Texas Instruments SM320F2812-HT specifications Center Description HFG Power Signals

SM320F2812-HT

SGUS062A –JUNE 2009 –REVISED APRIL 2010www.ti.com

			Table 2-3. Signal Descriptions (1)				(continued)
	PIN NO.	DIE PAD		DIE PAD	DIE PAD	I/O/Z (2)	PU/PD (3)
NAME	172-PIN			X-CENTER	Y-CENTER			DESCRIPTION
	HFG	NO.		(μm)	(μm)
					POWER SIGNALS
VDD	22	29		2927.6	42.6
VDD	36	43		4395.4	42.6
VDD	55	62		5361.5	1256.0
VDD	73	86		5361.5	3496.4
VDD	-	98		5361.5	4671.835			1.8-V or 1.9-V Core Digital Power Pins. See
								Section 6.2, Recommended Operating
VDD	98	113		3861.3	5057.5
								Conditions, for voltage requirements.
VDD	110	125		2451.9	5057.5
VDD	125	141		663.7	5057.5
VDD	140	156		42.6	3845.1
VDD	150	169		42.6	2635.3
VSS	-	25		2517.7	42.6
VSS	31	38		3871.3	42.6
VSS	37	44		4490.7	42.6
VSS	51	58		5361.5	869.2
VSS	57	65		5361.5	1514.6
VSS	-	79		5361.5	2818.6
VSS	76	89		5361.5	3754.9
VSS	84	97		5361.5	4585.7			Core and Digital I/O Ground Pins
VSS	97	112		3956.0	5057.5
VSS	103	118		3280.5	5057.5
VSS	111	126		2357.2	5057.5
VSS	-	133		1587.1	5057.5
VSS	126	142		569.0	5057.5
VSS	139	155		42.6	3915.2
VSS	-	159		42.6	3580.8
VSS	-	168		42.6	2705.4
VDDIO	30	37		3776.0	42.6
VDDIO	63	73		5361.5	2226.0
VDDIO	79	92		5361.5	4051.2			3.3–V I/O Digital Power Pins
VDDIO	-	105		4784.7	5057.5
VDDIO	112	127		2262.5	5057.5
VDDIO	142	160		42.6	3510.7
								3.3–V Flash Core Power Pin. This pin
								should be connected to 3.3 V at all times
VDD3VFL	68	78		5361.5	2732.4			after power-up sequence requirements
								have been met. This pin is used as VDDIO
								in ROM parts and must be connected to
								3.3 V in ROM parts as well.

22 IntroductionCopyright © 2009–2010, Texas Instruments Incorporated

Submit Documentation Feedback

Product Folder Link(s): SM320F2812-HT