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Intel 8080 manual

Models: 8080

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Intel 8080 manual

Contents

Page Programmable Communication Interface Clock Generator for 8080ASystem Controller for 8080A Programmable Peripheral InterfaceContents Peri pherals 127Chapter Packaging Information Page Microcomputer Design Aids Advantages of Designing With MicrocomputersConventional System Programmed Logic Iii Applications Example1IIII~Iff1 Application Peripheral Devices EncounteredArchitecture of a CPU Typical Computer SystemAccumulator Program Counter Jumps, Subroutines and the Stack Instruction Register and DecoderArithmetic/Logic Unit ALU Control CircuitryAddress Registers Computer OperationsMemory Write Instruction FetchMemory Read Wait memory synchronizationPage Page INTE~ 8080 Photomicrograph With Pin DesignationsArchitecture of the 8080 CPU RegistersData Bus Buffer Arithmetic and Logic Unit ALUInstruction Register and Control Processor CycleMachine Cycle Identification State Transition Sequence HaltStatus Bit Definitions Status Word ChartStatus Information Definition CPU State Transition Diagram ?~~Rr\ ONE ,----- ~ State Associated Activities ~2. State DefinitionsRLrL- rL rL rL-rL- rLrL Interrupt Sequences¢2 -+--sLJJlL-..rrL~LJLLJTLJJ\.lJL Halt Sequences Hold SequencesSTART-UP of the 8080 CPU 11. Halt Timing ~~~~t==p 001 STATUS6 Xram ~A~~~ll ~iA~~~11~iA~~ll,12 ~iA~~~11Value 111 000 001 010 011 100 101Typical Computer System Block Diagram Basic System OperationClock Generator and High Level Driver CPU Module Design8080 CPU Clock Generator Design~50ns ClK 0.......-..-.-----.. tf1A TTLHigh Level Driver Design Ststb !1 Page ROM Interface Interfacing the 8080 CPU to Memory and I/O DevicesRAM Interface Ill Isolated I/O InterfaceGeneral Theory Memory Mapped I/OInterface Example AddressingMemr to 13 Format 15 FormatInstruction and Data Formats 8080 Instruction SETByte Three I D7 Byte OneByte Two Addressing ModesDescription Format Symbols and AbbreviationsSymbols Meaning AllMOV r1, r2 Move Register Content of register r2 is moved to register r1Data Transfer Group Reg. indirect0 I R p 0 I R1 I 0 IArithmetic Group 0 I 0 oR 0 I 0 I D I DOCR M Decrement memory I ILogical Group Cycles States Addressing reg. indirect Flags Z,S,P ,CY,AC~11~ I 0 I 1 I 1 II 1 I 1 o I 1 I 1 I 1 1 10 I 0 I 0 I 1 I0 I 0 1 I Cycles States Flags noneBranch Group 000Ccondition addr I c c I c I 0 I 0 ISP ~ SP + Push rp Stack, I/O, and Machine Control GroupI 1 o 1 I R~ data Exchange stack top with Hand L~ SP + Cycles States Flags NoneInstruction SET Programmable Peripheral Interface 8224 8080A-1 8228 8080A-2 8080A M8080-A Page Schottky Bipolar PIN NamesOscillator Functional DescriptionGeneral Clock GeneratorPower-On Reset and Ready Flip-Flops Ststb Status StrobeCharacteristics Crystal RequirementsInput 8pFT42 T01 T02 T03 Toss Characteristics For tCY = 488.28 nsExample TORS tORH tOR FMAXPIN Configuration Block Diagram DbinGeneral BlockSignals Inta None ControlWaveforms Characteristics TA = Oc to 70C Vee = 5V ±5%TE~r Hlda to Read Status OutputsVTH GoUTStstb VCC=5V·-c GND ---. rIntel Silicon Gate MOS 8080 a ?oo .HVss Vee8080A Functional PIN Definition Capacitance CharacteristicsAbsolute Maximum RATINGS· IOl = 1.9mA on all outputsTiming Waveforms =..... -r-DATAIN~I~~~ ~~1 t CYCharacteristics Typical ~ Output Delay VS. a CapacitanceInstruction SET Typical InstructionsSilicon Gate MOS 8080.A Summary of Processor InstructionsInfel Silicon Gate MOS 8080A-1 Max Symbol Parameter TypUnit ~tOF.I Fft~l~-t TYPICAL!J. Output Delay VS. ~ Capacitance Infel Silicon Gate MOS 8080 A-2 J1A +10Cout VAOOR/OATA = VSS + O.45VSymbol Parameter Min Unit Test ConditionTypical ~ Output Delay VS. ~ Capacitance Min. Max. Unit Test ConditionPage Intel . Silicon Gate MOS M8080A Ence, arithmetic or logical, rotate Immediate mode or I/O instructionsRegister to regist~r, memory refer Interrupt instructionsSummary of Processor Instructions Llf17Silicon Gate MOS M8080A M8080A Functional PIN DefinitionIOL = 1.9mA on all outputs Absolute Maximum RatingsOperation Symbol Parameter Min. Max Unit Test Condition Silicon Gate MOS M8080A ~I~Page ROMs 8702A 8704 8708 8316A Page Silicon Gate MOS 8702A PIN Connections Operating CharacteristicsVoo ~10% Switching Characteristics1N= Vee = V ce\ \ Cs=o.