Xilinx ML561 manual 2DDR2 Sdram Dimm Terminations Signal Fpga Driver

Models: ML561

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Chapter 5: Signal Integrity Recommendations

Table 5-1:DDR400 SDRAM Component Terminations

R

 

 

 

 

 

Signal

FPGA Driver

Termination at FPGA

Termination at Memory

 

 

 

 

Data (DQ)

SSTL2_II_DCI

No termination

50Ω pull-up to 1.3V

 

 

 

 

Data Strobe (DQS)

SSTL2_II_DCI

No termination

50Ω pull-up to 1.3V

 

 

 

 

 

 

 

 

 

 

 

 

 

Clock (CK,

 

 

 

 

 

 

 

 

 

SSTL2_II

No termination

100Ω differential termination

CK)

 

 

 

 

 

 

 

 

 

 

 

 

 

between pair

 

 

 

 

Address (A, BA)

SSTL2_II

No termination

50Ω pull-up to 1.3V after the last

 

 

 

 

 

 

 

 

 

 

 

 

 

component

 

 

 

 

 

 

 

 

 

 

 

 

Control

 

 

 

 

 

 

 

 

 

DM, and

SSTL2_II

No termination

50Ω pull-up to 1.3V after the last

(RAS,

CAS,

WE,

CS,

CKE)

 

 

component

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Table 5-2:DDR2 SDRAM DIMM Terminations

 

 

 

Signal

FPGA Driver

Termination at FPGA

Termination at Memory

 

 

 

 

 

 

Data (DQ)

SSTL18_II_DCI

No termination

No termination (use 75Ω ODT(1))

 

Data Strobe (DQS,

 

 

 

 

 

 

 

DIFF_SSTL18_II_DCI

No termination

No termination (use 75Ω ODT)

 

DQS)

 

 

 

 

 

 

Data Mask (DM)

SSTL18_II

No termination

No termination (use 75Ω ODT)

 

 

 

 

 

 

 

 

6 Pairs of Clocks (CK,

 

 

 

 

SSTL18_II

No termination

No termination(2)

 

CK),

 

3 each per DIMM

 

 

 

 

 

 

 

 

 

Address (A, BA)

SSTL18_II

No termination

50Ω pull-up to 0.9V after the second

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

DIMM

 

 

 

 

 

 

 

 

 

 

 

 

Control

 

 

 

 

 

 

 

 

 

SSTL18_II

No termination

50Ω pull-up to 0.9V after the second

 

(RAS,

CAS,

WE,

 

CS,

CKE, and others)

 

 

DIMM

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Notes:

1.Due to use of DCI I/O for DQ and DQS, these signals have parallel termination at the source during Write operations. Simulation results show that use of a weaker 75Ω ODT instead of a matching 50Ω ODT setting gives better noise margin at the memory.

2.The DIMM already contains 120Ω differential termination. A 5 pF capacitive termination is provided on the board as per Micron TN-47-01.

Table 5-3:DDR2 SDRAM Component Terminations

 

Signal

FPGA Driver

Termination at FPGA

Termination at Memory

 

 

 

 

Data (DQ)

SSTL18_II_DCI

No termination

No termination (use 75Ω ODT)

 

 

 

 

 

 

 

 

 

 

 

Data Strobe (DQS,

 

 

 

 

 

 

 

DIFF_SSTL18_II_DCI

No termination

No termination (use 75Ω ODT)

DQS)

 

 

 

 

Data Mask (DM)

SSTL18_II

No termination

No termination (use 75Ω ODT)

 

 

 

 

 

 

 

 

 

 

 

 

 

Clock (CK,

 

 

 

 

 

 

 

 

 

SSTL18_II

No termination

100Ωdifferential termination between

CK)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

pair

 

 

 

 

Address (A, BA)

SSTL18_II

No termination

50Ω pull-up to 0.9V after the last

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

component

 

 

 

 

 

 

 

 

 

 

 

 

Control

 

 

 

 

 

 

 

 

 

 

 

 

SSTL18_II

No termination

50Ω pull-up to 0.9V after the last

(RAS,

CAS,

WE,

CS,

and CKE)

 

 

component

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

48

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Virtex-5 FPGA ML561 User Guide

 

 

UG199 (v1.2) April 19, 2008

Page 48
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Xilinx ML561 manual 2DDR2 Sdram Dimm Terminations Signal Fpga Driver