3-12 Signal Descriptions
3.7 Test Interface Signals

Tabl e 3.13 describes Test Interface signals.

MAD[7:0] 59–62,
64–67 L7, M7,
N7, K7,
M8,N8,
L8, K8
I/O 4 mA Memory Address/Data Bus. This bus is used in
conjunction with the memory addressstrobe pins
and external address latchesto assemble up to a
20-bit address for an externalEEPROM or flash
memory. This bus will put out the least significant
bytefirst and finishes with the most significant bits.
It is also used to write datato a flash memory or
read data into the chip from external EEPROM/
flash memory.These pins have static pull-downs.

Table 3.12 ROM Flash and Memory Interface Signals (Cont.)

Name PQFP BGA Type Strength Description

Table 3.13 Test Interface Signals

Name PQFP BGA Type Strength Description
TEST_HSC/ 126 A11 I N/A TestHalt SCSI Clock. For LSI Logic test purposes
only.Pulled HIGH internally. This signal can also
cause a full chip reset.
TCK 130 A10 I N/A Test Clock. This pin provides the clock forthe JTAG
test logic.
TMS 57 N6 I N/A Test Mode Select. The signalreceived at TMS is
decoded by the TAPcontroller to control JTAGtest
operations. This pinhas a static pull-down.
TDI 142 D7 I N/A TestD ata In. Serial test instructionsare received by
the JTAGtest logic at this pin. This pin has a static
pull-down.
TEST_RST/ 127 C10 I N/A Test Reset. For test purposes only.Pulled HIGH
internally.
TDO 58 J6 O 4 mA Test Data Out. This pin is the serial output for test
instructions and data from theJTAG test logic.
TRST/ 131 C9 I N/A Test Reset. This pin provides a reset for JTAG Test
Logic. Pulled HIGH internally.