Xilinx DS610 Timing Measurement Methodology, Test Methods for Timing Measurement at I/Os, Inputs

Models: DS610

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R

DC and Switching Characteristics

Timing Measurement Methodology

When measuring timing parameters at the programmable I/Os, different signal standards call for different test conditions. Table 25 lists the conditions to use for each standard.

open connection, and VT is set to zero. The same measurement point (VM) that was used at the Input is also used at the Output.

The method for measuring Input timing is as follows: A signal that swings between a Low logic level of VL and a High logic level of VH is applied to the Input under test. Some standards also require the application of a bias

voltage to the VREF pins of a given bank to properly set the input-switching threshold. The measurement point of the

Input signal (VM) is commonly located halfway between VL and VH.

VT (VREF)

FPGA Output

RT (RREF)

VM (VMEAS)

CL (CREF)

The Output test setup is shown in Figure 8. A termination voltage VT is applied to the termination resistor RT, the other end of which is connected to the Output. For each standard, RT and VT generally take on the standard values recommended for minimizing signal reflections. If the standard does not ordinarily use terminations (for example, LVCMOS, LVTTL), then RT is set to 1MΩ to indicate an

Table 25: Test Methods for Timing Measurement at I/Os

DS312-3_04_102406

Notes:

1.The names shown in parentheses are used in the IBIS file.

Figure 8: Output Test Setup

 

 

 

 

 

 

 

 

 

 

 

Inputs and

Signal Standard

 

 

Inputs

 

 

 

Outputs

Outputs

 

 

 

 

 

 

 

 

 

(IOSTANDARD)

VREF (V)

VL (V)

 

VH (V)

RT (Ω)

 

VT (V)

VM (V)

Single-Ended

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

LVTTL

 

 

-

0

 

3.3

1M

 

0

1.4

 

 

 

 

 

 

 

 

 

 

 

LVCMOS33

 

 

-

0

 

3.3

1M

 

0

1.65

 

 

 

 

 

 

 

 

 

 

 

LVCMOS25

 

 

-

0

 

2.5

1M

 

0

1.25

 

 

 

 

 

 

 

 

 

 

 

LVCMOS18

 

 

-

0

 

1.8

1M

 

0

0.9

 

 

 

 

 

 

 

 

 

 

 

LVCMOS15

 

 

-

0

 

1.5

1M

 

0

0.75

 

 

 

 

 

 

 

 

 

 

 

LVCMOS12

 

 

-

0

 

1.2

1M

 

0

0.6

 

 

 

 

 

 

 

 

 

 

 

PCI33_3

 

Rising

-

Note 3

 

Note 3

25

 

0

0.94

 

 

 

 

 

 

 

 

 

 

 

 

 

Falling

 

 

 

 

25

 

3.3

2.03

 

 

 

 

 

 

 

 

 

 

 

PCI66_3

 

Rising

-

Note 3

 

Note 3

25

 

0

0.94

 

 

 

 

 

 

 

 

 

 

 

 

 

Falling

 

 

 

 

25

 

3.3

2.03

 

 

 

 

 

 

 

 

 

 

 

PCIX

 

Rising

-

Note 3

 

Note 3

25

 

0

0.94

 

 

 

 

 

 

 

 

 

 

 

 

 

Falling

 

 

 

 

25

 

3.3

2.03

 

 

 

 

 

 

 

 

 

 

 

 

HSTL_I

 

 

0.75

VREF – 0.5

 

VREF + 0.5

50

 

0.75

VREF

HSTL_III

 

 

0.9

VREF – 0.5

 

VREF + 0.5

50

 

1.5

VREF

HSTL_I_18

 

 

0.9

VREF – 0.5

 

VREF + 0.5

50

 

0.9

VREF

HSTL_II_18

 

 

0.9

VREF – 0.5

 

VREF + 0.5

25

 

0.9

VREF

HSTL_III_18

 

 

1.1

VREF – 0.5

 

VREF + 0.5

50

 

1.8

VREF

SSTL18_I

 

 

0.9

VREF – 0.5

 

VREF + 0.5

50

 

0.9

VREF

SSTL18_II

 

 

0.9

VREF – 0.5

 

VREF + 0.5

25

 

0.9

VREF

SSTL2_I

 

 

1.25

VREF – 0.75

 

VREF + 0.75

50

 

1.25

VREF

SSTL2_II

 

 

1.25

VREF – 0.75

 

VREF + 0.75

25

 

1.25

VREF

 

 

 

 

 

 

 

 

 

 

 

 

DS610-3 (v2.0) July 16, 2007

 

 

www.xilinx.com

 

 

 

31

Product Specification

 

 

 

 

 

 

 

 

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Xilinx DS610 manual Timing Measurement Methodology, Test Methods for Timing Measurement at I/Os, Inputs, RT Ω Single-Ended