2

Board Level Hardware Description

Specifications

Table 2-1. MVME187 General Specifications

Characteristics

 

SpeciÞcations

 

 

 

Power requirements

+5 Vdc (+/-5%)

3.5 A (typical), 4.5 A (maximum)

(with all four EPROM sockets

 

(at 25 MHz, with 32MB parity DRAM)

populated and excluding

 

 

 

5.0 A (typical), 6.5 A (maximum)

external LAN transceiver)

 

 

(at 33 MHz, with 128MB ECC DRAM)

 

 

 

 

 

 

 

 

 

+12 Vdc (+/-5%)

100 mA (maximum)

 

 

 

(1.0 A (maximum) with offboard LAN

 

 

 

transceiver)

 

 

 

 

 

 

-12 Vdc (+/- 5%)

100 mA (maximum)

 

 

 

Operating temperature

0û to 55û C at point of entry of forced air

 

 

(approximately 490 LFM)

 

 

 

Storage temperature

-40û to +85û C

 

 

 

Relative humidity

5% to 90% (non-condensing)

 

 

 

 

Physical

PC board with

Height

9.187 inches (233.35 mm)

dimensions

mezzanine

 

 

Depth

6.299 inches (160.00 mm)

Double-high

module only

 

 

Thickness

0.662 inches (16.77 mm)

VMEboard

 

 

 

 

 

 

PC board with

Height

10.309 inches (261.85 mm)

 

connectors and

 

 

 

Depth

7.4 inches (188 mm)

 

front panel

 

 

 

 

 

Thickness

0.80 inches (20.32 mm)

 

 

 

 

Conformance to Requirements

These boards are designed to conform to the requirements of the following specifications:

VMEbus Specification (IEEE 1014-87)

EIA-232-D Serial Interface Specification, EIA

SCSI Specification

2-6

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Motorola manual Conformance to Requirements, MVME187 General Specifications, Characteristics SpeciÞcations