Power and Clocking

8.2Electrical Specifications

Table 8-2provides the Absolute Maximum ratings for the applications processor. These parameters may not be exceeded or the part may be permanently damaged. Operation at Absolute Maximum Ratings is not guaranteed.

Table 8-2. Absolute Maximum Ratings

Symbol

Description

Min

Max

 

 

 

 

TS

Storage Temperature

-40° C

125° C

VSS_O

Offset Voltage between any two VSS pins

-0.3 V

0.3 V

(VSS, VSSQ, VSSN)

VCC_O

Offset Voltage between any of the following pins:

-0.3 V

0.3 V

VCCQ, VCCN

 

 

 

 

 

 

 

VCC_HV

Voltage Applied to High Voltage Supplies

VSS-0.3 V

VSS+4.0 V

(VCCQ, VCCN)

VCC_LV

Voltage Applied to Low Voltage Supplies

VSS-0.3 V

VSS+1.45 V

(VCC, PLL_VCC)

 

 

 

max of

VIP

Voltage Applied to non-Supply pins except XTAL pins

VSS-0.3 V

VCCQ+0.3 V,

 

 

 

VSS+4.0 V

 

 

 

 

 

Voltage Applied to XTAL pins

 

max of

VIP_X

VSS-0.3 V

VCC+0.3 V,

(PXTAL, PEXTAL, TXTAL, TEXTAL)

 

 

 

VSS+1.45 V

 

 

 

 

 

Maximum ESD stress voltage, Human Body Model;

 

 

VESD

Any pin to any supply pin, either polarity, or

 

2000 V

Any pin to all non-supply pins together, either polarity.

 

 

Three stresses maximum.

 

 

 

 

 

 

IEOS

Maximum DC Input Current (Electrical Overstress) for any non-supply pin

 

5 mA

8.3Power Consumption Specifications

Power consumption on any highly integrated device is extremely dependent on the operating voltage, external switching activity, and external loading (shown in Table 8-3, “Power Consumption Specifications” on page 8-3). Because power consumption on the applications processor is optimized, power varies based on which functions are being performed and by the data and frequency requirements of the module.

The maximum power consumption specification is determined by all units running at their maximum: processor speed, voltage, and loading conditions. This method generates a conservative power consumption value; however, power supply and thermal management design requires the highest possible power consumption for robust design.The applications processor’s maximum power consumption is calculated using the following conditions:

All peripheral units operating at maximum frequency and size configuration

All I/O loads maximum (50pF for Memory interface, 100pF for peripherals)

Core operating at worst case power scenario (hit rates adjusted for worst power)

All voltages at maximum of range

8-2

PXA250 and PXA210 Applications Processors Design Guide

Page 70
Image 70
Intel PXA250 and PXA210 manual Electrical Specifications, Power Consumption Specifications, Absolute Maximum Ratings

PXA250 and PXA210 specifications

The Intel PXA250 and PXA210 processors, part of the Intel XScale architecture, were introduced in the early 2000s, targeting mobile and embedded applications. They are known for their low power consumption, high performance, and advanced multimedia capabilities, making them suitable for a wide range of devices, including PDAs, smartphones, and other portable computing devices.

The PXA250, which operates at clock speeds ranging from 400 MHz to 624 MHz, features a superscalar architecture that allows it to issue multiple instructions per clock cycle. This enhances the overall performance for demanding applications while maintaining low power usage. It supports a variety of peripheral interfaces, including USB, Ethernet, and various memory types, which contributes to its versatility in different product designs.

One of the key technologies in the PXA250 is the integrated Intel Smart Repeat Technology, which optimizes data processing, thereby reducing the amount of power consumed during operation. This feature is particularly important for battery-powered devices, as it extends the overall battery life, allowing for longer usage times in mobile environments. Additionally, the PXA250 includes a dedicated graphics acceleration unit, which enables enhanced graphics and multimedia performance suited to modern applications at the time.

In contrast, the PXA210 is a more entry-level processor, aimed at cost-sensitive applications. Operating at lower clock speeds, typically around 200 MHz to 400 MHz, it forgoes some of the advanced performance features of the PXA250 while still offering a good balance of performance and power efficiency. The PXA210 is less complex, making it suitable for simpler devices that do not require the extensive capabilities of the PXA250.

Both processors utilize the Intel XScale architecture, which is based on the ARM instruction set. They are built on a 0.13-micron process technology, enabling higher density and lower power consumption compared to their predecessors. With integrated memory controllers and bus interfaces, they facilitate efficient data handling and connectivity options.

In summary, both the Intel PXA250 and PXA210 processors played a crucial role in the evolution of mobile computing by providing powerful processing capabilities with energy efficiency. Their features and technologies enabled device manufacturers to create innovative products that catered to the growing demand for portable devices during that era.