~Characteristics for Programming Operation Operating Characteristics for Programming OperationSymbol Test SYMBOLTESTMIN. TYP. MAX. Unit ConditionsProgramming Operation of the 8702A Switching Characteristics for Programming OperationCS = OV Program OperationIII a Erasing Procedure Operation of the 8702A in Program ModeII. Programming of the 8702A Using Intel Microcomputers Programming Instructions for the 8702APage PIN Configurations Block Diagram PIN NamesIBB CommentIII VOH1Waveforms Symbol Parameter Typ. Max. Unit ConditionsTest Conditions Max UnitTpF Program Pulse Fall Time Parameter MinProgramming Current RnA Program Pulse Amplitude CS/WE = +12V Read/Program/Read Transitions+-------1 150 r PEEEf!1EJEZPlEzz$m=2!·m·· IccSilicon Gate MOS CS=O.O CommentMAX Unit Outa100 ns 7001 JJ.s ~~~H --4!~--~N-~-TA-AL-~-DU-T--~\200ns 500ns 300 ns Typical Characteristics Cs .. o.~ ~rSilicon Gate MOS Ilkc IlclIlpc ILOCoUT Conditions of Test for CharacteristicsCIN ~ ~ ~ Pppp Mask Option SpecificationsMarking Customer Number OateBlank ~ r ------ + -- t --- . L . ------ rJTitle Card 79-80PIN Configuration Block Diagram Intel Silicon Gate MOS ROM 8316AConditions of Test for 400CAPACITANCE2 TA = 25C, f = 1 MHz OU~TVALID WaveformsTypical D.C. Characteristics ILICO.N Gate MOS ROM 8316ASTO CustomerNumber Oate Mask Option Speci FicationsTitle Card COM~ANY NameRAMs Page PIN Configuration Logic Symbol Block Diagram Silicon Gate MOS10H = -150 p.A ~E~~=~utP~-t-·7~igh-~\/oltage-~------ ---- --i2-+---=~== ~== OC +----+Conditions of Test 00 ~Page PIN Configuration Logic Symbol Block Diagram Silicon Gate MOSICC1 Symbol Parameter Min. Typ.rIII ICC2Input Pulse Rise and Fall Times 20nsec Write 1~-tAW--.I-----I550 200 Timing Measurement Reference Level VoltPage Silicon Gate MOS Comment Power Dissipation Watt5V to +7V TA = OOC to +70C, Vee = 5V ±5% unless otherwise specifiedCapacitance T a = 25C, f = 1MHz 85o-·-···T+--~~~TL~~~EEt~~~P-.± Conditions of TestTypical A.C. Characteristics ~~~b~.JSilicon Gate MOS 8102A-4 TA = OC to +70 o e, Vcc = 5V ±5% unless otherwise specified 230 450300 Access Time VS LOAD·CAPACITANCE VIN Limits VS. TemperatureAccess Time VS Ambient Temperature Output Source Current VSFully Decoded Random Access BIT Dynamic Memory PIN Configuration Logic Symbol Block DiagramSilicon Gate MOS 81078·4 IOOAV2II.~ IMP~ri~~CERef = Read Cycle4000 Write CycleTypical Characteristics RWc 590 CD Symbol Parameter Min MaxNumbers in parentheses are for minimum cycle timing in ns Refresh Power DissipationStandby Power System Interfaces and FilteringTypical System BIT 256 x 4 Static Cmos RAM VOR ICC2VIH VOL VOH IcccrInput Pulse Rise and Fall Times 20nsec Timing Measurement Reference Level Volt~I----- t CW2 ------ . t PIN Configuration Logic Symbol Schottky BipolarConditions of Test Voo- --- ---TPower Supply Current Drain and Power Dissipation All driver outputs are in the state indicatedTypical System Dynamic Memory Refresh Controller Page 8212 8255 8251 Page PIN Configuration Logic Diagram EIGHT-BIT INPUT/OUTPUT PortFunctional Description OS2Are 3-state Basic Schematic SymbolsII. Gated Buffer 3·STATE Gated BufferInterrupt Instruction Port III. Bi-Directional Bus DriverIV. Interrupting Input Port BI-DIRECTIONAL BUS Driver8080 4 VI. Output Port With Hand-ShakingVII Status Latch OvJ \.. -4~Vee Viii SystemOUT SystemIX System DalN-t?!NrJ 1G~D L-~Characteristics Absolute Maximum Ratings·Typical Characteristics 052 ~OUT TpwTA = OC to + 75C Vee = +5V ± 5% Switching Characteristics12 pF Programmable Peripheral Interface ~~~lEI~S 1-- +SVRead/Write and Control Logic GeneralData Bus Buffer Basic Functional DescriptionGroup a and Group B Controls ResetPIN Configuration Ports A, B, and CDetailed