Description Sheet 1 PCI Option Interface PCI Host/Option Interface Pin Description Sheet 2 PCI Host/Option Interface Pin Description Sheet 3 Jtag Interface Clock Oscillator Clock SignalsClock Signals Input System Clock Power Interface Sheet 1 PowerName Nominal Description Voltage VCC De-Coupling Power SequenceReset Timing De-Coupling Capacitance Recommendations HDD HDD Component Selection Component PlacementPCB Overview General Recommendations Stack-Up Selection Component Placement on a PCB Controlled-impedance traces Low-impedance power distribution Layer Stackup General Layout Guidelines General Layout and Routing Guide General Component Spacing Signal Changing Reference Planes Good Design Practice for VIA Hole Placement Pad-to-Pad Clearance of Passive Components to a PGA or BGA Clock Signal Considerations MII Signal Considerations Smii Signal ConsiderationsUSB Considerations EMI-Design Considerations Cross-Talk Trace Impedance Power and Ground Plane HDD @66 MHz Electrical InterfaceTopology @33 MHz PCI Address/Data Routing Guidelines Clock DistributionParameter Routing Guidelines PCI Clock Routing Guidelines Trace Length Limits Routing Guidelines Signal Loading DDRIDQS40 DDR Signal GroupsGroup Signal Name Description No of Single Ended Signals Introduction DDR Sdram HDD Clock Banks Memory Size Supported Memory Configurations VTT VTT Terminating Circuitry Selecting VTT Power Supply Symbol Parameter Min Max Units DDR Command and Control Setup and Hold ValuesDdrmclk DDR Data to DQS Read Timing Parameters DDR Data to DQS Write Timing Parameters DDR-Data-to-DQS-Write Timing Parameters Printed Circuit Board Layer Stackup Printed Circuit Board Layer Stackup Printed Circuit Board Controlled Impedance Printed Circuit Board Controlled Impedance Timing Relationships Signal Group Absolute Minimum Absolute Maximum LengthTiming Relationships Clock Group Resistive Compensation Register Rcomp DDRIBA10, DDRIRASN, DDRICASN, Ddriwen Clock Signal Group Routing GuidelinesData, Command, and Control Group Routing Guidelines Parameter Definition Transmission Line Length Clock Group Topology Transmission Line CharacteristicsSimulation Results Clock Group DDR Clock Topology Two-Bank x16 Devices DDR Clock Simulation Results Two-Bank x16 Devices Data Group Data Group Topology Transmission Line Characteristics DDR Data Topology Two-Bank x16 Devices DDR Data Write Simulation Results Two-Bank x16 Devices HDD HDD Control Group Control Group Topology Transmission Line Characteristics DDR RAS Simulation Results Two-Bank x16 Devices Command Group Topology Transmission Line Characteristics Command Group DDR Command MA3 Topology Two-Bank x16 Devices DDR Address Simulation Results Two-Bank x16 Devices DDR Command RAS Topology Two-Bank x16 Devices 104 DDR RCVENIN/RCVENOUT Topology Rcvenin and Rcvenout DDR RCVENIN/RCVENOUT Simulation Results Rseries = 0 Ω DDR RCVENIN/RCVENOUT Simulation Results Rseries = 60 Ω 108