Xilinx DS610 - page 55

DC and Switching Characteristics

DS610-3 (v2.0) July 16, 2007 www.xilinx.com 55

Product Specification

R

Table 54:

Configuration Timing Requirements for Attached Parallel NOR Flash

Symbol Description Requirement Units

TCE

(tELQV)

Parallel NOR Flash PROM chip-select time ns

TOE

(tGLQV)

Parallel NOR Flash PROM output-enable time ns

TACC

(tAVQV)

Parallel NOR Flash PROM read access time ns

TBYTE

(tFLQV, tFHQV)

For x8/x16 PROMs only: BYTE# to output valid time(3) ns

Notes:

1. These requirements are for successful FPGA configuration in BPI mode, where the FPGA generates the CCLK signa l. The

post-configuration timing can be different to support the specific needs of the application load ed into the FPGA.

2. Subtract additional printed circuit board routing delay as required by the application.

3. The initial BYTE# timing can be extended using an external, appropriately sized pull-down resistor on the FPGA’s LDC2 pin. The resis tor

value also depends on whether the FPGA’s PUDC_B pin is High or Low.

T

CE TINITADD

R

≤

T

OE TINITADD

R

≤

T

ACC TCCLKn min

()

TCCO TDCC PC

B

–––≤

T

BYTE TINITADD

R

≤

Contents

Main Module 1: Introduction and Ordering Information Spartan-3 Generation Configuration User Guide www.xilinx.com/spartan3adsp Data Sheet DS610 July 16, 2007 0 0 Product Specification SPARTAN-3A DSP Page Spartan-3A and Spartan-3A DSP FPGA Differences Features Table 1: < B L B Spartan-3A DSP FPGA Family: Introduction and Ordering Information Architectural Overview Configuration I/O Capabilities Introduction and Ordering Information DCM Figure 1: CLBs Table 2: DSP48A Slice Available User I/Os and Differential (Diff) I/O Pairs Package M arking Spartan-3A DSP FPGA Package Marking Example Figure 2: Pb-Free Packaging The 5C and 4I Speed Grade/Temperature Range part combinations may be dual marked as 5C/4I. Page Page XtremeDSP DSP48A for Spartan-3A DSP FPGAs User Guide Spartan-3 Generation FPGA User Guide Spartan-3 Generation Configuration User Guide Functional Description Page DC Electrical Characteristics Absolute Maximum Ratings Table 3: DC and Switching Characteristics Power Supply Specifications Table 4: Table 7: Table 6: Table 5: General DC Characteristics for I/O Pins Table 8: General DC Characteristics of User I/O, Dual-Purpose, and Dedicated Pins I VIN = VCCO VCCAUX = 3.0V to 3.6V 167 346 659 A Quiescent Current Requirements Table 9: Quiescent Supply Current Characteristics Single-Ended I/O Standards Table 10: Recommended Operating Conditions for User I/Os Using Single-Ended Standards Table 11: DC Characteristics of User I/Os Using Single-Ended Standards DS610-3 (v2.0) July 16, 2007 www.xilinx.com 17 Differential I/O Standards IOSTANDARD Attribute Figure 3: Table 12: Differential Input Voltages Figure 4: V VOUTP - VOUTN = Output common mode voltage = 2 18 www.xilinx.com DS610-3 (v2.0) July 16, 2007 Device DNA Data Retention, Read Endurance LVDS, RSDS, MINI_LVDS, and PPDS I/O Standards External Input Termination for LVDS, RSDS, MINI_LVDS, and PPDS I/O Standards Figure 5: BLVDS_25 I/O Standard Switching Characteristics Software Version Requirements Table 16: I/O Timing Table 17: Pin-to-Pin Clock-to-Output Times for the IOB Output Path Table 18: Pin-to-Pin Setup and Hold Times for the IOB Input Path (System Synchronous) Table 19: Setup and Hold Times for the IOB Input Path Table 20: Propagation Times for the IOB Input Path Table 21: Table 22: Timing for the IOB Output Path Table 23: Set/Reset Times Timing for the IOB Three-State Path Page Page Page Timing Measurement Methodology Figure 8: Table 25: The capacitive load (CL) is connected between the output and GND. Test Methods for Timing Measurement at I/Os Table 25: Using IBIS Models to Simulate Load Conditions in Application Simultaneously Switching Output Guidelines Table 26: Page Page Configurable Logic Block (CLB) Timing Table 28: CLB (SLICEM) Timing Set/Reset Pulse Width Clock Buffer/Multiplexer Switching Characteristics Table 29: