TMS380C26

NETWORK COMMPROCESSOR

SPWS010A±APRIL 1992±REVISED MARCH 1993

MECHANICAL DATA

JEDEC plastic leaded quad flat package (PQ suffix)

Each of these chip carrier packages consists of a circuit mounted on a lead frame and encapsulated within an electrically nonconductive plastic compound. The compound withstands soldering temperatures with no deformation, and circuit performance characteristics remain stable when the devices are operated in high-humidity conditions. The packages are intended for surface mounting on solder lands on 0,635 (0.025) centers. Leads require no additional cleaning or processing when used in soldered assembly.

0,254 (0.010) NOM

0,635 (0.025) NOM

4,57 (0.180)

4,06 (0.160)

0,76 (0.030) NOM

C L

AB

C

C

L

B

A

JEDEC

NO. OF

 

A

 

B

 

C

OUTLINE

TERMINALS

MIN

MAX

MIN

MAX

MIN

MAX

 

 

 

 

 

 

 

 

MO±069±AD

100

22,28

22,43

18,97

19,13

15,16

15,32

(0.877)

(0.883)

(0.747)

(0.753)

(0.597)

(0.603)

 

 

MO±069±AE

132

27,36

27,50

24,05

24,21

20,24

20,40

(1.077)

(1.083)

(0.947)

(0.953)

(0.797)

(0.803)

 

 

 

 

 

 

 

 

 

 

ALL LINEAR DIMENSIONS ARE IN MILLIMETERS AND PARENTHETICALLY IN INCHES

POST OFFICE BOX 1443 HOUSTON, TEXAS

91

77251±1443

 

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Image 91
Texas Instruments TMS380C26 Jedec plastic leaded quad flat package PQ suffix, 254 0.010 NOM 635 0.025 NOM 76 0.030 NOM