Mechanical Information

7.1 Mechanical Information

The C614 is normally sold in die form but is also available in 100-pin PJM packages. The P614 is available in a windowed ceramic package, 120-pin PGA.

NOTE: Scan Port Bond Out

The Scan Port Interface on the MSP50C6xx devices has five dedicated pins and one shared pin that need to be used by the MSP50Cxx development tools. The SCANIN, SCANOUT, SCANCLK, SYNC, and TEST pins are dedicated to the scan port interface. The RESET pin is shared with the application. These pins may play an important role in debugging any system problems. For this reason, these pins MUST be bonded out on any C614 production board. Furthermore, it is recommended that these pins be connected to test points, so the development tool can be connected. Since the development tool requires VDD and VSS, test points connected these signals are also needed.

The application circuits appearing in section 6.1 show the minimum recommended configuration for any C614 application board. For production purposes the 10 kΩ resistor which appears at the RESET pin is optional. It is required for use with the Scan Port Interface, but they may be shorted otherwise. The footprints for this resistor is strongly recommended.

7.1.1Die Bond-Out Coordinates

Die bond-out coordinates are available upon request from Texas Instruments.

7-2

MSP50C614 specifications

The Texas Instruments MSP50C614 is a microcontroller that belongs to the MSP430 family, renowned for its low power consumption and versatile functionality. Primarily designed for embedded applications, this microcontroller is favored in various industries, including consumer electronics, industrial automation, and healthcare devices.

One of the standout features of the MSP50C614 is its ultra-low power technology, which enables it to operate in various power modes. This makes it ideal for battery-powered applications, where energy efficiency is crucial. The MSP430 architecture allows for a flexible power management system, ensuring that energy is conserved while providing robust performance.

The MSP50C614 is equipped with a 16-bit RISC CPU that delivers high performance while maintaining low power usage. With a maximum clock frequency of 16 MHz, it can execute most instructions in a single cycle, resulting in swift operation and responsive performance. This microcontroller also comes with a generous flash memory capacity, allowing developers to store large amounts of code and data conveniently.

In terms of peripherals, the MSP50C614 is highly versatile. It features a range of digital and analog input/output options, including multiple timers, GPIO ports, and various communication interfaces like UART, SPI, and I2C. This extensive set of peripherals allows for seamless integration with other components and simplifies the design of complex systems.

The integrated 12-bit Analog-to-Digital Converter (ADC) stands out as a valuable characteristic of the MSP50C614. This feature enables the microcontroller to convert physical analog signals into digital data, making it particularly useful for sensing applications and real-time monitoring.

Another noteworthy technology employed in the MSP50C614 is its support for low-voltage operations. With a broad supply voltage range, this microcontroller can function efficiently in diverse environments and is suitable for low-power applications, enhancing its practicality.

Moreover, Texas Instruments provides software support in the form of Code Composer Studio and various libraries that make it easier for developers to program and utilize the MSP50C614 effectively.

In summary, the Texas Instruments MSP50C614 microcontroller is a powerful, low-power solution equipped with the features and technologies necessary for efficient operation in a wide array of applications. Its blend of performance, flexibility, and energy efficiency makes it a popular choice among engineers and designers looking to create innovative, sustainable designs in the rapidly evolving tech landscape.

Texas Instruments MSP50C614 manual Mechanical Information, Die Bond-Out Coordinates

Models: MSP50C614