Xilinx DS610 manual DC Electrical Characteristics, Absolute Maximum Ratings

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Spartan-3A DSP FPGA Family: DC and Switching Characteristics

DS610-3 (v2.0) July 16, 2007 Product Specification

DC Electrical Characteristics

In this section, specifications may be designated as Advance, Preliminary, or Production. These terms are defined as follows:

Advance: Initial estimates are based on simulation, early characterization, and/or extrapolation from the characteristics of other families. Values are subject to change. Use as estimates, not for production.

Preliminary: Based on characterization. Further changes are not expected.

Production: These specifications are approved once the silicon has been characterized over numerous production lots. Parameter values are considered stable with no future changes expected.

Table 3: Absolute Maximum Ratings

All parameter limits are representative of worst-case supply voltage and junction temperature conditions. Unless otherwise noted, the published parameter values apply to all Spartan™-3A DSP devices. AC and DC characteristics are specified using the same numbers for both commercial and industrial grades.

Absolute Maximum Ratings

Stresses beyond those listed under Table 3: Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only; functional operation of the device at these or any other conditions beyond those listed under the Recommended Operating Conditions is not implied. Exposure to absolute maximum conditions for extended periods of time adversely affects device reliability.

Symbol	Description	Conditions	Min	Max	Units
VCCINT	Internal supply voltage		–0.5	1.32	V
VCCAUX	Auxiliary supply voltage		–0.5	3.75	V
VCCO	Output driver supply voltage		–0.5	3.75	V
VREF	Input reference voltage		–0.5	VCCO+0.5	V
VIN	Voltage applied to all User I/O pins and	Driver in a high-impedance state	–0.95	4.6	V
	Dual-Purpose pins
	Voltage applied to all Dedicated pins		–0.5	4.6	V
VESD	Electrostatic Discharge Voltage	Human body model	–	±2000	V
		Charged device model	–	±500	V
		Machine model	–	±200	V
TJ	Junction temperature		–	125	°C
TSTG	Storage temperature		–65	150	°C

Notes:

1.For soldering guidelines, see UG112: Device Packaging and Thermal Characteristics and XAPP427: Implementation and Solder Reflow Guidelines for Pb-Free Packages.

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Product Specification