Operational Description Mode SelectionSingle Bit Set/Reset Feature PA 7 ·pAoMode 0 Timing Operating Modes Mode 0 Basic Input/OutputInterrupt Control Functions Mode 0 Port Definition Chart Mode 0 Configurations119 Operating Modes Mode 1 Strobed Input/Output · / ,4Intr Interrupt Request Input Control Signal DefinitionIBF Input Buffer Full F/F Inte aOutput Control Signal Definition InteaOperating Modes Combinations of ModeBi-Directional Bus I/O Control Signal Definition Output OperationsMode 2 Control Word Mode 2 Bi-directional TimingMode 2 Combinations Mode 2 and Mode 0 OutputSource Current Capability on Port B and Port C Special Mode Combination ConsiderationsMode Definition Summary Table Reading Port C StatusKeyboard and Display Interface ApplicationsPrinter Interface Keyboard and Terminal Address InterfacePCO ~.LEFT/RIGHTSilicon Gate MOS Input High Voltage Val Output Low Voltage IOl = 1.6mA Characteristics TA = oc to 70C Vee = +5V ±5% vss = OVVil Input Low Voltage Time From STB = 0 To IBFMode 0 Basic Input Mode 1 Strobed Input Mode 2 Bi-directional Page Programmable Communication Interface ReadlWrite Control logic Reset ResetGeneral ClK ClockTxE Transmitter Empty Modem ControlDSR Data Set Ready DTR Data Termin·al ReadyRxRDY Receiver Ready Receiver BufferReceiver Control RxC Receiver ClockDetailed Operation Description Mode InstructionCommand Instruction ProgrammingAsynchronous Mode Receive Mode Instruction DefinitionAsynchronous Mode Transmission Data C~~RACTERMode Instruction Format, Synchronous Mode Synchronous Mode TransmissionSynchronous Mode Receive Synchronous Mode, Transmission FormatStatus Read Definition Command Instruction DefinitionCommand Instruction Format Status Read FormatSynchronous Interface to Terminal or Peripheral Device Asynchronous Serial Interface to CRT Terminal, DC-9600 BaudAsynchronous Interface to Telephone Lines Synchronous Interface to Telephone LinesIcc CapacitanceIOL TA = oc to 70C VCC = 5.0V ±5% Vss = OV Symbol Parameter Typ~AST BIT ,----1 RxDSRX ~4IlI RXD~Peripherals Page High Speed 1 OUT of 8 Binary Decoder Decoder Enable GateSystem Chip Select Decoder Using a very similar circuit to the I/O port decoder, an arPort Decoder 24K Memory InterfaceJJ,.--+-I----.....1 Logic Element Example\lJ IllSymbol VOL VOH Characteristics TA = OOC to +75C, Vee = 5.0V ±5%Typical Characteristics 8205Address or Enable to Output Delay VS. Ambient Temperature Switching Characteristics Conditions of Test Test LoadAddress or Enable to Output Delay VS. Load Capacitance Test Waveforms~ R PIN Configuration~ ~ Polled Method Interrupts in Microcomputer SystemsInterrupt Method Priority Encoder Current Status RegisterElR, ETlG, ENGl Control SignalsINTE, elK AO, A1, A2Level Controller Basic OperationI I Level ControllerCascading Los Operating CharacteristicsSymbol Parameter Limits Unit Conditions Min Typ.£1 Absolute Maximum RatingsCharacteristics and Waveforms TA = oc to +70C, vcc = +5V ±5% Schottky Bipolar +-......---- n cs 8216 8226Bi-Directional Driver Control Gating OlEN, CSMemory and 1/0 Interface to a Bi-directional Bus Applications of 8216/8226Large microcomputer systems it is often necessary to pro Input Load Current All Other Inputs VF =0.45 IcC Power Supply Current 120Input Load Current OlEN, CS VF =0.45 Input Leakage Current OlEN, CS VR =5.25VWaveforms OUTPage 8253 8257 8259 Page Programmable Interval Timer It uses nMOS technology ~Jmodesof operation areSystem Interface Block DiagramPreliminary Functional Description System InterfaceProgrammable DMA Controller Dack 2 System InterfaceSystem Application CS-------It LJJ Peripheral Coming Soon CPU GroupROMs RAMs Intel735~ ~~~1It-j Lead Plastic Dual IN-LINE Package P \.--.J.. ~~~l·34o~ Lead CerDIP Dual IN-LINE Package DSales and Marketing Offices Distributors Page Page Page Page Page Page Instruction SET Instruction SET Summary of Processor Instructions By Alphabetical OrderMicrocomputer System Users Registration Card Intel Corporation Microcomputer Systems Bowers Avenue Santa Clara, CAInter