Xilinx manual Board Design Considerations, 11ML561 Revision a PCB Stack-Up

Models: ML561

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Board Design Considerations

For Write data and terminations at the memory, if the trace length from the receiver pin to the termination resistor can be guaranteed to be within 0.3 inches, then the fly-by termination scheme is implemented. Otherwise, the non-fly-by termination topology is implemented for Write data at the memory end.

The physical dimensions of the raw PCB are 12.75 inches x 11.75 inches. With the overhangs due to edge connectors, the actual size of the fully assembled board is approximately 13 inches x 12 inches, with 1.5 inches height allowance for the DIMM modules. This 14-layer board has 6 signal layers, 4 GND layers, and 4 power planes and uses Polyclad 370HR material for lead-free assembly. Figure 3-11shows a stack-up diagram of the ML561 Revision A PCB.

Refer to UG203, Virtex-5 PCB Designer’s Guide for more information on the PCB design using Virtex-5 devices.

73.90 ±7 mils

1.0 oz, TOP, Z0 = 50Ω, width = 6 mils 3.8 mils, Er = 4.4

1.0 oz, 02_GND1

4 mils, Er = 4.4

0.5 oz, 03_INR1, Z0 = 50Ω, width = 4.5 mils 5.3 mils, Er = 4.4

1.0 oz, 04_PWR1

8 mils, Er = 4.4

0.5 oz, 05_INR2, Z0 = 50Ω, width = 4.5 mils 3.2 mils, Er = 4.4

1.0 oz, 06_GND2

3 mils, Er = 4.4

1.0 oz, 07_PWR2

3.3 mils, Er = 4.4

1.0 oz, 08_PWR3

3 mils, Er = 4.4

1.0 oz, 09_GND3

3.2 mils, Er = 4.4

0.5 oz, 10_INR5, Z0 = 50Ω, width = 4.5 mils 8 mils, Er = 4.4

1.0 oz, 11_PWR4

5.3 mils, Er = 4.4

0.5 oz, 12_INR6, Z0 = 50Ω, width = 4.5 mils 4 mils, Er = 4.4

1.0 oz, 13_GND4

3.8 mils, Er = 4.4

1.0 oz, BOTTOM, Z0 = 50Ω, width = 6 mils

UG199_c3_11_102407

Figure 3-11:ML561 Revision A PCB Stack-Up

Virtex-5 FPGA ML561 User Guide

www.xilinx.com

37

UG199 (v1.2) April 19, 2008

Page 37
Image 37
Xilinx manual Board Design Considerations, 11ML561 Revision a PCB Stack-Up