Xilinx DS610 Package Pins by Type, Pinout Descriptions Types of Pins on Spartan-3A DSP FPGAs

Models: DS610

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Pinout Descriptions

Table 56: Types of Pins on Spartan-3A DSP FPGAs (Continued)

R

Type/Color

Description

Pin Name(s) in Type

Code

 

 

GND

Dedicated ground pin. The number of GND pins depends on the package used. All must

GND

be connected.

 

 

 

VCCAUX

Dedicated auxiliary power supply pin. The number of VCCAUX pins depends on the

VCCAUX

package used. All must be connected.

 

 

 

VCCINT

Dedicated internal core logic power supply pin. The number of VCCINT pins depends on

VCCINT

the package used. All must be connected to +1.2V.

 

 

 

 

Along with all the other VCCO pins in the same bank, this pin supplies power to the output

VCCO_#

VCCO

buffers within the I/O bank and sets the input threshold voltage for some I/O standards. All

 

 

must be connected.

 

N.C.

This package pin is not connected in this specific device/package combination but may be

N.C.

connected in larger devices in the same package.

 

 

 

 

 

 

Notes:

1.# = I/O bank number, an integer between 0 and 3.

Package Pins by Type

Each package has three separate voltage supply inputs—VCCINT, VCCAUX, and VCCO—and a common ground return, GND. The numbers of pins dedicated to these functions vary by package, as shown in Table 57.

Table 57: Power and Ground Supply Pins by Package

Package

Device

VCCINT

VCCAUX

VCCO

GND

CS484

XC3SD1800A

36

24

24

84

 

 

 

 

 

XC3SD3400A

36

24

24

84

 

 

 

 

 

 

 

FG676

XC3SD1800A

23

14

36

77

 

 

 

 

 

XC3SD3400A

36

24

40

100

 

 

 

 

 

 

 

Table 58: Maximum User I/O by Package

Amajority of package pins are user-defined I/O or input pins. However, the numbers and characteristics of these I/O depend on the device type and the package in which it is available, as shown in Table 58. The table shows the maximum number of single-ended I/O pins available, assuming that all I/O-, INPUT-, DUAL-, VREF-, and CLK-type pins are used as general-purpose I/O. AWAKE is counted here as a Dual-Purpose I/O pin. Likewise, the table shows the maximum number of differential pin-pairs available on the package. Finally, the table shows how the total maximum user-I/Os are distributed by pin type, including the number of unconnected—N.C.—pins on the device.

 

 

Maximum

Maximum

Maximum

 

All Possible I/Os by Type

 

Package

Device

User I/Os

 

 

 

 

 

 

Input-

Differential

 

 

 

 

 

 

and

I/O

INPUT

DUAL

VREF(1)

CLK

N.C.

 

 

Only

Pairs

 

 

Input-Only

 

 

 

 

 

 

 

 

CS484

XC3SD1800A

309

60

140

156

41

52

28

32

0

 

 

 

 

 

 

 

 

 

 

XC3SD3400A

309

60

140

156

41

52

28

32

0

 

 

 

 

 

 

 

 

 

 

 

 

FG676

XC3SD1800A

519

110

227

314

82

52

39

32

0

 

 

 

 

 

 

 

 

 

 

XC3SD3400A

469

60

213

314

34

52

37

32

0

 

 

 

 

 

 

 

 

 

 

 

 

Notes:

1.Some VREFs are on INPUT pins. See pinout tables for details.

Electronic versions of the package pinout tables and foot- prints are available for download from the Xilinx website. Using a spreadsheet program, the data can be sorted and reformatted according to any specific needs. Similarly, the ASCII-text file is easily parsed by most scripting programs.

http://www.xilinx.com/bvdocs/publications/s3adsp_pin.zip

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www.xilinx.com

DS610-4 (v2.0) July 16, 2007

 

 

Product Specification

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Xilinx DS610 Package Pins by Type, Pinout Descriptions Types of Pins on Spartan-3A DSP FPGAs, Maximum User I/O by Package