MCF548x Reference Manual, Rev. 3
Freescale Semiconductor 31-1

Chapter 31

Mechanical Data

This chapter contains drawings showing the pinout, packaging, and mechanical characteristics of the

MCF548x. See the website http://www.freescale.com/coldfire for any updated information.

31.1 Package

The MCF548x is assembled in a 388-pin, thermally enhanced plastic BGA package.

31.2 Pinout

The MCF548x pinout is detailed in Table 31-1, including the primary and alternate functions of

multiplexed signals.

Table 31-1. MCF5485/MCF5484 Signal Description by Pin Number
PBGA
Pin
Pin Functions PBGA
Pin
Pin Functions
Primary GPIO Secondary Tertiary Primary GPIO Secondary Tertiary
A1 SDVDD P1 SDCS1 ——
A2 VSS — P2 SDCS2 ——
A3 SDDM2 ——P3SD_VDD —
A4 SDDATA23 ——P4IVDD — —
A5 SDDATA24 — P11 VSS
A6 SDDATA27 — P12 VSS
A7 SDDQS3 — P13 VSS
A8 SDDATA29 — P14 VSS
A9 SDADDR0 — P15 VSS
A10 SDADDR3 — P16 VSS
A11 SDADDR7 — P23 PCIAD19 FBADDR19
A12 SDADDR11 — P24 PCIAD20 FBADDR20
A13 SDADDR12 — P25 PCIAD18 FBADDR18
A14 IRQ5 PIRQ5 CANRX1 P26 PCIAD21 FBADDR21
A15 DSI —TDIR1FBCS5PFBCS5 —
A16 TCK — R2 SDCS3 ——
A17 CLKIN R3 EVDD
A18 MTMOD1 R4 VSS
A19 PLLVDD R11 VSS
A20 RSTO — R12 VSS
A21 PSTDDATA1 — R13 VSS