6-2 Electrical Specifications
Table 6.1 Absolute Maximum Stress Ratings1
1. Stressesbeyond those listed above may cause permanent damage to the device.These are stress
ratings only; functionaloperation of the device at these or any other conditions beyond those
indicatedintheOperating Conditions section of the manual is not implied.
Symbol Parameter Min Max Unit Test Conditions
TSTG Storage temperature 55 150 °C–
VDD Supply voltage 0.5 4.5 V
VIN Input voltage VSS0.3 5.55 V SCSI 5 V TolerANT pads
ILP2
2. 2V<V
PIN <8V.
Latch-up current ±=150 – mA
ESD Electrostatic discharge 2 K V MIL-STD 883C,
Method 3015.7
Table 6.2 Operating Conditions1
1. Conditions that exceedthe operating limits may cause the device to function incorrectly.
Symbol Parameter Min Max Unit TestConditions
VDD Supply voltage 2.97 3.63 V ±10%
IDD Supply current (dynamic)
Supply current (static)
200 mA
1mA mA
mA
TAOperatingfree air 0 70 °C–
θJA Thermal resistance
(junction to ambient air) – 25.1
34.7 °C/W 160 PQFP
169 PBGA

Table 6.3 Input Capacitance

Symbol Parameter Min Max Unit TestConditions
CIInput capacitanceof input pads 7 pF
CIO Input capacitance of I/Opads 15 pF