Table 7.1 Absolute Maximum Stress Ratings

Symbol

Parameter

Min

Max

Unit

Test Conditions

 

 

 

 

 

 

TSTG

Storage temperature

55

150

°C

VDD

Supply voltage

0.5

7.0

V

VIN

Input voltage

VSS 0.5

VDD +0.5

V

1

Latch-up current

±150

mA

ILP

ESD2

Electrostatic discharge

2 K

V

MIL-STD 883C,

 

 

 

 

 

Method 3015.7

 

 

 

 

 

 

1.2 V < VPIN < 8 V.

2.SCSI pins only.

Note: Stresses beyond those listed above may cause permanent damage to the device. These are stress ratings only; functional operation of the device at these or any other conditions beyond those indicated in the Operating Conditions section of the manual is not implied.

Table 7.2

Operating Conditions

 

 

 

 

 

 

 

 

 

 

Symbol

Parameter

Min

Max

Unit

Test Conditions

 

 

 

 

 

 

VDD

Supply voltage

4.75

5.25

V

1

Supply current (dynamic)

130

mA

IDD

 

Supply current (static)

1

mA

 

 

 

 

 

 

TA

Operating free air

0

70

°C

θJA

Thermal resistance

67

°C/W

 

(junction to ambient air)

 

 

 

 

 

 

 

 

 

 

1. Average operating supply current is 50 mA.

Note: Conditions that exceed the operating limits may cause the device to function incorrectly.

7-2

Electrical Characteristics

Page 184
Image 184
LSI 53C810A technical manual Absolute Maximum Stress Ratings, Operating Conditions