Chapter 2 - Hardware Installation

MGC+50 Hardware Installation

Unpacking and Positioning the MGC+50

To unpack and position the MGC+50:

1.When you receive your MGC+50, inspect the equipment for damage and verify that the components match the packing slip. If you did not receive a component or if there is damage to the system, notify Polycom immediately.

Wood Packing Case

Carrying Strap

Lock in Closed Position

Lock in Open Position

Figure 2-12: MGC+50 package

2.Place the MGC+50 unit on a stable flat surface in a location that meets the MGC+50’s environment requirements, which are:

Operating temperature: 10°–40°C (50°–104°F)

Humidity: 15%–90% noncondensing

Altitude: Up to 3,000m (10,000ft)

ESD: +8 kV

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Polycom DOC2238A MGC+50 Hardware Installation, Unpacking and Positioning the MGC+50, To unpack and position the MGC+50