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HP nPartitions (nPars) manual Server blade environmental specifications

Models: nPartitions (nPars)

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Table 12 Server blade environmental specifications

Parameter	Operating Range	Recommended	Maximum Rate of Change	Non-Operating Range
		Operating Range
Temperature	5°C to 35°C (41°F to	20°C to 25°C (68°F	10°C (50°F) / hr with	-40°C to 60°C (-40°F
	95°F) (up to 5000 feet)	to 77°F) (up to 5000	tape	to 140°F)
		feet)	20°C (68°F) / hr without
			tape
Relative Humidity	15-80% at 35°C (95°F)	40-60% at 35 degrees	30% per hour	90% at 65°C (149°F)
	noncondensing	35°C (95°F)	noncondensing	noncondensing
		noncondensing

98 Troubleshooting

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HP nPartitions (nPars) manual Server blade environmental specifications

Contents

Abstract HP-UX Contents Troubleshooting Optional componentsRemoving and replacing components Support and other resources 119Regulatory information 145 Index 146Overview Server blade overviewServer blade components CPU0Blade Link dimensions and weight Server blade dimensions and weightServer blade dimensions and weight for the BL860c Site preparationSite Inspection Checklist Customer and HP InformationSample Site Inspection Checklist Unpacking and inspecting the server blade Power subsystemESD handling information Unpacking the server blade Verifying site preparationInspect the shipping containers for damage Verifying the inventoryInstalling and powering on the server blade Installing the server blade into the enclosureInstallation sequence and checklist Preparing the enclosureRemoving a c7000 device bay divider Slide the locking tab down Installing interconnect modules Interconnect bay numbering and device mapping Installing the server blade into the enclosure Server blade power states Power StatesPowering on the server blade Powering off the server bladeBlade Link bay location rules BL1BL2E Installing the server blade into the enclosure Using iLO Accessing Uefi or the OS from iLO 3 MPUefi Front Accessing Uefi or the OS from iLO 3 MP Saving Uefi configuration settings Booting and installing the operating systemOS login prompt Operating system is loaded onto the server bladeInstalling the latest firmware using HP Smart Update Manager Operating systems supported on the server blade Operating system proceduresInstalling the operating system onto the server blade Continue with Configuring system boot options Installing the OS using HP Ignite-UXInstalling the OS using vMedia Adding HP-UX to the boot options list Configuring system boot optionsBooting and shutting down HP-UX HP-UX standard boot Booting HP-UX from the Uefi Boot ManagerBooting HP-UX from the Uefi Shell Booting HP-UX in single-user modeBooting HP-UX in LVM-maintenance mode Shutting down HP-UXBooting and shutting down HP-UX Optional components Partner bladesHot-plug SAS disk drives Installing internal components Removing the access panelProcessor and heatsink module Processor load orderOptional components Installing internal components Optional components Installing internal components Dimm installation guidelines DIMMsPerformance Dimm pair load orderMixed Dimm load order Dimm pair load order Dimm quad load order rules Mixed Dimm load order Dimm quad load orderInstalling Dimms Remove the access panel Removing the access panel Mezzanine cardsHP Smart Array P711m Controller Installing the Supercap mounting bracket Supercap pack mounting kitInstalling the P711m controller board SlotInstalling the Supercap Pack Procedure summary Replacing the access panelUpgrading a conjoined configuration Upgrade kit contents Before getting startedDetermining your current firmware revisions Supported operating systemsMinimum firmware versions Sysrev Uuid VCM Rules for server blade internal components Upgrading the original server Existing server blade checkAdding resources Installing internal components Ilo002264fed1da CMhpiLO- sr Sysset Command successful Installing internal components Final hardware check Support Booting the operating systemWarranty registration Blade link and system information parameters Operating System LicensesQuick Boot option FC SAN connections FCoE SAN connections Ethernet network connections Profile entry Assigned network Pre-Upgrade Procedure for PI Post-Upgrade Procedure for PIGioportableimage before Immed Now Methodology TroubleshootingGeneral troubleshooting methodology Methodology Executing recommended troubleshooting methodology Troubleshooting Entry PointsBasic and advanced troubleshooting tables Basic Low End TroubleshootingCannot find a boot disk. The iLO 3 MP is running Advanced Low End Troubleshooting Properly installed and fully seatedTroubleshooting tools Sl -e -nc Df -d Sysset Npar Uefi info allFront panel view Controls and portsServer blade LEDs Rear panel viewFront panel LEDs UID LEDSAS disk drive LEDs SAS hard drive LED combinationsDrive might terminate the current Indications for the iLO 3 TUI LEDs Virtual Front Panel LEDs in the iLO 3 TUIBlade Link LEDs Health LED Connecting to the serial port SUV Cable and PortsFault management overview DiagnosticsGeneral diagnostic tools HP-UX Fault managementEvent log usage Errors and error logsEvent log definitions ILO 3 MP event logs SEL review Cooling subsystem Troubleshooting processorsEnclosure information FirmwareIdentifying and troubleshooting firmware issues Troubleshooting the server interface system consoleTroubleshooting the environment Verify and install the latest firmwareServer blade environmental specifications CRU List Removing and replacing componentsServer blade components list 512744-001 AD399-2134A Preparing the server blade for servicing Powering off the server bladeBlade Link for BL870c i4 or BL890c i4 configurations Preparing the server blade for servicing Blade Link for BL860c i4 configurations Preparing the server blade for servicing Server blade Access panelPower off the server blade. Powering off the server blade Removing a disk drive blank Disk drive blanksDisk drives Dimm baffle DIMMs CPU baffle CPU and heatsink module Removing and replacing components CPU and heatsink module Server battery SAS backplaneMezzanine cards ICH mezzanine board System boardBlade Link Processor and heatsink module CPU and heatsink moduleUse the indent to pull the door open Support and other resources Contacting HPHP Insight Remote Support Software New and changed information in this editionTypographic conventions Understood or followed will result in personal injury or Standard terms, abbreviations, and acronyms AsicLdap TUI Using the saupdate command RAID configuration and other utilitiesConfiguring a Smart Array Controller SyntaxSetmode Updating the firmware using saupdate Determining the Driver ID and Ctrl IDRAID configuration and other utilities Creating a logical drive Deleting a logical drive Useful Uefi command checks DriversUefi Shell and HP Posse commands Uefi Shell CommandsControls batch file command echoing or displays a message Displays or modifies MEM/MMIO/IO/PCI/PCIE address space Using the Boot Maintenance Manager Drive paths in UefiBoot Options Add Boot OptionDelete Boot Option Change Boot Order Driver Options Add Driver OptionChange Driver Order Console ConfigurationDelete Driver Option Using the Boot Maintenance Manager Boot From File Set Boot Next ValueReset System Set Time Out ValueILO 3 MP Warranty information Turkey RoHS material content declarationUkraine RoHS material content declaration Regulatory informationIndex Drvcfg147 Turkey RoHS material content declaration