System Memory Interface

Table 2-8. Variable Latency I/O Interface AC Specifications (Sheet 2 of 2)

 

 

 

 

MEMCKLK

 

 

Units

Symbol

Description

 

 

 

 

 

 

 

99.5

118.0

 

132.7

 

147.5

165.9

Notes

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

tvlioDSW

MD(31:0), DQM(3:0) write data setup to

10

8.5

 

7.5

 

6.8

6

ns, 1

nPWE asserted

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

tvlioDSWH

MD(31:0), DQM(3:0) write data setup to

20

17

 

15

 

13.6

12

ns, 2

nPWE de-asserted

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

tvlioDHW

MD(31:0), DQM(3:0) hold after nPWE

10

8.5

 

7.5

 

6.8

6

ns, 1

de-asserted

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

tvlioDHR

MD(31:0) read data hold after nOE de-

0

0

 

0

 

0

0

ns

asserted

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

tvlioRDYH

RDY hold after nOE, nPWE de-

0

0

 

0

 

0

0

ns

asserted

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

tvlioNPWE

nPWE, nOE high time between beats of

20

17

 

15

 

13.6

12

ns, 2

write or read data

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

NOTES:

 

 

 

 

 

 

 

 

 

1.This number represents 1 MEMCLK period

2.This number represents 2 MEMCLK periods

2.6.5External Logic for PCMCIA Implementation

The PXA250 applications processor requires external glue logic to complete the PCMCIA socket interface. Figure 2-4, “Expansion Card External Logic for a Two-Socket Configuration” on page 2-

12and Figure 2-5, “Expansion Card External Logic for a One-Socket Configuration” on page 2-13show general solutions for one and two socket configurations. Use GPIO or memory-mapped

external registers to control the PCMCIA interface’s reset, power selection (VCC and VPP), and drive enables. These diagrams show the logical connections necessary to support hot insertion capability. For dual-voltage support, level shifting buffers are required for all the applications processor input signals. Hot insertion capability requires each socket be electrically isolated from the other and from the remainder of the memory system. If one or both of these features are not required, you may eliminate some of the logic shown in these diagrams. The applications processor allows either 1-socket or 2-socket solutions. In the 1-socket solution, only minimal glue logic is required (typically for the data transceivers, address buffers, and level shifting buffers.) To achieve this some of the signals are routed through dual-duty GPIO pins. The nOE of the transceivers is driven through the PSKTSEL pin, which is not needed in the one-socket solution. The DIR pin of the transceiver is driven through the RDnWR pin. A GPIO is used for the three-state signal of the address and nPWE lines. These signals are used for memories other than the card interface and must be three-stated.

Note: For 2.5 V VCCN, 5 V to 2.5 V level shifters are required.

Note: PCMCIA is only implemented on the PXA250 applications processor.

In the 2-socket solution, all pins assume their normal duties and glue logic is necessary for proper operation of the system. The pull-ups shown are included for compliance with PC Card Standard - Volume 2 - Electrical Specification. Remove power from these pull-ups during sleep to avoid unnecessary power consumption. Refer to Table 2-9for the PCMCIA or compact Flash card interface AC specifications.

PXA250 and PXA210 Applications Processors Design Guide

2-11

Page 37
Image 37
Intel PXA250 and PXA210 External Logic for Pcmcia Implementation, Variable Latency I/O Interface AC Specifications Sheet 2

PXA250 and PXA210 specifications

The Intel PXA250 and PXA210 processors, part of the Intel XScale architecture, were introduced in the early 2000s, targeting mobile and embedded applications. They are known for their low power consumption, high performance, and advanced multimedia capabilities, making them suitable for a wide range of devices, including PDAs, smartphones, and other portable computing devices.

The PXA250, which operates at clock speeds ranging from 400 MHz to 624 MHz, features a superscalar architecture that allows it to issue multiple instructions per clock cycle. This enhances the overall performance for demanding applications while maintaining low power usage. It supports a variety of peripheral interfaces, including USB, Ethernet, and various memory types, which contributes to its versatility in different product designs.

One of the key technologies in the PXA250 is the integrated Intel Smart Repeat Technology, which optimizes data processing, thereby reducing the amount of power consumed during operation. This feature is particularly important for battery-powered devices, as it extends the overall battery life, allowing for longer usage times in mobile environments. Additionally, the PXA250 includes a dedicated graphics acceleration unit, which enables enhanced graphics and multimedia performance suited to modern applications at the time.

In contrast, the PXA210 is a more entry-level processor, aimed at cost-sensitive applications. Operating at lower clock speeds, typically around 200 MHz to 400 MHz, it forgoes some of the advanced performance features of the PXA250 while still offering a good balance of performance and power efficiency. The PXA210 is less complex, making it suitable for simpler devices that do not require the extensive capabilities of the PXA250.

Both processors utilize the Intel XScale architecture, which is based on the ARM instruction set. They are built on a 0.13-micron process technology, enabling higher density and lower power consumption compared to their predecessors. With integrated memory controllers and bus interfaces, they facilitate efficient data handling and connectivity options.

In summary, both the Intel PXA250 and PXA210 processors played a crucial role in the evolution of mobile computing by providing powerful processing capabilities with energy efficiency. Their features and technologies enabled device manufacturers to create innovative products that catered to the growing demand for portable devices during that era.