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HP Z820 Workstation specifications
| Intel® Series C602 chipset with: | ||
| ● Support for the Intel® Xeon™ Processor | ||
| ● Integrated | ||
Processor | ● | Microarchitecture improvements | |
technology | ● | Large L3 cache for superior performance | |
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| ● Intel QuickPath Interconnect (QPI) connects processors and I/O controller with speeds up to 8.0 | ||
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| GT/s | |
| NOTE: HP Liquid Cooling option is available for all Z820 processors. | ||
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| ● 850W Silver, 88% efficient, | ||
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| on two separate 12V rail, ERP 0.5W, | |
Power supply | ● 1125W Gold, 90% efficient, | ||
| dongles on three separate 12V rails, ERP 0.5W, | ||
| ● China’s Energy Conservation Program (CECP) configurations | ||
| ● European Union ErP LOT6 2013 power limit of 0.5W in off mode | ||
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| ● Dual | ||
| ● Error checking and correcting | ||
| ● Eight | ||
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| transfer for improved performance | |
| ● Configurations with one CPU have eight DIMM slots; a second CPU adds eight more DIMM slots | ||
| ● With one processor, up to 256 GB system memory (32 GB DIMMs) | ||
Memory | ● With second processor, up to 512 GB system memory (32 GB DIMMs) | ||
● | 1600 MHz 2, 4 GB ECC unbuffered DIMM | ||
technology |
● 1600 MHz 4, 8, 16 GB ECC registered DIMM
● 1333 MHz 32 GB ECC Load Reducing DIMM (available second half of 2012)
NOTE: Do not mix any of the different types (unbuffered, registered, and load reducing DIMMs) of memory. The system will not boot and will produce a memory error.
NOTE: For maximum performance, on workstations with two CPUs, install the same number of
DIMMs per CPU and install them in pairs of the same size
NOTE: Distribute DIMMs across all memory channels for optimal performance
● PCIe Gen3 (PCIe3) bus speeds; can support three PCIe Gen3 graphics cards in PCIe3 x16 slots
Graphics cards ● Up to one 160W or two 75W graphics cards with 850W power supply
●Up to two 300W or three 225W graphics cards with optional 1125W power supply (other configuration restrictions may be required)
HP Z820 Workstation components | 35 |