Seiko Instruments MT-17E-003-D instruction manual Gas Suction, Cooling and Baking the STP Pump

STP-H600/H1000 Series Instruction Manual

7 Gas Suction, Cooling and Baking the STP Pump

7.1Gas Suction

WARNING

◇When sucking gases, they may remain in the STP pump. Introduce a purge gas and then exhaust all gasses.

Residual gases in the STP pump may cause an accident when the STP pump is removed.

Confirm the characteristics of gases to be used, referring to the Material Safety Data Sheet (MSDS) you obtain from the gas supplier.

CAUTION

◇Chlorine or fluorine system gases can be used in the chemical specific STP- H600C/H1000C (type C). When you use gases including alkaline metals, but excluding Li, gases including Ga, Hg, In, or Sn, or HBr, contact Seiko Seiki.

◇NEVER use corrosive gases (chlorine, fluorine, or other system gases) in the STP-H600/STP-H1000 pump or other models without anti-corrosion treatment.

◇Cool the STP pump to within the operating pressure range to prevent the STP pump from overheating when sucking gases.

7.1.1How to Introduce a Purge Gas

When sucking reactive or corrosive gases, introduce a purge gas to protect the inside of the STP pump.

1)Connect a needle valve or a similar part to the purge port and introduce a dry N2 gas or other gas to perform a gas purge (See Section 3.3.6, "Connecting the Purge Port").

2)The proper amount of the gas purge is approx. 3.4×10 -2Pa·m3/s (20SCCM). The allowable gas pressure ranges from zero [atmospheric pressure] to 4.9x104Pa [gauge pressure] (zero [atmospheric pressure] to 0.5kgf/cm2 [gauge pressure]).

NOTICE

◇When not using the purge port, always mount the blank flange (attached at delivery).

◇High-pressure at the inlet port may result in a noise. This is no abnormality/error.

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