Intel PXA250 and PXA210 manual SRAM / ROM / Flash / Synchronous Fast Flash Memory Options

Models: PXA250 and PXA210

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Table 2-6. BOOT_SEL Definitions (Sheet 2 of 2)

 

 

 

 

System Memory Interface

Table 2-6. BOOT_SEL Definitions (Sheet 2 of 2)

 

 

 

 

 

 

 

BOOT_SEL

 

 

 

 

 

 

Boot From . . .

 

2

1

0

 

 

 

 

 

 

 

1

0

1

1 16-bit Synchronous Mask ROM (64 Mbits)

 

 

 

 

 

 

1

1

0

2 16-bit Synchronous Mask ROMs = 32-bits (64 Mbits each)

 

 

 

 

 

 

1

1

1

1 16-bit Synchronous Mask ROM (64 Mbits)

 

 

 

 

 

2.6.3SRAM / ROM / Flash / Synchronous Fast Flash Memory Options

Table 2-7contains the AC specification for SRAM / ROM / Flash / Synchronous Fast Flash.

Table 2-7. SRAM / ROM / Flash / Synchronous Fast Flash AC Specifications

 

 

 

 

MEMCKLK

 

 

Units

Symbol

Description

 

 

 

 

 

 

 

99.5

118.0

 

132.7

 

147.5

165.9

Notes

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

SRAM / ROM / Flash / Synchronous Fast Flash (WRITES) (Asynchronous)

 

 

 

 

 

 

 

 

 

 

 

 

 

tromAS

MA(25:0) setup to nOE, nSDCAS (as

10

8.5

 

7.5

 

6.8

6

ns, 1

nADV) asserted

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

tromAH

MA(25:0) hold after nCS, nOE,

10

8.5

 

7.5

 

6.8

6

ns, 1

nSDCAS (as nADV) de-asserted

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

tromASW

MA(25:0) setup to nWE asserted

30

25.5

 

22.5

 

20.4

18

ns, 3

 

 

 

 

 

 

 

 

 

 

tromAHW

MA(25:0) hold after nWE de-asserted

10

8.5

 

7.5

 

6.8

6

ns, 1

 

 

 

 

 

 

 

 

 

 

tromCES

nCS setup to nWE asserted

20

17

 

15

 

13.6

12

ns, 2

 

 

 

 

 

 

 

 

 

 

tromCEH

nCS hold after nWE de-asserted

10

8.5

 

7.5

 

6.8

6

ns, 1

 

 

 

 

 

 

 

 

 

 

tromDS

MD(31:0), DQM(3:0) write data setup to

10

8.5

 

7.5

 

6.8

6

ns, 1

nWE asserted

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

tromDSWH

MD(31:0), DQM(3:0) write data setup to

20

17

 

15

 

13.6

12

ns, 2

nWE de-asserted

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

tromDH

MD(31:0), DQM(3:0) write data hold

10

8.5

 

7.5

 

6.8

6

ns, 1

after nWE de-asserted

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

tromNWE

nWE high time between beats of write

20

17

 

15

 

13.6

12

ns, 2

data

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

NOTES:

 

 

 

 

 

 

 

 

 

1.This number represents 1 MEMCLK period

2.This number represents 2 MEMCLK periods

2.6.4Variable Latency I/O Interface Overview

Both reads and writes for VLIO differ from SRAM in that the PXA250 applications processor samples the data-ready input, RDY. The RDY signal is level sensitive and goes through a two-stage synchronizer on input. When the internal RDY signal is high, the I/O device is ready for data transfer. This means that for a transaction to complete at the minimum assertion time for either nOE or nPWE (RDF+1), the RDY signal must be high two clocks prior to the minimum assertion time for either nOE or nPWE (RDF-1). Data will be latched on the rising edge of memclk once the internal RDY signal is high and the minimum assertion time of RDF+1 has been reached. Once the

PXA250 and PXA210 Applications Processors Design Guide

2-9

Page 35
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Intel PXA250 and PXA210 manual SRAM / ROM / Flash / Synchronous Fast Flash Memory Options, System Memory Interface