Table 31: Table 30: CLB Distributed RAM Switching Characteristics Block RAM Timing Table 32: Block RAM Timing Clock Frequency DSP48A Timing XtremeDSP DSP48A for Spartan-3A DSP FPGA User Guide Table 33: To reference the DSP48A block diagram, see the (UG431). Table 34: Clock to Out, Propagation Delays, and Maximum Frequency for the DSP48A Clock to Out from Output Register Clock to Output Pin Clock to Out from Pipeline Register Clock to Output Pins Clock to Out from Input Register Clock to Output Pins Digital Clock Manager (DCM) Timing Delay-Locked Loop (DLL) Table 35: Table 36: 42 www.xilinx.com DS610-3 (v2.0) July 16, 2007 Switching Characteristics for the DLL Notes: DS610-3 (v2.0) July 16, 2007 www.xilinx.com 43 Digital Frequency Synthesizer (DFS) Symbol Description Table 38: Table 37: Recommended Operating Conditions for the DFS Phase Shifter (PS) Table 39: Table 41: Table 40: Miscellaneous DCM Timing DNA Port Timing Table 42: DNA_PORT Interface Timing Suspend Mode Timing t sw_gts_cycle:512 sw_gts_cycle:1 sw_gwe_cycle:512 Configuration and JTAG Timing General Configuration Power-On/Reconfigure Timing (Open-Drain) (Output) Table 44: Configuration Clock (CCLK) Characteristics ConfigRate (power-on value) Master Mode CCLK Output Period by Table 45: Table 46: ConfigRate Table 48: Table 47: (power-on value) Master Serial and Slave Serial Mode Timing Figure 11: Table 49: Waveforms for Master Serial and Slave Serial Configuration Timing for the Master Serial and Slave Serial Configuration Modes Slave Parallel Mode Timing Figure 12: Table 50: Waveforms for Slave Parallel Configuration Timing for the Slave Parallel Configuration Mode Serial Peripheral Interface (SPI) Configuration Timing Figure 13: Table 51: Waveforms for Serial Peripheral Interface (SPI) Configuration Timing for Serial Peripheral Interface (SPI) Configuration Mode Table 52: Configuration Timing Requirements for Attached SPI Serial Flash --------------------------------- f TVTMCCLn TDCC Byte Peripheral Interface (BPI) Configuration Timing Figure 14: Table 53: Waveforms for Byte-wide Peripheral Interface (BPI) Configuration Timing for Byte-wide Peripheral Interface (BPI) Configuration Mode Page IEEE 1149.1/1553 JTAG Test Access Port Timing JTAG Waveforms Table 55: Figure 15: TCK The following table shows the revision history for this document. Page Packaging Pin Types Table 56: Pinout Descriptions Package Pins by Type Table 56: Table 58: Table 57: Package Thermal Characteristics Table 59: CS484: 484-Ball Chip-Scale Ball Grid Array Spartan-3A DSP CS484 Pinout . Pinout Table Spartan-3A DSP CS484 Pinout Page Page Page Page Page User I/Os by Bank Table 61: Table 62: Footprint Migration Differences DS610-4 (v2.0) July 16, 2007 www.xilinx.com 69 CS484 Footprint Bank 2 B Bank 3 M Right Half of CS484 Package (top view) 12 13 14 15 16 17 18 19 20 21 22 Bank 2 C D FG676: 676-Ball Fine-Pitch Ball Grid Array list of differences and migration advice, see the "Footprint Migration Differences" section. XC3SD1800A FPGA Pinout Table Page Page Page Page Spartan-3A DSP FG676 Pinout for XC3SD1800A FPGA Bank XC3SD1800A Pin Name FG676 Spartan-3A DSP FG676 Pinout for XC3SD1800A FPGA Bank XC3SD1800A Pin Name FG676 Page Page Page User I/Os by Bank Table 64: DS610-4 (v2.0) July 16, 2007 www.xilinx.com 81 FG676 Footprint Bank 2 E D C Right Half of FG676 Package (top view) 14 15 16 17 18 19 20 21 22 23 24 25 26 U B C XC3SD3400A FPGA Pinout Table Spartan-3A DSP FG676 Pinout for XC3SD3400A FPGA Page Page Page Page Page Page Page Bank XC3SD3400A Pin Name FG676 User I/Os by Bank Table 66: DS610-4 (v2.0) July 16, 2007 www.xilinx.com 93 FG676 Footprint F A R P Right Half of FG676 Package (top view) 14 15 16 17 18 19 20 21 22 23 24 25 26 U H J Footprint Migration Differences Table 67: FG676 Footprint Migration Differences Migration Recommendations FG676 Footprint Migration Differences Table 67: The following table shows the revision history for this document. SPARTAN-3A DSP www.xilinx.com/spartan3adsp Date Version Revision