Tableof C ontents
2715 Spectrum Analyzer Service Manual v
Figure 5-11: Presetting the Flatness Adjustments o n the
Log Board 5-35............................................
Figure 5-12: Gain Step ReferenceTest Setup 5-36...................
Figure 5-13: Internal Ref Ampltd TestSetup 5-38...................
Figure 5-14: SW410 on the Reference OscillatorBoard 5-39..........
Figure 5-15:Adjustment and Test Point Locations on the
Sweep Board 5-41..........................................
Figure 5-16: TypicalFM Adjustment Waveform 5-42................
Figure 5-17: HPF Tuning Criteria(at TP110M) 5-45.................
Figure 5-18: Typical Video Waveform 5-48.........................
Figure 5-19: Horizontal Sync Output 5-49.........................
Figure 5-20: Vertical Sync Output Waveform 5-50..................
Figure 5-21: E/O Output Waveform 5-51..........................
Figure 5-22: Test Equipment Characteriza tion Using a Dual
Channel Power Meter for split75 5-59..........................
Figure 5-23: Test Equipment Characteriza tion Using a
Single Channel P ower Meter to Characterize the Power Meter
Output for split75 5-59......................................
Figure 5-24: Test Equipment Characteriza tion Using a
Single Channel P ower Meter to Characterize the DUT
Output for split75 5-59......................................
Figure 5-25: Test Equipment Characteriza tion Using a Dual
Channel Power Meter for split50 5-60..........................
Figure 5-26: Test Equipment Characteriza tion Using a
Single Channel P ower Meter to Characterize the Power Meter
Output for split50 5-60......................................
Figure 5-27: Test Equipment Characteriza tion Using a
Single Channel P ower Meter to Characterize the DUT
Output for split50 5-60......................................
Figure 5-28: Flatness TestSetup (75 W) 5-62.......................
Figure 5-29: Flatness TestSetup (50 W) 5-62.......................
Figure6-1: Main Extender and SecondaryExtender 6-4............
Figure 6-2: Signal Steerin g SquarePins 6-5.......................
Figure 6-3: Surface Mounted Components Lead Configuration 6-14...
Figure 6-4:Top View of Assemblies and RF Deck 6-18...............
Figure 6-5:Assemblies Seen from the Bottom of the Spectrum
Analyzer 6-19..............................................
Figure 6-6: Removing the Front Panel 6-22........................
Figure 6-7: Locations of J510 and J550 on the Phase Lock
Assembly 6-23.............................................